• Applied Chemistry for Engineering
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• v.33 no.2
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• pp.229-233
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• 2022

In this study, a gas-liquid hybrid atmospheric pressure plasma reactor of the dielectric barrier discharge method was fabricated and characterized. The solubility of copper oxide in the organic acid solution was increased when argon having a larger atomic weight than helium was used during plasma discharge. There was no significant effect of mixing organic acid solutions under plasma discharge treatment on the variation of copper oxide's solubility. As the applied voltage for plasma discharge and the concentration of the organic acid solution increased, the dissolution and removal power of the copper oxide layer increased. Solubility of copper oxide was more affected by the concentration in organic acid solution rather than the variation of plasma applied voltage. The usefulness of hybrid plasma reactor for the surface cleaning process was confirmed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.40-40
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.41-42
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.95-96
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.31-31
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.191-196
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• 2007

This paper presents the measuring technique for local heat transfer coefficients using a copper sensor in a rod bundle with mixing vanes. A copper sensor consists of a cartridge heater and four pieces of thermocouple. The Heater is located at the center of the copper sensor and thermocouples measure the surface temperature of the copper sensor. Unheated copper sensor and heated copper sensor are able to measure the local heat transfer coefficient at the position where the heated copper sensor is installed. However the entire region of a rod bundle is actually not heated, the decay of local heat transfer coefficients measured represents overestimated value rather than an actual value. The calibration curve for local heat transfer coefficients is presented using the correction factor calculated by CFD.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.121-121
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• 2009

구리 전해정련 과정에서 전해액 중의 Arsenic과 같은 불순물 성분이 전기동의 전착에 미치는 영향을 확인하고, 전해액 중의 최대 허용 농도를 도출하고자 하였다. 전해정련 과정에서 분순물 성분이 전기동 전착에 미치는 영향을 주사전자현미경(SEM), X-선 회절(X-ray diffraction) 및 전기화학적 분석을 통해 수행하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.299-300
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• 2007

• Journal of Surface Science and Engineering
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• v.26 no.4
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• pp.163-174
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• 1993

The effect of gelatine on the electrodeposition of copper in cupric sulfate-sulfuric acid solution was investi-gated using an ac impedance technique. In the presence of gelatine, the charge transfer resistance was in-creased and the electrical double layer capacitance was decreased. A model was suggested to explain the im-pedance spectra and it fitted well the experimental data. Also the uniformity of deposit thickness was in-creased while the grain size was decreased by the addition of gelatine.