• The Plant Pathology Journal
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• v.32 no.5
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• pp.396-406
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• 2016

Continuous supplementation of mineral nutrients and salicylic acid (SA) as foliar application could improve efficacy in controlling basal stem rot (BSR) disease in oil palm seedling. It is revealed from the results that the highest disease severity index (58.3%) was recorded in T8 treatments at 9 months after inoculation. The best disease control was achieved by T7 treatments (calcium/copper/SA [Ca/Cu/SA]) (5.0%) followed by T1 (5.5%), T5 (5.8%), T3 (8.3%), T6 (8.3%), T4 (13.3%), and T2 (15.8%) treatments. Continuous supplementation of Ca/Cu/SA was found to be the most effective in controlling the disease and the high performance liquid chromatography results showed the detection of ergosterol at very low concentration in the treated samples. Moreover, the transmission electron microscopy analysis results clearly indicated that T7 treatment was also enhancing lignification, which was responsible for the thickness of the secondary cell walls and middle lamella compared to untreated samples. It was therefore, concluded that continuous supplementation of minerals nutrients and SA could effectively suppress disease severity by reducing ergosterol activity and also improve the process of lignification in the treated plants. Furthermore, this treatment also managed to delay the onset of BSR symptoms and promote the growth of the seedlings and eventually suppress the BSR disease.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.374-378
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• 2012

In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 ${\mu}m$ in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/$cm^2$, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/$cm^2$ is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/$cm^2$. A TSV with a diameter 10 ${\mu}m$ and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/$cm^2$ with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

• Journal of Microbiology and Biotechnology
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• v.31 no.12
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• pp.1656-1666
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• 2021

Dental pathogens lead to chronic diseases like periodontitis, which causes loss of teeth. Here, we examined the plausible antibacterial efficacy of copper nanoparticles (CuNPs) synthesized using Cupressus macrocarpa extract (CME) against periodontitis-causing bacteria. The antimicrobial properties of CME-CuNPs were then assessed against oral microbes (M. luteus. B. subtilis, P. aerioginosa) that cause periodontal disease and were identified using morphological/ biochemical analysis, and 16S-rRNA techniques. The CME-CuNPs were characterized, and accordingly, the peak found at 577 nm using UV-Vis spectrometer showed the formation of stable CME-CuNPs. Also, the results revealed the formation of spherical and oblong monodispersed CME-CuNPs with sizes ranged from 11.3 to 22.4 nm. The FTIR analysis suggested that the CME contains reducing agents that consequently had a role in Cu reduction and CME-CuNP formation. Furthermore, the CME-CuNPs exhibited potent antimicrobial efficacy against different isolates which was superior to the reported values in literature. The antibacterial efficacy of CME-CuNPs on oral bacteria was compared to the synergistic solution of clindamycin with CME-CuNPs. The solution exhibited a superior capacity to prevent bacterial growth. Minimum inhibitory concentration (MIC), minimum bactericidal concentration (MBC), and fractional inhibitory concentration (FIC) of CME-CuNPs with clindamycin recorded against the selected periodontal disease-causing microorganisms were observed between the range of 2.6-3.6 ㎍/ml, 4-5 ㎍/ml and 0.312-0.5, respectively. Finally, the synergistic antimicrobial efficacy exhibited by CME-CuNPs with clindamycin against the tested strains could be useful for the future development of more effective treatments to control dental diseases.

• The Korean Journal of Pesticide Science
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• v.6 no.4
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• pp.287-292
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• 2002

To establish effective and safe control method against Phytophthora root rot caused by Phytophthora capsici on tomato in hydroponic culture, three pesticides, oxadixyl copper hydroxide 8% WP, metalaxyl copper oxychloride 15% WP, and dimethomorph. dithianon 38% WP at 4 concentration levels were tested on potato dextrose agar medium inoculated with Phytophthora capsici. All pesticides inhibited mycelial growth, but two pesticides of them, metalaxyl copper oxychloride WP and dimethomorph. dithianon WP, were selected as effective pesticides for the efficacy test in a hydroponic culture. Forty days after transplanting of tomato seedlings, 4 ml of sporangia of P. capsici (about 25 sporangi/ml) per plot was inoculated around tomato plant root, and then 5 days after inoculation, the pesticides diluted at 5,000 times were drenched 1, 2 or 3 times per plot on the culture cube at 15 days interval. Fifteen days after drenching, tomato fruits and hydroponic culture solution were sampled for the analysis of pesticide residues. Dimethomorph was detected 0.001 and 0.003 mg/kg in tomato of the plots sprayed 2 and 3 times with dimethomorph dithianon WP of which detection levels were far below compared with 1.0 mg/kg of the Korean MRL of dimethomorph on tomato. Incidences of Phytophthora root rot were $30.5{\sim}50%$ in the plots drenched at 1 or 2 times with metalaxyl.copper oxychloride WP, and $16.7{\sim}25%$ in the plots treated with dimethomorph dithianon WP. However, there was no incidence of Phytophthora root rot in the plots treated at 3 times with both of pesticides, showing no phytotoxic effect. Based on the results, the drenching of these pesticides on the culture cube could be recommended as a very safe and effective control method for Phytophthora root rot in tomato.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.1
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• pp.57-63
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• 2015

The incidence of fires caused by electrical factors has increased with the growth in domestic electrical consumption. According to the national fire data system of national emergency management agency, electrical fires accounted for 20% of all domestic fires in the last 10 years. Electrical fires are mainly caused by short circuit, leakage current, defect in an electrical equipment, over load, utility fault, etc. The fault current can be several times larger than the nominal current, thereby exceeding the rated current of cable. Consequently, the cable conductor, typically copper wire, heats up to a temperature that ignites surrounding combustibles. This paper describes the transient characteristics of the 0.6/1kV, TFR-8 cable have been investigated, and analyzed under the over current conditions for reduce the risk of electrical fire by experimental and FEM analysis. The experimental and FEM(Finite Element Method) analysis results of temperature and resistance variation according to the over current in copper wires were analyzed. The experimental results coincide well with the FEM analysis.

• Bulletin of the Korean Chemical Society
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• v.31 no.8
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• pp.2247-2254
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• 2010

The surface structures of copper phthalocyanine (CuPc) thin films deposited on sulphur-passivated and plane perylene-3,4,9,10-tetracarboxylic dianhydride (PTCDA)-covered InAs(100) surfaces have been studied by low energy electron diffraction (LEED) and van der Waals (vdW) intermolecular interaction energy calculations. The annealing to $300^{\circ}C$ and $450^{\circ}C$ of $(NH_4)_2S_x$-treated InAs(100) substrates produces a ($1{\times}1$) and ($2{\times}1$) S-passivated surface respectively. The CuPc deposition onto the PTCDA-covered InAs(100) surface leads to a ring-like diffraction pattern, indicating that the 2D ordered overlayer exists and the structure is dominantly determined by the intermolecular interactions rather than substrate-molecule interactions. However, no ordered LEED patterns were observed for the CuPc on S-passivated InAs(100) surface. The intermolecular interaction energy calculations have been carried out to rationalise this structural difference. In the case of CuPc unit cells on PTCDA layer, the planar layered CuPc structure is more stable than the $\alpha$-herringbone structure, consistent with the experimental LEED results. For CuPc unit cells on a S-($1{\times}1$) layer, however, the $\alpha$-herringbone structure is more stable than the planar layered structure, consistent with the absence of diffraction pattern. The results show that the lattice structure during the initial stages of thin film growth is influenced strongly by the intermolecular interactions at the interface.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.8C
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• pp.792-802
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• 2002

One of the technologies which accelerate data transmission rate on the Internet is ADSL(Asymmetric Digital Subscriber Line), which enables the fast growth of the information age by providing infrastructures for the high speed Internet access. The network architecture of the ADSL service is the FTTC(Fiber To The Curb) which consists of fiber netwoks and copper based subscriber lines. The ADSL is a technology that utilizes the existing subscriber line efficiently. In the FTTC architecture, the major factors that degrade the quality of the ADSL service are the copper wires in the subscriber loops. This paper examines the characteristics of the subscriber lines that affect the high speed Internet access in deploying the ADSL services and also analyzes the mutual relationships between each line characteristic and its performance.

• Korean Journal of Environmental Agriculture
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• v.33 no.2
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• pp.129-133
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• 2014

BACKGROUND: This study was performed for selecting yeast mutants with a high tolerance for targeted metals, and determining whether yeasts strains tolerant to multiple heavy metals could be induced by sequential adaptations. METHODS AND RESULTS: A mutant yeast strain tolerant to the heavy metals cadmium (Cd), copper (Cu), nickel (Ni), and zinc (Zn) was selected by sequential elevated exposures to each metal with intermittent mutant isolation steps. A Cd-tolerant mutant was isolated by growing yeast cells in media containing $CdCl_2$ concentrations that were gradually increased to 1 mM. Then the Cd-tolerant mutant was gradually exposed to increasing levels of $CuCl_2$ in growth media until a concentration of 7 mM was reached, thus generating a strain tolerant to both Cd and Cu. In the subsequent steps, this mutant was exposed to $NiCl_2$ (up to 8 mM), and a resultant isolate was further exposed to $ZnCl_2$ (up to 60 mM), allowing the derivation of a yeast mutant that was simultaneously tolerant to Cd, Cu, Ni, and Zn. CONCLUSION: This method of inducing tolerance to multiple targeted heavy metals in yeast will be useful in the bioremediation of heavy metals.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.124-131
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• 1999

Copper film, which is expected to be used as interconnection material for 1 giga DRAM integrated circuits was deposited on hole and trench patterns by Metal Organic Chemical Vapor Deposition(MOCVD) method. After a reflow process, contact and L/S patterns were filled by copper and the characteristics of the Cu reflow process were investigated. When deposited Cu films were reflowed, grain growth and agglomeration of Cu have occurred in surfaces and inner parts of patterns as well as complete filling in patterns. Also Cu thin oxide layers were formed on the surface of Cu films reflowed in $O_2$ambient. Agglomeration and oxidation of Cu had bad influence on the electrical properties of Cu films especially, therefore, their removal and prevention were studied simultaneously. As a pattern size is decreased, preferential reflow takes place inside the patterns and this makes advantages in filling patterns of deep submicron size completely. With Cu reflow process, we could fill the patterns with the size of deep sub-micron and it is expected that Cu reflow process could meet the conditions of excellent interconnection for 1 giga DRAM device when it is combined with Cu MOCVD and CMP process.

• Proceedings of the Korea Society of Poultry Science Conference
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• 2001.11a
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• pp.66-68
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• 2001

An experiment was conducted investigate the of supplemental Cu and Zn methionine chelates on the performance, nutrient digestibility, serum IgG level, gizzard erosion, and Cu and Zn contents in the liver and excretion of broiler chickens. One thousand hatched broiler chickens (Ross) of one day old were assigned to 4 treatments:control(T1), 100ppm of copper in the from of Cu-methionine chelate(Cu-Met, T2), 100ppm of zinc in the from of Zn-methionine chelate(Zn-Met, T3) and 100ppm of copper plus 100ppm of zinc in the from of methionine chelate(Cu-Zn-Met, T4). Each treatment had four replications of 50 bird each. Weight gain of chicks fed chelated products were significantly higher than that of chicks fed control(P＜0.05).Combination of Cu and Zn chelates(Cu-Zn-Met) tended to show the best growth rate and feed conversion ratio. Nutrient digestibilities were not affected by dietary treatments. Serum IgG level of chicks fed Cu-Zn-Met was significantly higher than that of chicks fed control(P＜0.05). Gizzard erosion index was not significantly different among treatments. Contents of Cu and Zn in liver were not significantly affected by dietary treatments, whereas excretions of these minerals were significantly affected by dietary treatments.