• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.24-25
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• 2007

Nano-sized metal patterns were successfully fabricated on flexible PET substrate using nanoimprint lithography. 70nm line and space PMMA resist pattern was formed on PET substrate without residual layer by "partial filling effect' and 20nm thin Cr metal layer was deposited by e-beam evaporation. Then, PMMA resist was selectively removed by acetone and 70nm narrow Cr pattern was formed.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.1-7
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• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.

• Journal of the Korean Magnetics Society
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• v.9 no.4
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• pp.210-216
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• 1999

The objective of this paper is to investigate corrosion behaviors of CoCrTa/CrNi thin film and post heat-treatment effect. An electron beam evaporator was used for films deposition. After evaporation, post heat-treatment was carried out under $5.0{\times}10^3$ Torr vacuum condition. Annealing temperature and time were 400 $^{\circ}C$ and 30 min, respectively. To understand the effect of annealing on corrosion behavior of CoCrTa/CrNi, potentiodynamic polarization technique and accelerated corrosion chamber test were undertaken. Corrosion potential is higher for the annealed samples (CoCrTa 400$\AA$/CrNi 1000$\AA$) than for as-deposited one. This is attributed to an enrichment of Cr in the surface layer of the thinfilm resulting in a more corrosion resistant material.

• Journal of the Korean Ceramic Society
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• v.31 no.7
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• pp.767-771
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• 1994

In a salb-preheating furnace of steel-making industry, the oxidation/degradation behavior of Cr3C2 ceramic composited dkid button reaction with scale in Fe-oxide system occurs and was thermodynamically examined. The reaction of scale with Cr3C2 skid button produces Cr3C2(s) and C(s), and Co gas is then evolved from the reaction of C(s) with Fe-scale. Cr3C2(s) from oxidation of Cr3C2(s) reacted with Fe-oxide(s) becomes high-melting chromite. The chromite acts as protection layer against further oxidation and improves resistance of the reaction of Cr3C2 skid button with Fe-scale.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.4
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• pp.555-562
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• 1990

Alloyed ohmic contact properties of Au-Zn/Au, Au-Be/Au,Au-Zn/Cr/Au, and Au-Be/Cr/Au metal system to p-InP were investigated. Optimum alloying conditions were obtained at the annealing temperature of 425\ulcorner for all the metal systems using a rapid thermal annealing system. Surface AES analysis and auger depth profiling were done for each metal system annealed at the optimum conditions. Outdiffusions of In and P from the InP substrate were found in the metal systems without Cr intermediate layer. Also, small amount of In. P and Cr were detected at the surface in the case of Au-Zn/Cr/Au system, while there were occured no outdiffusion of In, P, and Cr for Au-Be/Cr/Au system. The best surface morpholoty and specific contact resistivity of 4.5x 10**-5 \ulcornercm\ulcornerhave been obtained in this Au-Be/Cr/Au material system alloyed at 425\ulcorner for 60 second.

• Journal of the Korean Society for Heat Treatment
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• v.19 no.1
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• pp.3-9
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• 2006

The phase changes, nitride precipitation and hardness variations of 14%Cr-6.7Ni-0.65Mo-0.26Nb-0.05V-0.03C super martensitic stainless steel were investigated after nitrogen permeation heat treatment at a temperature range between $1050^{\circ}C$ and $1150^{\circ}C$. The nitrogen-permeated surface layer was transformed into austenite. The rectangular type NbN, NbCrN precipitates and fine round type precipitate were coexisted in the surface austenite layer, while the interior region that was free from nitrogen permeation kept the martensitic phase. The hardness of surface austenite showed 280 Hv, while the interior region of martensite phase represented 340 Hv. When tempering the nitrogen-permeated steel at $450^{\circ}C$, a maximum hardness of 433 Hv was appeared, probably this is attributed to the secondary hardening effect of the precipitates. The nitrogen concentration decreased gradually with increasing depth below the surface after showing a maximum of 0.3% at the outmost surface. The strong affinity between nitrogen and Cr enabled the substitutional element Cr to move from interiors to the surface when nitrogen diffuse form surface to the interior. Corrosion resistance of nitrogen permeated steel was superior to that of solution-anneaed steel in the solution of 1N $H_2SO_4$.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• Corrosion Science and Technology
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• v.2 no.4
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• pp.171-177
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• 2003

The electronic properties of the passive film formed on Fe-20Cr ferritic stainless steel in pH 8.5 buffer solution containing 0.05 M EDTA (ethylene diammine tetraacetic acid) were examined by the photocurrent measurements and Mott-Schottky analysis for the film. XPS depth profile for the film demonstrated that Cr content in the outermost layer of the passive film was higher in the solution with EDTA than that in the solution without EDTA, due to selective dissolution of Fe by EDTA. In the solution with EDTA, the passive film showed characteristics of an amorphous or highly disordered n-type semiconductor. The band gap energies of the passive film are estimated to be ~ 3.0 eV, irrespective of film formation potential from 0 to 700 $mV_SCE$ and of presence of EDTA. However, the donor density of the passive film formed in the solution with EDTA is much higher than that formed in the solution without EDTA, due to an increase in oxygen vacancy resulted from the dissolution of Fe-oxide in the outermost layer of the passive film. These results support the proposed model that the passive film formed on Fe-20Cr in pH 8.5 buffer solution mainly consists of Cr-substituted $\gamma$-$Fe_2O_3$.

• Journal of the Korean Society for Heat Treatment
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• v.18 no.3
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• pp.183-189
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• 2005

The effects of duplex-treatment of plasma carburization and CrN coating onto Ti-6Al-4V alloy on its creep properties were investigated by means of a constant stress creep tester. Applying duplex-treatment, specimens having an inner carburized layer of about $150{\mu}m$ in depth and outer CrN layer of about $7.5{\mu}m$ in thickness were prepared. The hardness of duplex-treatment surface was about 1,960 VHN. It also appeared that the duplex-treatment improved the roughness of the surface significantly; $Ra=0.045{\mu}m$ for treated alloy while $Ra=0.321{\mu}m$ for untreated alloy. The steady-state creep behaviors were investigated in a temperature range of $510{\sim}550^{\circ}C$ ($0.42{\sim}0.44T_m$) under an applied stress range of 200~275 MPa. The stress exponent, n, was derived assuming the power law creep behavior. The surface treatment showed a decrease in a value from 9.32 (untreated) to 8.79 (treated). Also the activation energy obtained from an Arrhenius plot increased from 238 to 257 kJ/mol.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.322-327
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• 2000

This paper investigates the time-dependent crack growth in X20CrMoV 12 1 steel weld joints. Crack growth test are carried out $545^{\circ}C$ on side-grooved 1/2T CT specimens under static loads. A simulated material is produced for the intercritical HAZ, where fracture normally occurs. Constitutive properties are obtained for the simulated HAZ material as well as for the base metal and weld metal. Finite element analyses of crack growth are performed on the models with and without a HAZ layer, using the experimental crack length-time history. The inclusion of HAZ layer increase the load line velocities significantly. The crack growth rates are correlated reasonably well with $C^*$. The smallest crack size for the validity of $C^*$ is found much smaller than the ASTM crack initiation size for 1T CT specimen of creep ductile materials.