• Journal of the Semiconductor & Display Technology
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• v.12 no.4
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• pp.55-59
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• 2013

Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.69-75
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• 2016

This study investigated the effect of heat treatment conditions not only on the Cr surface crack propagation behaviors but also on the Ni/Cr interfacial reaction characteristics in electroless Ni/electroplated Cr double coating layers on Cu substrate. Clear band layer of Ni-Cr solid solutions were developed at Ni/Cr interface after heat treatment at $750^{\circ}C$ for 6 h. Channeling cracks formed in Cr layer after 1 step heat treatment, that is, heat treatment after Ni/Cr plating, while little channeling cracks formed after 2 step heat treatment, that is, same heat treatments after Ni and Cr plating, respectively, due to residual stress relaxation due to crystallization of Ni layer before Cr plating.

• Journal of the Korean institute of surface engineering
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• v.40 no.3
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• pp.131-137
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• 2007

The typical MCFC (molten carbonate fuel cell) anode is made of Ni-10%Cr alloy. The work of this paper is focused concerning long life of anode because Ni-10% Cr anode is suffering from sintering and creep behavior during cell operation. Therefore, Ni-coated Alumina powder($20{\mu}m$) was developed by electroless nickel plating. Optimum condition of electroless nickel coation on $20{\mu}m$ alumina is as follows: pH 11.7, temperature $65{\sim}80^{\circ}C$, powder amount $100cm^2/l$. The deposition rate for Ni-electroless plating was as a function of temperature and activation energy was evaluated by Arrhenius Equation thereby activation energy calculated slope of experimental data as 117.6 kJ/mol, frequency factor(A) was $6.28{\times}10^{18}hr^{-1}$, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.133-140
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• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.67-71
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• 2015

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

• Journal of the Korean institute of surface engineering
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• v.15 no.3
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• pp.127-137
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• 1982

In chemical plating of nickel and chromium on steel, studies on various factors affect-ing the plating operations were carried out. The optimum bath compositions and operat-ing conditions were obtained. The structure and properties of the as deposits or deposits after heat treatment were investigated. (1) The most optimum conditions for the chemical nickel and chromium plating were; 〔Ni2+〕/〔H2PO2-〕; 0.5∼0.8, 〔Cr3+〕/〔H2PO2-〕; 0.6∼0.9 PH;5.0∼5.5, temperature; 90∼95$^{\circ}C$ (2) In the case of nickel deposition, the hardness of deposits increased with increasing phosphorous contents. Heat-treating at the temperature range 200$^{\circ}C$ to 600$^{\circ}C$, the maximum hardness of deposits was obtained at 400$^{\circ}C$ and decreased at temperature above 400$^{\circ}C$ due to growth of Ni3P. (3) Corrosion resistance of chemical nickel deposits was improved with increasing of p-hosphorous contents and heat treating temperature.

• Environmental Engineering Research
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• v.12 no.1
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• pp.16-20
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• 2007

Toxicity of metal plating wastewater was evaluated by using acute toxicity tests on Daphnia magna. To identify toxicants of metal plating wastewater, several manipulations such as solid phase extraction (SPE), ion exchange and graduated pH adjustment were used. The SPE test had no significant effect on baseline toxicity, suggesting absence of toxic non-polar organics in metal plating wastewater. However, anion exchange largely decreased the baseline toxicity by 88%, indicating the causative toxicants were inorganic anions. Considering high concentration of chromium in metal plating wastewater, it is thought the anion is Cr(VI) species. Graduated pH test showing independence of the toxicity on pH change strongly supports this assumption. However, as revealed by toxicity confirmation experiment, the initial toxicity of metal plating wastewater (24-h TU=435) was not explained only by Cr(VI) (24-h TU = 725 at $280\;mg\;L^{-1}$). Addition of nickel($29.5\;mg\;L^{-1}$) and copper ($26.5\;mg\;L^{-1}$) largely decreased the chromium toxicity up to 417 TU, indicating antagonistic interaction between heavy metals. This heavy metal interaction was successfully predicted by an equation of 24-h $TU\;=\;3.67\;{\times}\;\ln([Cu]\;+\;[Ni])\;+\;79.44$ at a fixed concentration of chromium.

• Environmental Engineering Research
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• v.23 no.3
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• pp.301-308
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• 2018

We investigated simultaneous removal of heavy metals such as Cr, Ni, and Zn by adsorption onto powdered activated carbon (PAC) and PAC modified with sodium diethyldithiocarbamate (PAC-SDDC). Modification of PAC was confirmed by Fourier transform infrared spectroscopy and Scanning electron microscopy and energy dispersive X-ray spectroscopy. Both PAC and PAC-SDDC reached adsorption equilibrium within 48 h, and the adsorption kinetics followed a pseudo-second order reaction kinetics. The removal of metals was enhanced with increasing both adsorbent dosage and followed the descending order of Cr > Ni > Zn for PAC and Cr > Zn > Ni for PAC-SDDC, respectively. Adsorption kinetics followed pseudo-second order kinetics. Adsorption kinetic results were well fitted by the Freundlich isotherm except for Cr adsorption onto PAC. The optimum pH for heavy metal adsorption onto PAC was 5, whereas that for PAC-SDDC ranged from 7 to 9, indicating that modification of PAC with SDDC significantly enhanced heavy metal adsorption, especially under neutral and alkaline pH conditions. Our results imply that SDDC modified PAC can be applied to effectively remove heavy metals especially Cr in plating wastewaters without adjusting pH from alkaline to neutral.

• Journal of Environmental Science International
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• v.29 no.11
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• pp.1055-1064
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• 2020

In this research, heavy metals and T-P removal characteristics of plated wastewater are derived using BPC(Break Point Chlorination) process. AA sedimentation pond outflow(Influence) was evaluated for the removal efficiency of heavy metal(Ni) and T-P at a reaction time of 25 minutes by NaOCl input volume(9, 11, 13 and 15 mL). In the case, the higher the NaOCl input volumes, the higher the ORP values were maintained and the higher the removal efficiency tended to be. On the other hand, T-P was judged to have a low relationship between the ORP value and the removal efficiency. In addition, the efficiency of removal heavy metals and T-P in the plated wastewater by injecting 10 mL, 15 mL, 20 mL and 25 mL NaOCl, increased as the amount of NaOCl injected increased, the amount of NaOH input for pH increased. It was found that suspended solid in effluence also increased. It was also observed that the color of the plating wastewater changed from yellowish green to green to charcoal gray to black as the amount of NaOCl injected increased. Treatment characteristics of the reaction time, the longer the reaction time with the substance to be treated after the input of NaOCl, the more the heavy metal removal efficiency tended to increase. Through XRF analysis of the sludge, the constituents in the sludge such as NaCNO, CNCl, Na₃PO₄, CrO₄, 2Na₂CrO₄ and 2NaNO₃ will be analyzed in detail, and the mechanisms of the reaction between the plated wastewater and the complex compound will be elucidated.