• Journal of Surface Science and Engineering
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• v.34 no.5
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• pp.429-434
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• 2001

Ti-Cu-N nanocomposite films deposited by arc ion plating and magnetron sputter hybrid system with various copper contents. The microstructure and mechanical properties of Ti-Cu-N superhard nanocomposite films depend on the Cu concentration. In X-ray diffraction (XRD) analysis, intensity of TiN (111) and TiN (220) peak decreased and peak broadness increased with increasing the copper contents and Cu peak was not detected. The grain size of films decreased with increasing at%Cu and Transmission Electron Microscopy (TEM) analysis also showed that Ti-Cu-N film containing 1.5at%Cu was composed of very fine (<10nm) nanocrystalline grains. The maximum hardness of Ti-Cu-N (1.5at%Cu) film reached to 45GPa and friction coefficient was measured 0.3.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.2
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• pp.619-626
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• 2020

The development of new antifreeze mixtures containing non-amine-type corrosion inhibitors, which considers environmental protection, has become a major issue. In this study, four non-amine-type corrosion inhibitors were synthesized and used to produce five kinds of new antifreeze for automobiles to evaluate the rate of copper corrosion. The effects were evaluated by the weight change, surface observation, roughness measurement, and measurement of copper elution in the solution. The amount of copper eluted measured by ICP from Sample 4 was small, and the elution rate was prolonged. Sample 4 showed the best anti-corrosion performance owing to a corrosion suppression effect by passivating copper because the metal surface was smooth after the test, and the corrosion product layer was formed evenly on the surface as small local corrosion was observed. The major corrosion inhibitor added to Sample 4 was 1-aminomethyl(N',N'-di(2-hydroxyethyl)benzotrazole, which contained a certain amount in Sample 5 to show relatively high local corrosion but passivation in progress. Therefore, among the four corrosion inhibitors, 1-aminomethyl(N',N'-di(2-hydroxyethyl)benzotrazole had the highest corrosion inhibitory effect. This corrosion inhibitor prevents corrosion by promoting the passivation of copper on the antifreeze.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.29-33
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• 2011

The current density in copper electroplating is directly related with the productivity and then to increase the productivity, the increase in current density is required. To obtain the high mass flow rate, rotating disk electrode(RDE) was employed. High rotational speed in RDE can increase the mass flow rate and then high speed electroplating was possible using RDE to control mass flow. Two types of cathode were used. One is RDE and another is rotating cylindrical electrode(RCE). A constant-current, constant-voltage and linear sweep voltammetry were applied to investigate current and voltage relationship. The maximum current density without evolution of hydrogen gas was increased with rotational speed. Over 400 rpm, maximum current density was higher than 1000 A/$m^2$. The diffusion coefficients of copper calculated from the slope of the plots are $5.5{\times}10^6\;cm^2\;s^{-1}$ at $25^{\circ}C$ and $10.5{\times}10^6\;cm^2\;s^{-1}$ at $62^{\circ}C$. The stable voltage without evolution of hydrogen gas was -0.05 V(vs Ag/AgCl). Additives were added to prevent dendritic growth on cathode deposits. The surface roughness was analyzed with UV-Vis Spectrophotometer. The reflectance of the copper surface over 600 nm was measured and was related with the surface roughness. As the surface roughness improved, the reflectance was also increased.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.13-15
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• 2006

The effects of plasma treatment on the surfaces of the FR-4 (Flame Resistant-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the underfills/FR-4 substrate and underfills/copper substrate are also studied. As experimental results, the plasma treatments of FR-4 and copper substrate surfaces yield several oxygen complexes in hydrophilic surfaces, which can play an important role in increasing the surface polarity, wettability, and adhesion characteristics of the underfills/substrates.

• Korean Journal of Materials Research
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• v.13 no.3
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• pp.174-179
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• 2003

Thin copper films were grown by electrodeposition on copper seed layers which were grown by sputtering of an ultra-pure copper target on tantalum nitride-coated silicon wafers and subsequently, cleaned in ECR plasma. The copper films were then subjected to ⅰ) vacuum annealing, ⅱ) rapid thermal annealing (RTA) and ⅲ) rapid thermal nitriding (RTN) at various temperatures over different periods of time. XRD, SEM, AFM and resistivity measurements were done to ascertain the optimum heat treatment condition for obtaining film with minimum resistivity, predominantly (111)-oriented and smoother surface morphology. The as-deposited film has a resistivity of ∼6.3 $\mu$$\Omega$-cm and a relatively small intensity ratio of (111) and (200) peaks. With heat treatment, the resistivity decreases and the (111) peak becomes dominant, along with improved smoothness of the copper film. The optimum condition (with a resistivity of 1.98 $\mu$$\Omega$-cm) is suggested as the rapid thermal nitriding at 400oC for 120 sec.

• Journal of Environmental Science International
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• v.12 no.10
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• pp.1055-1060
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• 2003

Adsorption on goethite of individual component from a solution containing phosphate, sulfate, or copper ion was investigated. Competitive adsorption in the binary and ternary solution systems composed of phosphate, sulfate, and copper ions was also investigated. In competitive adsorption systems with phosphate and sulfate ions, the presence of phosphate ion reduced the adsorption of sulfate ion largely. On the other hand, the presence of sulfate ion caused only a small decrease in phosphate adsorption. This result suggests that phosphate ion is a stronger competitor for adsorption on goethite than sulfate ion, which is consistent with the higher affinity of phosphate for the surface compared to sulfate ion. Compared to the results from single-sorbate systems, adsorption of copper ion in the binary system of sulfate ion and copper ion was found to be enhanced in the presence of sulfate ion. Addition of sulfate ion to the binary system of copper ion and phosphate ion resulted in a small enhancement in copper sorption. This result implies that the presence of sulfate ion promotes adsorption of the ternary complex FeOHCuSO$_4$. The adsorption isotherms could be well described by the Langmuir adsorption equation.

• Journal of Korean Society of Water and Wastewater
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• v.33 no.2
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• pp.131-140
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• 2019

This study used a packed column reactor and a horizontal flow mesh reactor to examine the removal of copper ions from aqueous solutions using pine bark, a natural adsorbent prepared from Korean red pine (Pinus densiflora). Both equilibrium and nonequilibrium adsorption experiments were conducted on copper ion concentrations of 10mg/L, and the removals of copper ions at equilibrium were close to 95%. Adsorption of copper ions could be well described by both the Langmuir and Freundlich adsorption isotherms. The bark was treated with nitric acid to enhance efficiency of copper removal, and sorption capacity was improved by about 48% at equilibrium; mechanisms such as ion exchange and chelation may have been involved in the sorption process. A pseudo second-order kinetic model described the kinetic behavior of the copper ion adsorption onto the bark. Regeneration with nitric acid resulted in extended use of spent bark in the packed column. The horizontal flow mesh reactor allowed approximately 80% removal efficiency, demonstrating its operational flexibility and the potential for its practical use as a bark filter reactor.

• Journal of Conservation Science
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• v.27 no.1
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• pp.31-40
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• 2011

Copper-red (Dongwha, Jinsa) is Korean traditional inorganic pigment used for red-coloring on the porcelain surface during Goryeo and Joseon Periods. Trace amounts of copper-red porcelains are handed down because of the technical difficulty of making and coloring of the pigment. It is known that copper ore sources were extensively distributed in Korea according to old literatures and some of them are still producing copper ore at this present. Main types of copper-bearing mineral in Korea are chalcopyrite ($CuFeS_2$) and malachite ($Cu_2CO_3(OH)_2$), and they are easily collected from the ground surface. This means Korea had geographical and economic geological advantages for supplying raw material of the pigment. These two minerals showed good red-coloring in color test for porcelain pigment. As a coloring element, copper showed micro size less than $5{\mu}m$ in diameter in glaze matrix. The dispersion of copper particle is the most decisive factor for red chromaticity of copper-red porcelain, as well as copper content of the pigment.

• Journal of ILASS-Korea
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• v.23 no.3
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• pp.149-153
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• 2018

The present study investigates the heat transfer characteristics of droplet growth during dropwise condensation on the hydrophobic copper surface. We use the copper specimen coated by the self-assembled layer and conduct the real-time measurement of droplet size and spatial distribution of condensates during condensation with the use of the K2 lens (long distance microscope lens) and CMOS camera. The temperatures are measured by three RTDs (resistance temperature detectors) that are located through the holes made in the specimen. The surface temperature is estimated by the measured temperatures with the use of the one-dimensional conduction equation. It is observed that the droplets on the surface are growing up and merging, causing larger droplets. The experimental results show that there are three distinct regimes; in the first regime, individual small droplets are created on the surface in the early stage of condensation, and they are getting larger owing to direct condensation and coalescence with other droplets. In the second and third regimes, the coalescence occurs mainly, and the droplets are detached from the surface. Also, the fall-off time becomes faster as the surface wettability decreases. In particular, the heat transfer coefficient increases substantially with the decrease in wettability because of faster removal of droplets on the surfaces for lower wettability.

• Restorative Dentistry and Endodontics
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• v.7 no.1
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• pp.77-83
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• 1981

The purpose of this study was to observe the bonding strength between tooth surface (enamel and dentin) and restorative filling materials which are two composite resins (Clearfil and Concise) and Glass ionomer cement, after etching with 50% phoshoric acid and 37% citric acid. To measure the bonding strength in enamel, the labial surface of upper anterior tooth was cut flatly with using carborundum disk and polished with sand paper disk, and to measure in dentin, the dentin surface was prepared by grinding upper part of posterior tooth horizontally. After washing the tooth surface with water and drying with air blast, the prepared tooth surface was etched. In glass ionomer cement, 50% phosphoric acid and 37% citric acid were used, in Clearfil 40% phosphoric acid was used and in Concise, 50% phosphoric acid and 37% citric acid were used as etchant for 1 minute. After the copper band which is 5 mm in diameter and 5 mm in height was fixed on the prepared surface and each filling material was inserted into the copper band, the hooking loop was inserted into filled material in the copper band before setting to make it easily that the load is applied on the specimen. After all specimens were immersed in water at $37^{\circ}C$ for 1 week, this specimen was placed on the load cell of tensile test apparatus, and specimen was pulled at the cross-head speed of 0.8 mm per minute. The following results were obtained 1) In glass ionomer cement, the bond strength obtained by 37% citric acid was higher than one obtained by 50% phosphoric acid in enamel and dentin surfaces. The bond strength obtained in non-etched surface was much less than one by etchants in enamel and dentin surface. 2) In Clearfil, the bond strength obtained by 40% phosphoric acid was 4 times more than one obtained by non etch ant. 3) In Concise, the bond strength obtained by 50% phosphoric acid was almost same as one obtained by 37% citric acid, and the bond strength obtained by non etch ant was much less than one obtained by etchants.