Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
권호 표지

Nano Crystalline Change by Heat Treatment

  • Sun, Yong-Bin (Semiconductor-Display-Mechatronics Program, GS_CEI, Kyonggi University)
  • Received : 2013.12.03
  • Accepted : 2013.12.16
  • Published : 2013.12.31
Download PDF
⟨ Previous Next ⟩

Abstract

Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.

Keywords

References

  1. Y.B. Sun, Adhesion Mechanism at Metal-Organic Interface Modified by Plasma, Materials Transactions, 44(2003), 1636-1639 https://doi.org/10.2320/matertrans.44.1636
  2. Uwe Erb and Karl T. Aust, Electrodeposited Nanocrystalline Metals, Alloys, and Composites, Nanostructured Materials, Noyes Publications, Ch.5 (2002) 179-222
  3. El-Sherik, J. Shirokoff, U. Erb, Stress measurements in nanocrystalline Ni electrodeposits, J. Allloys and Compounds, 389(2005) 140-143 https://doi.org/10.1016/j.jallcom.2004.08.010
  4. N. Wang, Z. Wang, K. Aust, U. Erb, Isokinetic analysis of nanocrystalline Nickel electrodeposits upon annealing, Acta Mater., 45(1997) 1655-1669 https://doi.org/10.1016/S1359-6454(96)00254-6