• 한국전기화학회:학술대회논문집
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• 2005.07a
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• pp.383-390
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• 2005

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

• Korean Journal of Materials Research
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• v.20 no.2
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• pp.82-89
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• 2010

Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at $70^{\circ}C$ with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

• Journal of Environmental Science International
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• v.11 no.4
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• pp.319-325
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• 2002

This experiment was carried out to investigate the effects of heavy metals (copper, cadmium, lead and chrome) on the growth of plant and seed germination of Arabidopsis thaliana treated with various concentrations of heavy metals. Cadmium and chrome among the 4 heavy metals had no effect on the growth of stem even in the concentration fifty times higher than the official standard concentration of pollutant exhaust notified by the Ministry of Environment. The official standard concentration of cadmium, however, stimulated the growth of stem in general, increasing leaf size and surface area, although it had no effect on the length of stem. But the growth of stem was decreased about 18% in the official standard concentration of pollutant exhaust of lead and copper. There was no growth of root in the concentration of lead and copper ten times higher than the official standard concentration. Cadmium and chrome had no effect on the seed germination, but lead and copper decreased the rate of seed germination. Seeds were not germinated in the concentration of copper ten times higher than the official standard concentration and in the concentration of lead fifty times higher than the official standard concentration. From this research three peculiar results were obtained. Chrome in the soil did not have much effect on the plant growth and seed germination of Arabidopsis thaliana. Cadmium stimulated the stem growth in an optimum concentration. But lead and copper reduced the plant growth and seed germination even in a small concentration, especially copper had the worse effect.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.34-46
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• 2004

Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.

• Corrosion Science and Technology
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• v.22 no.3
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• pp.137-152
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• 2023

Polarization behavior and corrosion inhibition of copper in acidic chloride solutions containing benzotriazole were studied. Pourbaix diagrams constructed for copper in NaCl solutions with different BTAH concentrations were used to understand the polarization behavior. Open circuit potential (OCP) depended not only on chloride concentration, but also on whether a CuBTA layer was formed on the copper surface. Only when the (pH, OCP) was located well in the CuBTA region of the Pourbaix diagram, a stable corrosion inhibiting CuBTA layer was formed, which was confirmed by X-ray Photoelectron Spectroscopy (XPS) and a long-term corrosion test. The OCP for the CuBTA layer decreased logarithmically with increasing [Cl^-] activity in the solution. A minimum BTAH concentration required to form a CuBTA layer for a given NaCl concentration and pH were determined from the Pourbaix diagram. It was found that 320 ppm BTAH solution could be used to form a corrosion-inhibiting CuBTA layer inside the corrosion pit in the sprinkler copper tube, successfully reducing water leakage rate of copper tubes. These experimental results could be used to estimate water chemistry inside a corrosion pit.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.22 no.2
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• pp.105-115
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• 2024

In this study, we employed a small-scale experiment to demonstrate the introduction of a thin copper heat dissipation plate into a bentonite buffer layer of an engineered barrier system. This experiment designed for spent nuclear fuel disposal can effectively reduce the maximum temperature of the bentonite buffer layer, and ultimately, make it possible to reduce the area of the disposal site. For the experiment, a small-scale engineered barrier system with a copper heat dissipation plate was designed and manufactured. the thickness of the cylindrical buffer was about 2 cm, which was about 1/20 of KAERI Repository System (KRS). At a power supply of 250 W, the maximum buffer temperature reduced to a mere 1.8℃ when the thin copper plate was introduced. However, the maximum surface temperature reduced to a remarkable 9.1℃, when a U-collar copper plate was introduced, which had a good contact with the other barrier layers. Consequently, we conclude that the introduction of the thin copper plate into the engineered barrier system for spent nuclear fuel disposal can effectively reduce the maximum buffer temperature in high-level radioactive waste disposal repositories.

• Polymer(Korea)
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• v.33 no.6
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• pp.525-529
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• 2009

In order to manufacture 2-layer flexible copper clad laminate (FCCL) s having the excellent performance high adhesion properties between copper foil and polyimide film are required. Silane coupling agents with specific functional groups as an adhesion promoter are generally used to enhance the adhesion. In our study, we synthesized a novel silane coupling agent for increasing the adhesive property between copper layer and polyimide layer. The surface morphology of rolled copper foil, as a function of the concentrations of the coated silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by the surface morphology and we confirmed that the novel silane coupling agent affects adhesive properties in FCCL with two types of poly (amic acid)s.

• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1160-1169
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• 1999

In this study, the silane primers were introduced to improve the interface adhesion between copper and epoxy. Especially, the polymer types obtained by solution and emulsifier-free emulsion polymerization of vinyltriethoxysilane and the low molecular weight types of 3-aminopropyltriethoxysilane(3-APTES) and 3-glycidoxypropyltrimethoxysilane(3-GPTMS) were used to improve the adhesion strength between epoxy and copper. Also, the surface of copper was treated by 1,1,1-trichloroethane. According to the results, the interfacial adhesion strength of copper-epoxy increased about 2~5 times with the introduction of silane primer. Also, the optimum treatment time of copper surface was about 10 minutes. Additionally, the adhesion strength as a function of concentration of low molecular weight silane was maximum at about 0.5 vol.% for 3-APTES and about 0.2 vol% for 3-GPTMS.

• Journal of Surface Science and Engineering
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• v.16 no.4
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• pp.199-214
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• 1983

Up to this date, numerous methods of analysis of electroplating solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelope countries, technicians of electoplating shops are most high school gradutes or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equiIJment. Therefore, in this paper the simplest, besides accurate method is investigated after comparing nu.merous methods published. Among the methods of 'copper determinations from acid and alkaline copper plating baths, EDT A titration method are chosen, due to these methods are the simplest and fastest for the evaluation of metal content, without requiring any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of .indicators androther metal's coexsistence as well as solution comIJonent, many difficulties were encountered from cyanide' copper, on the contrary of acid copper bath. PAN, PV, and MX indicators were tried, but it is found that MX is the best. In cyanide solution, due to cyanide is the masking reagent, elimination of this component is essential, and finally found that elimination eN- by precipitation with AgN03 solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method from time to time, before chelate titration by means of AgN03 precipitation. Always some constant deviatioJ;ls will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• Corrosion Science and Technology
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• v.23 no.4
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• pp.315-323
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• 2024

This work examined pitting corrosion failure of a copper heat-return pipe used in a district heating system. The copper pipe was corroded with a 48% reduction in thickness due to localized corrosion on the inner surface exposed to heating water of 20 ~ 40 ℃. Fe and Si elements as corrosion products were found around pits. Cl element was also observed, which accelerated oxidation of copper inside pits. Cu₂O deposits on the pit's bottom surface decreased the pH inside the pit. X-ray diffraction analysis revealed hematite, cuprite, malachite and brochantite as corrosion products. Chemical analysis demonstrated that Fe and Si elements did not exist in the copper, supply water, or heating water, indicating that Fe and Si species might have entered into the pipe from the exterior. These results indicated that pits were initiated due to ion concentration gradient near Fe and Si species. Moreover, the interior of pits had lower pH due to Cl^- concentration and Cu₂O reactions, which accelerated the pit's growth and led to formation of pinholes. Additionally, we confirmed that the type of pitting corrosion was a complex combination of types I and II based on the HCO₃^-/SO₄^2- ratio, pH, temperature, and corrosion products.