• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.615-618
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• 2005

In this work, the effects of corner transistors in SOI MOSFETs were investigated. We fabricated SOI MOSFETs with various widths and a fixed length and characterized them. The SOI thickness was $4000{\AA}$ and the buried oxide(BOX) thickness was $4000{\AA}$. The isolation of active region was simply done by silicon etching and TEOS sidewall formation. Several undesirable characteristics have been reported for LOCOS isolation in fabrication on SOI wafers so far. Although we used an STI-like process instead of LOCOS, there were still a couple of abnormal phenomena such as kinks and double humps in drain current. Above all, we investigated the location of the parasitic transistors and found that they were at the corners of the SOI in width direction by high-resolution SEM inspection. It turned out that their characteristics are strongly dependent on the channel width. We made a contact pad through which we can control the body potential and figured out the dependency of operation on the body potential. The double humps became more prominent as the body bias went more negative until the full depletion of the channel where the threshold voltage shift did not occur any more. Through these works, we could get insights on the process that can reduce the effects of corner transistors in SOI MOSFETs, and several possible solutions are suggested at the end.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.48-51
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• 1997

This paper presents the algorithm of FIC inspection in chip mounter. When device is mounted on the PCB, it is impossible to get zero defects since there are many problems which can not be predicted. Of these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). In this paper, we proposed a new algorithm based on the Radon transform which uses a projection to inspect the FIC(Flat Integrated Circuit) device and compared this method with other algorithms. We measured the position error and applied this algorithm to our image processing board which is characterized by line scan camera. We compared speed and accuracy in our board.

• Journal of the Korea institute for structural maintenance and inspection
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• v.7 no.2
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• pp.239-246
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• 2003

In the PCA Load Contour Method, the biaxial bending design coefficient of columns(${\beta}$) is based on the equivalent rectangular stress block (RSB). And coefficient of ${\beta}$ estimates the reinforcement index to be a influencing parameter on biaxial moment strength of RC columns without considering the arbitrary condition of bar arrangement. The experimental results of high strength concrete (HSC) columns subjected to combined axial load and biaxial bending moment were compared to the analysis results of RSB method. As result, the accuracy of RSB method is still acceptable for HSC columns and, as the reinforcement is placed densely in each corner of column section, the ${\beta}$ is decreased.

• Journal of the Korea institute for structural maintenance and inspection
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• v.4 no.4
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• pp.141-148
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• 2000

Recently the Carbon Fiber Sheet(CFS) is widely used for strengthening damaged RC structures. Strengthening compression members such as column can increase ductility and strength due to the confinement effect. In this experiment, the behavior of concrete cylinders confined by CFS was examined. The confinement pressure is increased linearly as axial stress is increased in low axial stress, and the confinement effect of CFS was rapidly developed after near maximum axial stress, thus axial strength and ductility was improved. As the ratio of CPS is increased, concrete cylinders failed due to local fracture of CFS. The confinement effect of circular section is more efficient than that of rectangular section. And significant improvement of axial strength, axial strain, transverse strain at failure is observed in circular section. This is because in rectangular section the local fracture of CFS near corner may be occured, thus the strain efficiency ratio must be considered for RC structures with CFS.

• Journal of the Korea institute for structural maintenance and inspection
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• v.2 no.4
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• pp.217-223
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• 1998

본 논문에서는 원형연단이 단순지지 되어 있을 때 단순과 자유의 방사연단 조건을 갖는 부채꼴형 평판의 휨진동에 대한 엄밀한 해석방법을 제시한다. Ritz방법을 이용하여 수직진동변위를 두가지 적합 함수식으로 가정하였다. 이러한 두가지의 적합 함수식은 (1) 수학적으로 완전한 대수삼각다항함수와, (2) 둔각 모서리에서의 휨모멘트 특이도를 고려하는 모서리함수로 구성되어있다. 본 연구에서는 방사연단의 둔각 모서리를 이루는 부채꼴형 각도의 범위에 따른 엄밀한 진동수 및 수직진동 변위의 전형적인 등고선을 제시하였다.

• Journal of Advanced Information Technology and Convergence
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• v.10 no.2
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• pp.153-166
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• 2020

DDI(Display Driver IC) are used to drive numerous pixels that make up display. For stable driving of DDI, it is necessary to attach a protective film to shield electromagnetic waves. When the protective film is attached, defects often occur if the film is inclined or the center point is not aligned. In order to minimize such defects, an algorithm for correcting the center point and the inclined angle using camera image information is required. This technology detects the corner coordinates of the protective film by image processing in order to correct the positional defects where the protective film is attached. Corner point coordinates are detected using an algorithm, and center point position finds and correction values are calculated using the detected coordinates. LUT (Lookup Table) is used to quickly find out whether the angle is inclined or not. These algorithms were described by Verilog HDL. The method using the existing software requires a memory to store the entire image after processing one image. Since the method proposed in this paper is a method of scanning by adding a line buffer in one scan, it is possible to scan even if only a part of the image is saved after processing one image. Compared to those written in software language, the execution time is shortened, the speed is very fast, and the error is relatively small.

• Journal of the Korea institute for structural maintenance and inspection
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• v.28 no.3
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• pp.74-82
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• 2024

In this study, feature point detection and displacement measurement performance depending on feature extraction algorithms were compared and analyzed according to environmental changes and target types in the feature point-based displacement measurement algorithm. A three-story frame structure was designed for performance evaluation, and the displacement response of the structure was digitized into FHD (1920×1080) resolution. For performance analysis, the initial measurement distance was set to 10m, and increased up to 40m with an increment of 10m. During the experiments, illuminance was fixed to 450lux or 120lux. The artificial and natural targets mounted on the structure were set as regions of interest and used for feature point detection. Various feature detection algorithms were implemented for performance comparisons. As a result of the feature point detection performance analysis, the Shi-Tomasi corner and KAZE algorithm were found that they were robust to the target type, illuminance change, and increase in measurement distance. The displacement measurement accuracy using those two algorithms was also the highest. However, when using natural targets, the displacement measurement accuracy is lower than that of artificial targets. This indicated the limitation in extracting feature points as the resolution of the natural target decreased as the measurement distance increased.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.2
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• pp.81-86
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• 2005

This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.383-386
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• 2007

In this study, the analysis was carried out for Electrical Discharge Machining (EDM) characteristics of the Cu electrodes by LIGA process. The shape of electrodes has 324 pins for the cavity of BGA(Ball Grid Array) type test socket mold. BGA test sockets are used in the inspection process of the semi-conductor I.C chip manufacturing. In the work, the machining performance for EDM of the electrodes was analyzed on dimensional accuracy and wear rate. The dimensional accuracy was measured for dimension of the pins, pitch size between the pins and the roundness of corner edge using optical measuring machine.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.6
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.