• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권9호
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• pp.488-493
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• 2004

In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining(ECDM) for glass machining. An array of 72 Cu electrodes is used to machine Borofloat33 glass. The height and diameter of a Cu electrode are 400 $\mu\textrm{m}$ and 100 $\mu\textrm{m}$ respectively. It is fabricated by ICP-RIE, Au-Au thermo-compression bonding, and copper electroplating. Borofloat33 glass is machined by the fabricated copper electrode array in 60 seconds at 55 V. The surface roughness of the machined glass is measured and the machined glass is anodically bonded with silicon.

• Corrosion Science and Technology
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• 제17권5호
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• pp.211-217
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• 2018

Natural degradation of grounding-electrode in soil environment should be monitored for several decades to predict the lifetime of the grounding electrode for efficient application and management. However, long-term studies for such electrodes have many practical limitations. The conventional accelerated corrosion test is unsuitable for such studies because simulated soil corrosion process cannot represent the actual soil environment. A preliminary experiment of accelerated corrosion test was conducted using existing test standards. The accelerated corrosion test that reflects the actual soil environment has been developed to evaluate corrosion performances of grounding-electrodes in a short period. Several test conditions with different chamber temperatures and salt spray were used to imitate actual field conditions based on ASTM B162, ASTM B117, and ISO 14993 standards. Accelerated degradation specimens of copper-bonded electrodes were made by the facile method and their corrosion performances were investigated. Their corrosion rates were calculated to $0.042{\mu}m/day$, $0.316{\mu}m/day$, and $0.11{\mu}m/day$, respectively. These results indicate that accelerated deterioration of grounding materials can be determined in a short period by using cyclic test condition with salt spray temperature of $50^{\circ}C$.

• Archives of Pharmacal Research
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• 제27권11호
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• pp.1161-1167
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• 2004

Adriblastina, a cancerostatic anthracycline antibiotic, causes considerable oxidative damage to DNA molecules. The interaction of this compound with DNA was investigated using Osteryoung square wave stripping voltammetry (OSWSV) and cyclic voltammetry (CV) at an in situ mercury film electrode. It was found that the equilibrium constant of the bonded oxidized form of the drug was 63 times bigger more important than that of the bonded reduced form. Copper forms 1 metal: 2 drug stoichiometry complex which is highly stable compared to ssDNA-drug interaction and consequently inhibited the drug biochemical damaging effects. Copper complex offered sub-nanogram determination of adriblastina in aqueous and urine media.