• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.54-55
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• 2000

• Journal of the Korean Wood Science and Technology
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• v.38 no.5
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• pp.450-456
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• 2010

This research was performed to develop the simple techniques to predict the copper concentration in alkaline copper quat (ACQ), copper azole (CUAZ), and bis-(N-cyclohexyl-diazeniumdioxy)-copper (CB-HDO) solutions. Two simple methods measuring the color due to copper compounds were evaluated by using a spectrophotometer. One is to directly measure the color of the preservative solutions. The other is to measure the color developed on the surface of a treated sample with the preservatives. The $L^*$ of the measured color values appeared to be the most sensitive to the change of copper concentration. The $a^*$ values of the preservative solutions tended to be decreased at above a certain concentration condition, and the $b^*$ values showed no trend with the concentration of copper compounds in preservative solutions. The surface color of the treated samples were changed from bluish to greenish as time passed. Both methods showed the high $R^2$ values of the regression models determined by using the lightness, which suggested that the methods might be applicable in preservative-treatment mills for the easy and fast prediction of the copper concentration.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.5
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• pp.215-221
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• 2019

Ceramic tiles, which are widely used as interior and exterior materials for construction, have recently been required to have pollution prevention function. In order to remove contaminants, many researches of ceramic tiles with hydrophilic surface property through $TiO_2$ coating and hydrophobic surface property by improving the flow of water droplets have been proceeded. Expecially, it is very important to develop a surface glaze having hydrophobicity through a sintering process above $1000^{\circ}C$ without an additional coating process and the degradation of mechanical properties. In this study, surface glaze with copper powder was applied to manufacture of ceramic tile. Contact angle of ceramic tile according to thickness of surface glaze layer was investigated after the conventional sintering process. The contact angle of the ceramic tile surface without the copper powder was shown to be $25.3^{\circ}$, which is close to hydrophilic surface. However, the contact angle was increased up to $109.8^{\circ}$ when the thickness of surface glaze with the copper powder was $150{\mu}m$. The excellent hydrophobic property of the surface glaze with copper powder was resulted from the cellular structure of copper particles on the glaze surface. In addition, the mechanical properties of the developed hydrophobic ceramic tiles such as bending strength, chemical resistance, abrasion resistance, and frost resistance were well maintained and meet the criteria of 'KS L 1001 Ceramic tile'.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.2
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• pp.93-100
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• 2021

Copper sheets has been used widely in electric and electron industry fields because they have good electric and heat conduction property of the material. And, in order to bond copper material, a kind of soldering process is generally used. But, because it is difficult to bond by soldering between overlapped thin copper sheets, so, another kind of brazing bonding process can be used in that case. But, because the brazing process needs wide bonding area, it needs heat treatment process in electric furnace. Generally, for spot welding of sheets, a conventional electric Resistance Spot Welding process(RSW) has been used, it has welding characteristics using contact resistance heating induced by electric current flow between sheets. But, because copper sheets has the low electric resistance, it is difficult to weld by electric resistance spot welding. So, in this study, an electric Resistance heated Surface Friction Spot Welding process(RSFSW) is suggested and is testified for the spot welding ability of thin copper sheets. It is known from the experimental results and simulation that the suggested spot welding process will be able to improve the spot welding ability of copper sheets by the combined three kinds of heating generated by surface friction by rotating pin, and conducted from heated steel electrode, and generated by contact resistance of electricity.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.125-125
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• 2005

• Journal of the Korean institute of surface engineering
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• v.29 no.4
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• pp.238-252
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• 1996

In order to study the effect of interface oxides on the adhesion strength of the copper/epoxy system, copper foils were immersed in black oxide or brown oxide forming solutions before lamination with epoxy prepregs, and variation of peel strength with the treatment time were investigated. Results showed that peel strength decreased rapidly up to 1 minute of treatment lime and remained constant in the case of the black oxide treated specimens, which was accompanied by the thickening of $Cu_2O$ at the Copper/Epoxy interface during the period. In contrast, peel strength increased rapidly up to 1 minute of treatment time and remained constant in the case of the brown oxide treated specimens, which could be ascribed to the thickening of CuO. Subsequent heat treatments of the Copper/Epoxy laminations at $120^{\circ}C$ in air showed that peel strength remained constant in the case of the black oxide treated specimens but decreased gradually in the case of the brown oxide treated specimens. Following XPS analyses revealed that the latter was possibly caused by the coalescence of CuO at the Copper/Epoxy interface into $Cu_2O$.

• Tribology and Lubricants
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• v.12 no.2
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• pp.32-40
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• 1996

The tribological role of copper alloy fine particles in an additive is not well known compared to solid lubricants such as $MoS_{2}$ and PTFE. In this experimental investigation, a series of friction and wear test was undertaken to gain a better understanding of an additive containing copper alloy fine particles and to identify the effectiveness of copper alloy particles in improving tribological performance of the lubricant. Friction and wear of specimens under lubricated contact condition were studied and the worn surfaces were characterized by AES (Auger Electron Spectroscopy), SEM (Scanning Electron Microscopy) and optical microscopy. It was revealed that a copper-contained layer was formed and this layer resulted in considerable reduction in both friction and wear due to its lubricity and anti-wear property. The analysis of worn surface revealed that copper of the fine alloy particles in the additive helps healing the worn surface by plating and filling wear pits.

• Journal of the Korean institute of surface engineering
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• v.37 no.1
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• pp.22-27
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• 2004

Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

• Korea-Australia Rheology Journal
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• v.14 no.2
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• pp.63-70
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• 2002

Chemical mechanical planarization (CMP) is the polishing process enabled by both chemical and mechanical actions. CMP is used in the fabrication process of the integrated circuits to achieve adequate planarity necessary for stringent photolithography depth of focus requirements. And recently copper is preferred in the metallization process because of its low resistivity. We have studied the effects of chemical reaction on the polishing rate and surface planarity in copper CMP by means of numerical simulation solving Navier-Stokes equation and copper diffusion equation. We have performed pore-scale simulation and integrated the results over all the pores underneath the wafer surface to calculate the macroscopic material removal rate. The mechanical abrasion effect was not included in our study and we concentrated our focus on the transport phenomena occurring in a single pore. We have observed the effects of several parameters such as concentration of chemical additives, relative velocity of the wafer, slurry film thickness or ash)tract ratio of the pore on the copper removal rate and the surface planarity. We observed that when the chemical reaction was rate-limiting step, the results of simulation matched well with the experimental data.