• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.1
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• pp.1-12
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• 1996

In lots of application to heat exchanger systems, closed two-phase thermosyphons are tilted from a horizontal. If the tilt angle, especially, is less than 30$^{\circ}$, the operational performances of thermosyphon are highly dependent on tilt angle. The present study was conducted to better understand such operational behaviors as mech-anni는 of phase change, and flow patterns inside a tilted thermosyphon. For experiment, an ethanol thermosyphon with a 35% of fill charge rate was designed and manufactured, using a copper tube with a diameter 19mm and a length 1500mm. Through a series of test, the tilt angle was kept constant at each of 4 different values in the range 10~25deg. and the heat supply to the evaporator was stepwisely increased up to 30㎾/$m^2$. When a steady state was established to the thermosyphon for each step of thermal loads, the wall temperature distribution and vapor temperature at the condenser were measured. The wall temperature distributions demonstrated a formation of dry patch in the top end zone of the evaporator, with a values of temperature 20~4$0^{\circ}C$ higher than the wetted surface for a moderate heat flux q≒20㎾/$m^2$. Inspite of the presence of hot dry patch, however, the mean values of boiling heat transfer coefficient at the evaporator wall were still in a good agreement with those predicted by Rohsenow's formula, which was based on nucleate boiling. For the condenser, the wall temperatures were practically uniform, and the measured values of condensation heat transfer coefficient were 1.7 times higher than the predicted values obtained from Nusselt's film condensation theory on tilted plate. Using those two expressions, a correlation was formulated as a function of heat flux and tilt angle, to determine the total thermal resistance of a tilted thermosyphon. The correlation formula showed a good agreement with the experimental data within 20%.

• Korean Chemical Engineering Research
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• v.56 no.5
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• pp.705-710
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• 2018

An electrochemical glucose sensor with enzyme-free was fabricated using Pt nanoparticles (Pt NPs) decorated CuO nanoflowers (CuO NFs). 3-D CuO nanoflowers film was directly synthesized on Cu foil by a simple hydrothermal method and Pt NPs were dispersed on the petal surface of CuO NFs through electrochemical deposition. This prepared sample was noted to Pt NPs-CuO NF. Morphology of the Pt NPs-CuO NFs layer was analyzed using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS). The electrochemical properties and sensing performances were investigated using cyclic voltammetry (CV) and chronoamperometry (CA) under alkaline condition. The sensor exhibited a high sensitivity, wide liner range and fast response time. Its excellent sensing performance was attributed to the synergistic effect of the Pt NPs and CuO nanostructure.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.8
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• pp.408-418
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• 2017

Supercritical carbon dioxide ($sCO_2$) power system is emerging technology because of its high cycle efficiency and compactness. Meanwhile, PCHE (Printed Circuit Heat Exchanger) is gaining attention in $sCO_2$ power system technology because PCHE with high pressure-resistance and larger heat transfer surface per unit volume is fundamentally needed. Thermo-fluidic characteristics of $sCO_2$ in the micro channel of PCHE should be investigated. In this study, heat transfer characteristics of $sCO_2$ of various inlet conditions and cross-sectional shapes of single micro channel were investigated experimentally. Experiment was conducted at supercritical state of higher than critical temperature and pressure. Test sections were made of copper and hydraulic diameter was 1 mm. Convective heat transfer coefficients were measured according to each interval of the channel and pressure drop was also measured. Convective heat transfer coefficients from experimental data were compared with existing correlation. In this study, using measured data, a new empirical correlation to predict near critical region heat transfer coefficient is developed and suggested. Test results of single channel will be used for design of PCHE.

• Journal of the Semiconductor & Display Technology
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• v.4 no.2 s.11
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• pp.39-43
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• 2005

In the study, in order to deposit TaN thin film for diffusion barrier and bottom electrode we made the Plasma Assisted ALD equipment and confirmed the electrical characteristics of TaN thin films grown PAALD method. Plasma Assisted ALD equipment depositing TaN thin film using PEMAT(pentakis(ethylmethlyamino) tantalum) precursor and NH3 reaction gas is shown that TaN thin film deposited high density and amorphous phase with XRD measurement. The degree of diffusion and reaction taking place in Cu/TaN (deposited using 150W PAALD)/$SiO_{2}$/Si systems with increasing annealing temperature was estimated for MOS capacitor property and the $SiO_{2}$, (600${\AA}$)/Si system surface analysis by C-V measurement and secondary ion material spectrometer (SIMS) after Cu/TaN/$SiO_{2}$ (400 ${\AA}$) layer etching. TaN thin film deposited PAALD method diffusion barrier have a good diffusion barrier property up to 500$^{\circ}C$.

• Korean Journal of Food Science and Technology
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• v.11 no.1
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• pp.8-12
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• 1979

A cylindrical solar energy focusing collector constructed using aluminum-laminated film plastered on the acrylic plate and examined its performances under the Korean local weather conditions. The reflector surface of this collector· evidenced the reflectivity of 66.1%,which was satisfactory value that could be applicable to the solar collector for its low price and at·availability. Collector efficiency measured at the heat exchanger fluid in absorber-copper pipe black colored was 73% and the resulting natural convection of the heat transfer media (water) was recorded up to 2.82 cm/sec. The overall efficiency of the solar heater in operation was 28.6% and it was correlated with the solar energy input and the temperature elevation difference gained.

• Korean Journal of Materials Research
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• v.25 no.1
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• pp.27-31
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• 2015

This paper proposes a novel way of fabricating aligned porous Sn by freeze-drying of camphene slurry with stannic oxide ($SnO_2$) coated Sn powders. The $SnO_2$ coated Sn powders were prepared by surface oxidation of the initial and ball-milled Sn powders, as well as heat treatment of tin chloride coated Cu powders. Camphene slurries with 10 vol% solid powders were prepared by mixing at $50^{\circ}C$ with a small amount of oligomeric polyester dispersant. Freezing the slurry was done in a Teflon cylinder attached to a copper bottom plate cooled at $-25^{\circ}C$. Improved dispersion stability of camphene slurry and the homogeneous frozen body was achieved using the oxidized Sn powder at $670^{\circ}C$ in air after ball milling. The porous Sn specimen, prepared by freeze-drying of the camphene slurry with oxidized Sn powder from the heat-treated Sn/tin chloride mixture and sintering at $1100^{\circ}C$ for 1 h in a hydrogen atmosphere, showed large pores of about $200{\mu}m$, which were aligned parallel to the camphene growth direction, and small pores in their internal walls. However, $100{\mu}m$ spherical particles were observed in the bottom part of the specimen due to the melting of the Sn powder during sintering of the green compact.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.3
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• pp.686-693
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• 2004

We have studied a method to fabricated a Surface Acoustic Waves (SAW) filter for Wide band Codeless Division Multiple Access(WCDMA) was formed on the Langasite substrate and was evaporated by Aluminum-Copper alloy and then we developed a simulator using the mathematica package. And, we can design and fabricate the Slanted finger Inter-digital Transducer (SFIT) for the purpose to decreased the ultimate rejections on side of the electrodes, and performed computer-simulation by simulator. Also, we have employed that the block weighted type Inter-digital Transduce(IDT) as input transduce of the filter and the withdrawal weighted type IDT as an output transducer of the filter in order to minimize effect of diffractions. We have employed that the number of pairs of the input and output IDT are 50 pairs and the thickness and the width of reflector are $5000\AA$, and $1\lambda/4(\cong3.6{\mu}m)$, respectively. Also the width of IDT' finger and the space between IDT' finger and reflector are $1\lambda$/16 and 1\lambda$/8, respectively. Frequency response of the fabricated SAW bandpass filter has the property that center frequency is about 190MHz, bandwidth at the 3dB is probably 4MHz and out-band attenuation is -60dB approximately.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.623-626
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• 2005

Toward the practical applications, on operation of conduction-cooled HTS SMES at temperatures well below 77 K should be investigated, in order to take advantage of a greater critical current density of HTS and considerably reduce the size and weight of the system. Recently, research and development concerning application of the conduction-cooled HTS SMES that is easily movement are actively progressing in Korea. Electrical insulation under cryogenic temperature is a key and an important element in the application of this apparatus. Using multi wrapped copper by polyimide film for HIS SMES, the breakdown characteristics of models for turn-to-turn, that is surface contact model, were investigated under ac and impulse voltage at 77 K. A material that is Polyimide film (Kapton) 0.025 mm thickness is used for multi wrapping of the electrode. Statistical analysis of the results using Weibull distribution to examine the wrapping number effects on breakdown voltage under ac and impulse voltage in $LN_2$ was carried.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.