• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.61-66
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• 2018

The objective of this research study is to investigate the optimal process parameters of electrical discharge machining (EDM) on SCM440 steel with copper as a tool electrode. The effect of various process parameters on machining performance is investigated in this study. Modern ED machinery is capable of machining geometrically complex or hard material components, that are precise and difficult-to-machine such as heat treated tool steels, composites, super alloys, ceramics, etc. This paper reports the results of an experimental investigation by Taguchi method carried out to study the effects of machining parameters on material surface roughness in electric discharge machining of SCM440 steel. To predict the optimal condition, the experiments are conducted by using Taguchi's L27 orthogonal array. The work material was ED machined with copper electrodes by varying the pulsed current, pulse on-time, voltage, servo speed and spark speed. Investigations indicate that the surface roughness is strongly depend on pulsed current.

• Journal of Surface Science and Engineering
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• v.57 no.3
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• pp.125-139
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• 2024

As the limits of semiconductor integration are approached, the challenges in semiconductor processes have intensified. And, for the production of semiconductors with dimensions under a few nanometers and to resolve the issues related to nanoscale device fabrication, research on atomic layer etching (ALE) technology has been conducted. The investigation related to ALE encompasses not only silicon and dielectric materials but also metallic materials. Particularly, there is an increasing need for ALE in next-generation metal materials that could replace copper in interconnect materials. This brief review will summarize the concept and methods of ALE and describe recent studies on potential next-generation metal replacements for copper, along with their ALE processes.

• Nuclear Engineering and Technology
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• v.52 no.9
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• pp.1939-1944
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• 2020

Pool boiling heat transfer of a copper microporous coating was experimentally studied in borated water with a concentration of boric acid from 0.0 to 5.0 vol percent (vol%) to determine the effect of boric acid on boiling heat transfer in water. A high-temperature, thermally conductive microporous coating (HTCMC) was created by sintering copper powder with an average particle size of 67 ㎛ onto a 1 cm × 1 cm plain copper surface with a coating thickness of ~300 ㎛ within a furnace in a vacuum environment. The tests showed that the nucleate boiling heat transfer coefficient (NBHT) of HTCMC became slightly less enhanced as the concentration of boric acid increased but the NBHT coefficient values were still significantly higher than those of the plain surface. The critical heat flux (CHF) values from 0 to 1.0 vol% were maintained at ~2,000 kW/㎡, and then, they gradually decreased down to ~1,700 kW/㎡ as the concentration increased further to 5.0 vol%. It is believed that the micro-scale pores of the HTCMC were partially blocked by the high boric acid concentration during the nucleate boiling such that the small bubbles were not effectively created using the HTCMC reentrant cavities as the boric acid concentration increased.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.9-15
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• 2008

Mokumegane is one of the sophisticated metal craft techniques enabling wood grain surface effect. To embody the mokumegane, an ingot of well-bonded stacked metal plates has been required. Traditionally prepared mokumegane ingots were bonded using charcoal which enables reduction atmosphere, but sometimes end up with collapse of bonding interface due to the lack of reliable process control. We proposed a systematic vacuum direct bonding process for ingots. First, we confirmed copper//copper homogeneous plate bonding at $900^{\circ}C$ by applying uniaxial press of 2.5kg. We observed 80min required to obtain 90%-bonding ratio and the diffusion coefficient would be enhanced up to 100 times due to surface effect. Second, by considering enhanced diffusion behavior, we also obtained optimum bonding condition in copper/silver heterogeneous plates that ensures 90%-bonding ratio at $700^{\circ}C$ for 10min with apply uniaxial press. A 7-layered copper/silver ingot is prepared successfully, and eventually the prototype mokumegane cases for mobile phone were fabricated with these ingot.

• Journal of Microbiology and Biotechnology
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• v.21 no.2
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• pp.147-153
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• 2011

Bacillus species have been involved in metal association as biosorbents, but there is not a clear understanding of this chelating property. In order to evaluate this metal chelating capacity, cultures and spores from Grampositive bacteria of species either able or unable to produce surface layer proteins (S-layers) were analyzed for their capacity of copper biosorption. Only those endowed of S-layers, like Bacillus sphaericus and B. thuringiensis, showed a significant biosorption capacity. This capacity (nearly 50%) was retained after heating of cultures, thus supporting that structural elements of the envelopes are responsible for such activity. Purified S-layers from two Bacillus sphaericus strains had the ability to biosorb copper. Copper biosorption parameters were determined for strain B. sphaericus 2362, and after analyses by means of the Langmuir model, the affinity and capacity were shown to be comparable to other bacterial biosorbents. A competitive effect of $Ca^{2+}$ and $Zn^{2+}$, but not of $Cd^{2+}$, was also observed, thus indicating that other cations may be biosorbed by this protein. Spores that have been shown to be proficient for copper biosorption were further analyzed for the presence of S-layer content. The retention of S-layers by these spores was clearly observed, and after extensive treatment to eliminate the S-layers, the biosorption capacity of these spores was significantly reduced. For the first time, a direct correlation between S-layer protein content and metal biosorption capacity is shown. This capacity is linked to the retention of S-layer proteins attached to Bacillus spores and cells.

• Bulletin of the Korean Chemical Society
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• v.34 no.11
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• pp.3227-3232
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• 2013

A novel Cu-Co-O composite nanocatalyst was designed and prepared for the ozonation of phenol. A synergistic effect of copper and cobalt was observed over the Cu-Co-O composite nanocatalyst, which showed higher activity than either copper or cobalt oxide alone. In addition, the Cu-Co-O composite revealed good activity in a wide initial pH range (4.11-8.05) of water. The fine dispersion of cobalt on the surface of copper oxide boosted the interaction between catalyst and ozone, and the surface Lewis acid sites on the Cu-Co-O composite were determined as the active sites. The Raman spectroscopy also proved that the Cu-Co-O composite was quite sensitive to the ozone. The trivalent cobalt in the Cu-Co-O composite was proposed as the valid state.

• Corrosion Science and Technology
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• v.11 no.6
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• pp.263-269
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• 2012

Copper alloys are commonly applied to ship's propellers, pumps and valves which are serviced in seawater due to their good castability and corrosion resistance. In the environment of high flow velocity, however, erosion damage predominates over corrosion damage. In particular, the cavitation in seawater environment accelerates surface damage to copper alloys, resulting in degradation of products and economic losses and also threatening safety. The surface was coated with WC-27NiCr by high velocity oxygen fuel(HVOF) spraying technique to attain durability and cavitation resistance of copper alloys under high velocity/pressure flow. The cavitation test was performed for the WC-27NiCr coating deposited by HVOF in seawater at the amplitude of $30{\mu}m$ with seawater temperature. The cavitation at $15^{\circ}C$ caused exfoliation of the coating layer in 17.5 hours while that of $25^{\circ}C$ caused the exfoliation in 12.5 hours. When the temperature of seawater was elevated to $25^{\circ}C$ from $15^{\circ}C$, more damage was induced by over 160%. Although WC-27NiCr has good durability, corrosion resistance and eletrochemical stability, the cavitation damage rate of the coating layer could remarkably increase at the elevated temperatures under cavitation environments.

• Journal of the Korean Electrochemical Society
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• v.27 no.1
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• pp.8-14
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• 2024

Austenitic stainless steel 316L has been used a lot of applications because of its high corrosion resistance and formability. In addition, copper brazing is employed to create complex shape of 316L stainless steel for various engineering parts. In such system, copper-based filler metals make galvanic cell at metal/filler metal interface, and it accelerates corrosion of stainless steel. Furthermore, Cu-rich region formed by diffused copper in austenitic stainless steel can promote a pitting corrosion. In this study, we used an ammonia (NH₃) gas to nitride the 316L stainless steel for improving the corrosion resistance. The thickness of the nitride (nitrogen high) layer increased with the treatment temperature, and the surface hardness also increased. The potentiodynamic polarization test showed the improvement of corrosion resistance of 316L stainless steel by enhancing the passivation on nitride layer. However, in case of high temperature nitriding, a chromium nitride was formed and its fraction increased, so that the corrosion resistance was decreased compared to the intact 316L stainless steel.

• Economic and Environmental Geology
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• v.19 no.spc
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• pp.103-112
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• 1986

The geology of the mine consists of Cretaceous lower andesitic breccia member, tuffaceous black shale, upper tuffaceous sandstone member and andesitic dike. Ore bodies are two parallel veins of breccia originated from hydrothermal activity of later acidic igneous intrusion. First two periods of mineralization, gold and silver, and copper, and later copper enrichment was identified. The first two might have been occurred during boiling of hydrothermal solution that formed breccia and copper enrichment was accomplished by enhancement of $CO_2$ fugacity from the organic material contained in the black shale. With all the geologic and mineralogic data and inferences attained from other investigators it was estimated that the optimum depth of the ore mineralization was between 500m and 300m below the surface of Kyong-Sang series.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.11a
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• pp.55-62
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• 2001

An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.