• International Journal of Railway
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• v.3 no.1
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• pp.19-27
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• 2010

In the present study, the electrical sliding wear and corrosion resistance of pure copper (Cu) and six age-hardened copper alloys (CuCr, CuZr, CuCrZr, CuNiSiCr, CuBe and CuBeNi) were investigated by a pin-on-disc tribometer and electrochemical measurement. Various copper-based alloys in the form of cylindrical pin were forced to slide against a counterface stainless steel disc in air under unlubricated condition at a sliding velocity of 31 km/h under normal load up to 20 N with and without electric current. The worn surface of and wear debris from the specimens were studied by scanning electron microscopy. Both mechanical wear and electrical arc erosion were the wear mechanisms for the alloys worn at 50 A. Owing to its good electrical conductivity, high wear and corrosion resistance, CuCrZr is a promising candidate as the overhead catenary material for electric traction systems.

• Journal of Korean Society for Atmospheric Environment
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• v.23 no.1
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• pp.64-73
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• 2007

The catalytic activity of transition metals (Cu, Co, Mn, Fe and Ni) supported on ${\gamma}-Al_2O_3$ for the oxidation of toluene was investigated in the microreactor of fixed-bed type. The catalytic activity of transition metals for the oxidation of toluene turned out to be increasing in the order of Ni$Cu/{\gamma}-Al_2O_3$ catalysts for the oxidation of toluene increased with the increasing loadings of copper, reached the maximum activity at 5% loadings of copper, and decreased with higher loadings of copper in the catalysts. The activity of $Cu/{\gamma}-Al_2O_3$ catalysts for the oxidation of toluene decreased with the increasing calcination temperatures. This might result from the decreasing surface area of catalysts due to the sintering of copper oxide as well as ${\gamma}-Al_2O_3$ supports. The 5wt% $Cu/{\gamma}-Al_2O_3$ catalysts calcined at $400^{\circ}C$ for 4 hrs in the air showed the highest activity for the oxidation of toluene. Mutual inhibition was observed for the binary mixture of toluene and xylene. The activity of the easy-to-oxidize toluene was greatly decreased while the difficult-to-oxidize xylene was slightly decreased in the binary mixture of toluene and xylene. It might suggest that the inhibition of toluene and xylene in the binary mixture resulted from the competitive adsorption for the adsorbed oxygen on the catalytic surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• The Korean Journal of Ecology
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• v.23 no.1
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• pp.59-64
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• 2000

Heavy metal concentrations in surface sediments, seawater and oysters (Crassostrea gigas) were determined to assess heavy metal contamination in the Jinhae Bay. The ranges of cadmium, cobalt, copper, nickel, lead and zinc concentration in surface sediments were 0.1∼2.4, 12.6∼14.4, 25.3∼ 92.3, 32.4∼ 93.5, 24. 1∼81.2, 124∼477 ㎍/g, respectively. The concentrations of cadmium, copper, lead and zinc which were influenced by industrial activity were the highest in the inside of Masan Bay. Dissolved concentrations of cadmium, cobalt, copper, nickel, lead and zinc in seawater were <0.010∼0.043, 0.008∼0.120, 0.31∼0.90, 0.25∼3.10, 0.010∼0.142, 0.27∼9.04 ㎍/L, respectively. The concentrations of cadmium, cobalt, copper, nickel, lead and zinc in seawater were also the highest inside of Masan Bay, suggesting that Masan Bay is the major source of heavy metal input to the Jinhae Bay. Bioconcentration factors (BCF) of zinc, copper, cadmium, lead, cobalt and nickel in C. gigas were 647373, 280861, 145069, 44559, 13524, 2745, respectively, showing C gigas is a stronger accumulator than other bivalves.

• Journal of Surface Science and Engineering
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• v.38 no.4
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• pp.163-166
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• 2005

Carbon nanotube-copper composite structures were fabricated using composite plating method and their field emission characteristics were investigated. Multi-walled carbon nanotubes (MWNTs) synthesized by chemical vapor deposition were used in the present study. It was revealed that turn-on field was about $3.0\;V/{\mu}m$ with the current density of $0.1\;{\mu}A/cm^2.$ We observed relatively uniform emission characteristics as well as stable emission current Carbon nanotube-copper composite plating method is efficient and it has no intrinsic limit on the deposition area. Moreover, it gives strong adhesion between emitters and an electrode. Therefore, we recommend that carbon nanotube-copper composite plating method can be applied to fabricate electron field emitters for large area FEDs and large area vacuum lighting sources.

• Korean Journal of Materials Research
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• v.23 no.7
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• pp.392-398
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• 2013

A two-pass differential speed rolling(DSR) was applied to a deoxidized low-phosphorous copper alloy sheet in order to form a homogeneous microstructure. Copper alloy with a thickness of 3 mm was rolled to 75 % reduction by two-pass rolling at $150^{\circ}C$ without lubrication at a differential speed ratio of 2.0:1. In order to introduce uniform shear strain into the copper alloy sheet, the second rolling was performed after turning the sample by $180^{\circ}$ on the transverse direction axis. Conventional rolling(CR), in which the rotating speeds of the upper roll and lower roll are identical to each other, was also performed by two-pass rolling under a total rolling reduction of 75 %, for comparison. The shear strain introduced by the conventional rolling showed positive values at positions of the upper roll side and negative values at positions of the lower roll side. However, samples processed by the DSR showed zero or positive values at all positions. {100}//ND texture was primarily developed near the surface and center of thickness for the CR, while {110}//ND texture was primarily developed for the DSR. The difference in misorientation distribution of grain boundary between the upper roll side surface and center regions was very small in the CR, while it was large in the DSR. The grain size was smallest in the upper roll side region for both the CR and the DSR. The hardness showed homogeneous distribution in the thickness direction in both CR and DSR. The average hardness was larger in CR than in DSR.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.523-524
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• 2007

This paper discusses the planarization process of thick copper film structure used for power supply device. Chemical mechanical polishing(CMP) has been used to remove a metal film and obtain a surface planarization which is essential for the semiconductor devices. For the thick metal removal, however, the long process time and other problems such as dishing, delamination and metal layer peeling are being issued, Compared to the traditional CMP process, Electro-chemical mechanical planarization(ECMP) is suggested to solve these problems. The two-step process composed of the ECMP and the conventional CMP is used for this experiment. The first step is the removal of several tens ${\mu}m$ of bulk copper on patterned wafer with ECMP process. The second step is the removal of residual copper layer aimed at a surface planarization. For more objective comparison, the traditional CMP was also performed. As an experimental result, total process time and process defects are extremely reduced by the two-step process.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.183-186
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• 1994

• The Magazine of the IEIE
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• v.28 no.4
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• pp.101-102
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• 2001