• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• Journal of Ship and Ocean Technology
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• v.1 no.1
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• pp.48-56
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• 1997

This paper deals with the energy dissipation of ductile metal plate due to cutting. By using nondimensional analysis, we present that the dissipation energy of tearing behaviour can be formulated as a function of slenderness ratio expressed by cutting length, yield stress, plate thickness and elastic modulus. The validity of the proposed formula for Al-alloy, copper and mild steel is demonstrated by comparing the proposed formula with experimental results, which are shown in good agreements except for thick mild steel plate.

• Journal of Electrochemical Science and Technology
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• v.14 no.2
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• pp.194-204
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• 2023

Models based on diffusion-limited aggregation (DLA) have been extensively used to explore the mechanisms of dendritic particle aggregation phenomena. The physical and chemical properties of systems in which DLA aggregates emerge are given in their fractal. In this paper, we present a comprehensive study of the growth of electrodeposited copper dendrites in flat plate electrochemical cells from a fractal perspective. The effects of growth time, applied voltage, copper ion concentration, and electrolyte acidity on the morphology and fractal dimension of deposited copper were examined. 'Phase diagram' set out the variety of electrodeposited copper fractal morphology analysed by metallographic microscopy. The box counting method confirms that the electrodeposited dendritic structures manifestly exhibit fractal character. It was found that with the increase of the voltage and copper ion concentration. The fractal copper size becomes larger and its morphology shifts towards a dendritic structure, with the fractal dimension fluctuating around 1.60-1.70. In addition, the morphology of the deposited copper is significantly affected by the acidity of the electrolyte. The increase in acidity from 0.01 to 1.00 mol/L intensifies the hydrogen precipitation side reactions and the overflow path of hydrogen bubbles affects the fractal growth of copper dendrites.

• Clean Technology
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• v.27 no.3
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• pp.240-246
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• 2021

The waste etching solution for chip on film (COF) contained about 3.5% copper, and it was recovered through cementation using iron samples. The effect of cementation with plate, chip, and powder iron samples was investigated. The molar ratio (m/r) of iron to copper was used as a variable in order to increase the recovery rate of copper. As the molar ratio increased, the copper content in the solution rapidly decreased at the beginning of the cementation reaction. Before and after the reaction, the copper content of the solution was determined by Inductively Coupled Plasma (ICP) using copper concentration according to time. After cementation at room temperature for 1 hour, the recovery rate of copper had increased the most in the iron powder sample, having the largest specific surface area of the samples, followed by the chip and plate samples. The recovered copper powder was characterized for its crystalline phase, morphology, and elemental composition by X-ray diffraction (XRD), scanning electron microscopy (SEM), and Energy-dispersive X-ray spectroscopy (EDS), respectively. Copper and unreacted iron were present together in the iron powder samples. The optimum condition for recovering copper was obtained using iron chips with a molar ratio of iron to copper of 4 giving a recovery rate of about 98.4%.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• Journal of the Korea Fashion and Costume Design Association
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• v.8 no.3
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• pp.129-143
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• 2006

This study is to review the printed cotton textile industry of Europe in 17th-l8th century, and specially investigate the development of the Toile do Jouy, printed French fabrics around the 18th century. Generally, the Toile de Jouy has two different meanings. The first meaning is the popular printed cotton textiles producted by wood block printing, copper plate printing and roller printing techniques at Jouy on Joas factory in France, around 18th century. The second meaning is the monochromatic upholstery fabrics printed by copper plate. Actually, this monochromatic printed textiles were the most popular printed cotton fabrics with large scale scenic designs with people, trees, birds, buildings, mythical heroes, protagonists of novel and country scenes of shepherds, sheep and other animals manufactured by Jouy on Joas factory. Main issue of this paper is to propose features of pattern, color and classify types of patterns expressed on the Toile de Jouy fabrics according to printing techniques such as wood block printing, copper plate printing and copper roller printing. And this study is also to analyze on origins of the variety of names called the printed cotton textiles in those days. The results of this study can help to understand the knowledge of printed cotton textiles in Europe and be effectively applied to develop printed fabric design in the textile industry.

• Journal of the Korea Convergence Society
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• v.8 no.4
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• pp.199-205
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• 2017

In this study, the design analysis and the explosion welding were made into a clad sheet by the convergence method in order to solve the problem of heat transfer to the guide due to the heating of the 3D printer heating block. The shear strength of the clad plate material was tested and the results were analyzed by thermal analysis, thermal conductivity and thermal imaging. The following conclusions were obtained. 3D modeling of the heating block made of copper and titanium clad plate material The thermal analysis showed that the surface temperature of the filament guide area was lower than the heating block surface temperature. The average shear strength of copper and titanium clad plate material was measured and the average value of 195.6MPa was obtained. The thermal conductivity of the heating block made of copper and titanium clad plate material was measured three times and the average value was $62.52W/m{\cdot}K$. The surface temperature of the heating block made of copper and titanium clad plate material was measured by a thermal imaging camera at a maximum of $107.3^{\circ}C$ and $183.2^{\circ}C$ at the filament guide. The temperature distribution was $89^{\circ}C$ lower than that of the existing filament.

• Journal of the Korean Society of Radiology
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• v.11 no.6
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• pp.459-466
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• 2017

The purpose of this study was to evaluate the difference of dose and image quality according to the material of the additional filter plate by selecting copper and nickel. First, the absorbed dose was measured using a Rando phantom setting the additional filter plates of copper and nickel None, 0.1 mm, 0.2 mm, and 0.3 mm under 120 kVp, and 6.3 mAs. Second, We acquired image according to filter thickness of copper and nickel. by changing the tube voltage of 90 kVp, 100 kVp, 110 kVp, 120 kVp and exposure indexes of 400, 800 and 1600. Third, we obtained the SNR and CNR values using the Image J program and evaluated quantitatively and then evaluated image quality. As a result, Absorbed dose measurements showed that nickel was higher than copper, and the absorbed dose decreased as the thickness increased(p<0.05). Furthermore, Quantitative analysis of images showed no significant difference between the two images according to change the voltage and the exposure index(p>0.05). In conclusion, this study confirms that the nickel addition plate can maintain the current image quality while reducing the exposure dose compared to copper.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.6 no.2
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• pp.91-98
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• 1977

For the cost reduction of a flat-plate solar collector, a new galvanized iron collectro plate replaced the convenctional copper or alnminum collector plates and the flow channel was also modified to a rectangular channel for a better heat transfer performance. A simple analytical model was developed and agreed well with the experimental results. The results show better thermal performance for a rectangular channel than for a conventional circular channel.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.