• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.496-499
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• 2012

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

• Journal of the Korean institute of surface engineering
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• v.39 no.5
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• pp.223-228
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• 2006

The current efficiency of copper anode containing impurities in copper sulfate solution for electrorefining was studied at various current type such as direct current, variable current and periodic reverse current. The passivity behavior was investigated by galvanostatic technique. The results obtained were that current efficiency of variable current was higher than those of direct current and periodic reverse current. The increased current efficiency could be explained by the formation of slime structure with lower average resistance due to variable current. The frequency of various factors in variable current condition has a greatest effect on current efficiency. It appeared that frequency increased current efficiency when increased from 1 to 4, but further increases did not have an effect.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.13-14
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• 2008

A high rate magnetron sputtering source (HRMSS) was employed to deposit thick copper films. The HRMSS was manufactured by changing the magnet size, arrangement, and field intensity. For the preparation of thick copper films, the copper sputtering conditions using HRMSS were characterized based on the deposition parameters such as discharge characteristics, I-V characteristics of the source, and change of deposition rate. The deposition rate of copper turned out to be more than 5 times than that of conventional magnetron sputtering source. Thick copper films having thickness of more than $20{\mu}m$ were prepared by using HRMSS. The morphology and orientation of the films were investigated by scanning electron microscopy and x-ray diffraction.

• Bulletin of the Korean Chemical Society
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• v.22 no.7
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• pp.748-752
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• 2001

Alkanethiols (CH3(CH2)n-1SH) based self-assembled monolayers (SAMs) on the clean copper surfaces have been examined for n = 4, 8, and 16. Using X-ray photoelectron spectroscopy (XPS) and contact angle analysis, it is found that alkanethiolate monolayers similar to those on gold are formed on clean copper surfaces. The monolayers are stable in air up to about 140 $^{\circ}C.$ Above 160 $^{\circ}C$ the monolayers begin to desorb through the oxidation reaction of the thiolate to sulfonate, with the alkyl chains remaining intact. Following this desorption step, the copper surface has begun to oxidize to CuO at about 180 $^{\circ}C$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.38-43
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• 2019

Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• Korean Chemical Engineering Research
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• v.46 no.5
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• pp.863-867
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• 2008

Pitch based activated carbon fiber(ACF) was prepared from reformed naphtha cracking bottom oil(NCB oil) by melt spinning. The fibers obtained were stabilized, carbonized, and then steam activated. The ACF was sensitized with Pd-Sn catalytic nuclei via a single-step activation approach. This sensitized ACF was used as precursors for obtaining copper plated ACFs via electroless plating. ACFs uniformly decorated with metal particles were obtained with reduced copper plating in the reaction solution. Effects of the amount of copper on characteristics of ACF/Cu catalysts were investigated through BET surface area, X-ray diffraction, scanning emission microscopy, and ICP. The amount of copper increased with plating time, but the surface area as well as the pore volume decreased. NO conversion increased with reaction temperature. NO conversion decreased with increasing the amount of copper, which is seemed to be due to the reduction of surface area as well as the dispersion of copper.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.58-67
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• 2002

In this study copper chloride(CuCl$_2$) solution was used as raw material to produce the fine copper oxide powder which has less than 1 $\mu\textrm{m}$ average particle size and has uniform particle size distribution by spray pyrolysis process. In the present study, the effects of reaction temperature, the injection speed of solution and air, the nozzle tip size and the concentration of raw material solution on the properties of produced powder were studied. The structure of the powder became much more compact with increasing the reaction temperature regardless of copper concentration of the raw material solution. The particle size of the powder increased accordingly with increasing the reaction temperature in case of 30 g/$\ell$ copper concentration of the solution. The particle size of the powder increased accordingly, and the surface structure of the powder became more porous with increasing the copper concentration of the raw material solution. When copper concentration in raw material solution was more than 100 g/$\ell$, all produced powder was CuCl regardless of reaction temperatures. When copper concentration in solution was below 30 g/$\ell$ and reaction temperature was higher than 90$0^{\circ}C$, CuO was the main phase. The surface of the powder tended to become porous with increasing the injection speed of solution. Particle size was increased and the surface of the powder showed severely disrupted state with increasing the nozzle tip size. The particle size was decreased and the particle size distribution was more uniform with increasing the air pressure through the nozzle.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.747-754
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• 2008

Recently, the requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. Therefore, it is important to examine the surface state of substrate depending on the processing parameter during the anodic oxidation. This study investigated the effect of the various electrolyte concentrations on anodizing of titanium anode prior to copper electrodeposition. Different surface morphology of anodized titanium was obtained at different electrolytic concentration 0.5 M to 3.0 M. In addition, the effect that the surfaces and the electrical characteristics on the electrodeposited copper layer was observed. In this study, surface anodized in the group containing 0.5M $H_2SO_4$ shows more uniform copper crystals with low surface roughness. the surface roughness and sheet resistance for 0.5M $H_2SO_4$ group were $1.353{\mu}m$ and $0.104m{\Omega}/sq$, respectively.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.222-230
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• 2022

The electroplating for copper foils has many advantages in economics. During the electroplating, the selection of appropriate additives is needed to manufacture copper foils with various properties. Therefore, it is investigated the initial plating voltage and the properties of copper foil electroplated in the electrolyte with benzothiazole as additives. The addition of benzothiazole without any additives decreased effectively the initial plating voltage. However, the initial voltage increased when the additives was used in combination with an inhibitor and a leveler along with benzothiazole. Moreover, the voltage tends to increase with the concentration of benzothiazole except for 40 ppm group. The mixed additives could change not only the initial voltage but also the morphology of crystals on the surface. When benzothiazole is added at 20 ppm or less, it was observed that the clustered crystals existed on the surface, which result in ununiform surface and high roughness value. In addition, the grain size increased with the amount of benzothiazole, but the resistivity decreased. However, when the leveler was added in 20 ppm, the grain size was decreased with the amount of benzothiazole. The size of the crystals could be influenced by the mixing ratio of additives. Therefore, it is necessary to study on the effect of concentration ratio of additives in the future.