• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2009년도 추계학술대회 초록집
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• pp.155-155
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• 2009

The copper plating was deposited by pulse reverse current (PRC) method with additives. The all specimens were first immersted in 10% H2SO4 for 10 minutes, and then were rinsed with deionized water. The current densities of forward pulse were 400mA/$cm^2$, and those of reverse pulse were 1900mA/$cm^2$ and 100mA/$cm^2$. Results are compared for different additives for pulse plating conditions. When it added in Only CH4N2S (TU) or only C10H13NO3S (SVH), the effect of surface side growth of Cu was not different. But when it added in TU and SVH, surface side growth of Cu decreased. Polarization curves were measured from OCP to -0.7 V at a rate of 1mV/sec. Each specimen was observed under the PHENOM to see surface morphology.

• 센서학회지
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• 제15권5호
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• pp.352-356
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• 2006

In this paper, we developed enzyme electrode of a new form to improve performance of disposable glucose sensor. We could fabricate electrode of Cu/Ni/Au structure which has very low electrical resistance (0.1 $\Omega$) by sticking copper film to plastic film with laminating method and electro-plated nickle and gold on it. The enzyme electrode was completed by immobilizing enzyme on the fabricated electrode. The fabricated glucose sensor has very quick sensing time as 3 seconds, and excellent reproducibility, fabrication yield as well.

• 한국수소및신에너지학회논문집
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• 제4권2호
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• pp.23-28
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• 1993

The $(LM)Ni_{4.5}Co_{0.1}Mn_{0.2}Al_{0.2}$ hydrogen storage alloy powders were conducted 25wt% electroless copper plating in an acidic bath. For the preparation of a hydride electrodes, the copper coated alloy powder was mixed with Si-sealant(organosilicon) and compacted with $6t/cm^2$ at room temperature. The electrode characteristics were examined through electrochemical measurements in a half cell. As a sealant contents increased, the initial discharge capacity of si-sealant bounded electrode was lower and the activation rate in high current density was slower. For extended cycles, however, the electrodes with the Si-sealant were superior in a high rate discharge and useful range of temperature over the sealant-free electrode. In addition, the cycle life increased with increasing the amount of Si-sealant added. It can be suggested from the results that the Si-sealant as a binder could be applied to the preparation of the metal hydride electrode.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.284-284
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• 2015

반도체 Ball Grid Array(BGA)에 사용되던 종래의 Solder Ball은 Sn96.3 Ag3.0 Cu0.7의 용융솔더를 이용하여 제작하고 있다. 이는 SMT Reflow공정에서 BGA Ball의 퍼짐현상으로 인해 원래의 Ball Height에 영향을 미쳐 접합불량의 원인이 되고 있다. 이러한 문제를 해결하기 위해 Copper Core Ball위에 SnAgCu 삼원합금도금공정을 이용해 문제점을 해결하고자 했으며, 본 실험을 통해 구현한 CCSB를 이용해 SMT Reflow를 진행한 결과 종래의 BGA Ball보다 우수한 효과를 확인할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 추계학술대회 논문집 전기기기 및 에너지변환시스템부문
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• pp.104-106
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• 2001

In this paper, it is object of design of high efficiency slotless BLDC motor using film coil. Slotless BLDC motor is able to have high efficiency property and low cogging torque, due to magnetization of stator core have constant contribution by slotless core. But it is difficult to make coil winding of slotless BLDC motor. So we make amateur of slotless BLDC motor using film coil. Film coil is fabricated by drilling, electro-plating and etching of copper/insulator/copper plate. In this paper, after design of slotless BLDC motor for moving axial blower, it is fabricated by NdFeB permanent magnet type rotor and film coil.

• 한국표면공학회지
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• 제32권3호
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• pp.372-376
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• 1999

The deposited Cu film on the ferrite magnet was more deposited comparing with that on the plastic magnet. The Cu film became thicker on the S pole comparing with that on the N pole in the both of magnets. The thickness and texture coefficient of deposited copper film affected with direction of line of magnetic force. The difference of pole had little or no effect to the texture coefficient of deposited nickel film. The reaction rate on ferrite magnet and S pole was faster comparing with that on plastic magnet and N pole.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2009년도 추계학술대회 초록집
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• pp.168-168
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• 2009

핸드폰, 노트북과 같이 최신경량 전자재료로 만들어지는 전자제품의 수요가 급증함에 따라 반도체 배선의 폭이 점점 작아지고, 이로 인해 프린팅공정을 이용한 미세 배선기술이 활발히 개발되고 있다. 이에 본 연구는 미세배선에 높은 전기전도도를 부여하기 위하여 전기도금을 실시하였으며, 균일한 도금층을 얻기 위하여 첨가제에 따른 분극거동을 분석하고 이를 바탕으로 양극 및 음극 형상에 따른 구리의 성장 거동을 시뮬레이션을 통하여 분석하였다. 균일한 증착을 위해서는 첨가제의 역할도 중요하지만 양극과 음극의 형상에 따라서도 구리성장 거동에 영향을 미치는 것을 알 수 있었다.

• 한국표면공학회지
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• 제34권5호
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• pp.429-434
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• 2001

Ti-Cu-N nanocomposite films deposited by arc ion plating and magnetron sputter hybrid system with various copper contents. The microstructure and mechanical properties of Ti-Cu-N superhard nanocomposite films depend on the Cu concentration. In X-ray diffraction (XRD) analysis, intensity of TiN (111) and TiN (220) peak decreased and peak broadness increased with increasing the copper contents and Cu peak was not detected. The grain size of films decreased with increasing at%Cu and Transmission Electron Microscopy (TEM) analysis also showed that Ti-Cu-N film containing 1.5at%Cu was composed of very fine (<10nm) nanocrystalline grains. The maximum hardness of Ti-Cu-N (1.5at%Cu) film reached to 45GPa and friction coefficient was measured 0.3.

• 한국막학회:학술대회논문집
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• 한국막학회 1994년도 추계 총회 및 학술발표회
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• pp.8-11
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• 1994

Disposal of hazardous ions in the aqueous streams is a significant industrial waste problem.. Waste streams from electronics, electroplating, and photographic industries contain metal ions such as copper, nickel, zinc, chromium(IV), cadmium, aluminum, silver, and gold, amongst others in various aqueous solutions such as sulfates, chlorides, fluorocarbons, and cyanides. Typical plating solutions having similar compositions are listed in Table 1. Spent process streams in catalyst manufacturing facilities also contain precious metals such as Ag, Pt, and Pd. Developing an effective recovery process of these metal ions for reuse is important.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.136-136
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• 2015

2007년 일본에서 지갑전화나 지상파 디지털TV 방송기능을 탑재한 휴대전화개발에 힘을 쏟고 있을 무렵, 해외에서 컴퓨터에 가까운 스마트폰이라는 다기능단말기 개발이 진행되고 있었다. 스마트폰은 젊은이를 중심으로 인기가 높아지고 있다. 휴대전화를 시작으로 정밀전자기기에는 인쇄배선판(이하, PWB: Printed Wiring Board)이 내장되어 있다. PWB는 향후 하이브리드차나 전기자동차의 발전과 함께, 차량탑재 수요도 높아질 것이다. 본고에서는 PWB를 지탱하는 동 도금 Via Hole메움에 대하여 기술하였다.