• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.14-20
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• 2006

During the 11 year period of 1995-2005, there was about a 40% increase in the world copper demand mainly because of the Asian economic growth. In the increase, about a half was consumed by China. Most of the China's copper demand increase has been taken place over the final 5-6 years of that period. The growth is expected to continue for several years, and in 10 years or sooner the same situation is expected for India. Copper is the third metal in global demand, but its little abundance in the Earth's crust is not well recognized. From the production rate and the abundance, a copper shortage, or crisis, has a high probability than the other metals. Deep ocean mineral resources such as manganese nodules in the Clarion-Clipperton Fracture Zones, Kuroko-type massive seafloor sulfides (SMS), and cobalt-rich manganese crusts in the EEZ and the high sea areas have big potentials for the future sources. We need to re-evaluate their potentials as copper resources and other metals to realize their developments. The same situation is under progress in the hydro-carbon markets. Methane hydrates that are classified into non-conventional hydro-carbon resources have an important role as the future sources, too.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.206.1-206.1
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• 2014

최근 전자 장비의 금속 전도성 패턴 제작에 있어서 직접적인 프린트가 가능한 프린팅 기술이 기존의 복잡한 photolithography 를 대체할 기술로 주목 받고 있다. 이와 함께 금속 전도성 패턴 제작에 사용되는 고가의 전도성 물질인 Ag ink 및 paste 를 저가의 Cu ink 및 paste 로 대체하기 위한 연구가 진행되고 있다. 하지만 일반적으로 copper 는 대기 중 에서 쉽게 산화되어 높은 저항을 야기시킨다. 따라서 Cu ink 또는 paste 를 제작할 때 copper nanoparticles 을 유기 용매에 분산하여 inert atmosphere에서 합성하거나 [1] copper ink 또는 paste 를 substrate 에 프린트하여 reduction atmosphere 에서 소성시킨다 [2]. 이번 연구에서 Cu paste 를 유리 기판에 screen printing 하여 혼합가스(질소 95%, 수소 5%)와 질소 가스 분위기에서 소성하여 Cu 전극의 소성 거동과 전기적 특성을 분석하였다. 4-point probe를 통해 소성된 Cu 전극의 저항을 측정하여 전도도를 조사하였으며 Thermal Gravimetric Analysis (TGA), Fourier Transform Infrared(FTIR)를 통해 소성된 Cu 전극의 유기물 분해가 전도도에 미치는 영향을 분석하고 Field Emission Scanning Electron Microscopy (FESEM)과 High Resolution Transmission Electron Microscopy (HRTEM)을 통해 Cu nanoparticles 의 grain growth가 전도도에 미치는 영향을 조사하였다.

• 한국결정성장학회지
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• 제24권2호
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• pp.84-87
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• 2014

Separation/recovery of valuable metals such as zinc, nickel or tin from copper alloy dross has recently attracted from the viewpoints of environmental protection and resource recycling. In this study, preliminary investigation on separation of tin (Sn) from copper alloy dross using selective dissolution method was performed. The tin in the copper alloy dross did not dissolve in an aqueous nitric acid solution which could allow the concentration/separation of tin from the copper alloy dross. Precipitation of tin as $H_2SnO_3$ (meta stannic acid)occurred in the solution and transformed to tin dioxide ($SnO_2$) after drying process. The dried sample was heat-treated at low temperature and its crystal structure, surface morphology and chemical composition were investigated.

• 한국표면공학회지
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• 제54권3호
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• pp.124-132
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• 2021

Graphene which grown on the cobalt or nickel sputtered copper foil depending on the annealing time was studied. Graphene on the copper foil grown by chemical vapor deposition was compared to those on cobalt or nickel sputtered copper foil by using a RF (Radio Frequency) magnetron sputtering at room temperature. FLG(few-layer graphene) was identified independent of substrates by Raman and X-Ray Photoelectron Spectroscopy analyses. On copper foil, size and area fraction of the graphene growth increased until 30 minutes annealing and then didn't changed. Comparing to that, graphene on the cobalt refined till 50 minutes annealing, after then the effect disappeared which means a similar shape to that on copper foil. On nickel the graphene refined irrespective of annealing time that is possibly because of the complete solid solution of nickel with copper.

• 한국결정성장학회지
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• 제8권3호
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• pp.431-434
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• 1998

층상구조를 가진 염기성 초산구리, $Cu(OH)(CH_3COO){cdot}H_2O$를 합성하였다. 또한 음이온 치환반응을 통해서 alkyl sulfonate를 염기성 초산구리에 삽입시켰다. X-선 회절 데이터와 alkyl sulfonate의 분자의 크기를 비교하여 층간 삽입된 초산구리의 공간배열을 확인하였다.

• 한국결정성장학회지
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• 제14권2호
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• Journal of Magnetics
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• 제11권3호
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• pp.119-122
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• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 제4회 압출 및 인발가공 심포지엄
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• pp.55-62
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• 2001

An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.

• Asian-Australasian Journal of Animal Sciences
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• 제23권5호
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• pp.573-579
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• 2010

This study was conducted to determine the effects of different copper (inorganic and organic) and energy (tallow and glycerol) sources on growth performance, nutrient digestibility, gas emission, diarrhea incidence, and fecal copper concentration in growing pigs by using a 2${\times}$2 factorial design. In this trial, 96 pigs (63 d of age) were employed, with an average initial weight of 28.36${\pm}$1.14 kg. The dietary treatments were i) basal diet with 134 ppm copper (Korea recommendation) as $CuSO_4$+tallow; ii) basal diet with 134 ppm Cu as $CuSO_4$+glycerol; iii) basal diet with 134 ppm copper as CuMet+tallow; and iv) basal diet with 134 ppm copper as CuMet+ glycerol. Throughout the entire experimental period, no differences were noted among treatment groups with regard to the magnitude of improvement in ADG (average daily gain), ADFI (average daily feed intake) and G/F (gain:feed) ratios. The nitrogen (N) digestibility of pigs fed on diets containing organic copper was improved as compared with that observed in pigs fed on diets containing inorganic copper (p<0.05). An interaction of copper${\times}$energy was observed in the context of both nitrogen (p<0.05) and energy (p<0.01) digestibility. Ammonia emissions were significantly lower in the organic copper-added treatment groups than in the inorganic copperadded treatment groups (p<0.05). Mercaptan and hydrogen sulfide emissions were reduced via the addition of glycerol (p<0.05). No significant effects of copper or energy source, or their interaction, were observed in reference to diarrhea appearance and incidence throughout the entirety of the experimental period. The copper concentration in the feces was significantly lower in the organic copper source treatment group than was observed in the inorganic copper source treatment group (p<0.05). The results of this experiment show that organic copper substituted for inorganic copper in the diet results in a decreased fecal copper excretion, but exerts no effect on performance. The different energy (tallow and glycerol) sources interact with different copper sources and thus influence nutrient digestibility. Glycerol supplementation may reduce the concentrations of odorous sulfuric compounds with different Cu sources.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.812-813
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• 2006

Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.