• Transactions of the Korean Society of Automotive Engineers
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• v.4 no.3
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• pp.112-121
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• 1996

Applications of bonded dissimilar materials such as metal/ceramics and resin/metal joints, are very increasing in various industry fields. It is required to find crack propagation direction and path applying to the fracture mechanics on the bonded joint of dissimilar meterials. In this paper, crack propagation direction and path were simulated numerically by using boundary element method. Crack propagation angle is able to easily determine based on the maximum stress concept. Fracture tests of Al/Epoxy dissimilar materials with an interface crack are carried out under various mixed mode conditions by using the specimens of bonded scarf joints. It is found that the experimental results are well coincide with the analysis results of boundary element method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.820-825
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• 1994

It is improtant to examine life or crack propagation behavior of structures because of its safety evaluation. The purpose of this study is to investigate the effect of crack-crack interaction to evaluate fatigue life and crack behavior. In this study, the behavior of the interaction of two cracks is studied by experiment. The vertical distance of two cracks is varied to make different interaction stress field. In addition, the effect of plastic zone is considered to examine crack propagation path and propagation rate.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.4
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• pp.90-96
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• 2009

The loading condition of actual construction works is complex. The shear effect of mixed-mode load component are crack propagation mechanism in step larger than the crack initial mechanism. Therefore, in this study received a mixed-mode loading on fatigue crack stress ratio on crack propagation path and speed of progress to learn whether stress affects crack propagation. ${\Delta}$ P a constant state of fatigue tests in Mode I, II give the same stress ratio, frequency 10Hz, sinusoidal waveform was used. A lower stress ratio fatigue crack propagation angle is small. This is less affected by the Mode II. Therefore, a mixed-mode fatigue crack propagation is to progress by the Mode. Stress ratio in a mixed mode crack in the path of progress and found a lot of impact.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.7
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• pp.1097-1105
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• 1997

Because of the existence of stress interaction field made by other defects and propagating cracks, the structure may be weakened. Therefore in this study, the crack behavior in the interaction field made by two different cracks is studied experimentally. In the experiment, vertical distance between two cracks and applied stress are varied to make different stress interacted field. In addition, the effect of plastic zone is used to examine crack propagation path and rate. Three types of crack propagation in the interacted field were found, and crack propagating path and rate of two cracks were significantly changed according to different applied stress as each crack propagates. And the results are attributed to the effect of the size and shape of the plastic zone.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Structural Engineering and Mechanics
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• v.8 no.5
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• pp.439-452
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• 1999

A simple numerical scheme suitable for tracing the fracture propagation path for structures idealized by means of Hillerborg's classical cohesive crack model is presented. A direct collocation, multidomain boundary element method is adopted for the required space discretization. The algorithm proposed is necessarily iterative in nature since the crack itinerary is a priori unknown. The fracture process is assumed to be governed by a path-dependent generally nonlinear softening law. The potentialities of the method are illustrated through two examples.

• Structural Engineering and Mechanics
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• v.63 no.3
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• pp.329-345
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• 2017

This paper devoted to study dynamic interaction between crack and inclusion or void by developing the eXtended Finite Element Methods (XFEM). A novel XFEM approximation is presented for these structures containing multi discontinuities (void, inclusion, and crack). The level set methods are used so that elements that include a crack segment, the boundary of a void, or the boundary of an inclusion are not required to conform to discontinuous edges. The investigation covers the effects of a single circular or elliptical void / stiff inclusion, and multi stiff inclusions on the crack propagation path under dynamic loads. Both the void and the inclusion have a significant effect on the dynamic crack propagation path. The crack initially curves towards into the void, then, the crack moves round the void and propagates away the void. If a large void lies in front of crack tip, the crack may propagate into the void. If an enough small void lies in front of crack tip, the void may have a slight or no influence on the crack propagation path. For a stiff inclusion, the crack initially propagates away the inclusion, then, after the crack moves round the inclusion, it starts to propagate along its original path. As ${\delta}$ (the ratio of the elastic modulus of the inclusion to that of the matrix) increases, a larger curvature of the crack path deflection can be observed. However, as ${\delta}$ increases from 2 to 10, the curvature has an evident increase. By comparison, the curvature has a slight increase, as ${\delta}$ increases from 10 to 1000.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.401-409
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• 2009

This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.9
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• pp.1691-1699
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• 1992

The experimental results of fatigue crack propagation under constant amplitude loading show that intra-and inter-specimen variability exist. In this paper, a stochastic model for the estimation of mean and variance of crack propagation life is presented To take into account the intra-specimen variability, the material resistance against crack propagation is treated as an 1-dimensional spatial stochastic process, i. e. random field, varying along the propagation path. For the inter-specimen variability, C in paris equation is assumed to be a random variable. Compared with experimental results reported, the present method well estimate the variation in fatigue crack propagation life. And it is confirmed that the thicker the specimen thickness is, the less the variation of propagation life is.