Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effect of Gelatine on the Electrodeposition of Copper

구리 전착에서 젤라틴의 영향

  • 장영철 (동서산업(주) 신소재 연구소) ;
  • 손헌준 (서울대학교 공과대학 자원공학과)
  • Published : 1993.08.01
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Abstract

The effect of gelatine on the electrodeposition of copper in cupric sulfate-sulfuric acid solution was investi-gated using an ac impedance technique. In the presence of gelatine, the charge transfer resistance was in-creased and the electrical double layer capacitance was decreased. A model was suggested to explain the im-pedance spectra and it fitted well the experimental data. Also the uniformity of deposit thickness was in-creased while the grain size was decreased by the addition of gelatine.

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