• Journal of Electrochemical Science and Technology
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• v.3 no.1
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• pp.35-43
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• 2012

Highly ordered and perforated anodic aluminum oxide membranes were prepared by anodic oxidation and subsequent removal of the barrier layer. By using these homemade anodic aluminum oxide membranes as templates, metal selenide nanowires and nanotubes were synthesized. The structure and composition of these one-dimensional nanomaterials were studied by field emission scanning electron microscopy as well as transmission electron microscopy and energy dispersive X-ray spectroscopy. The growth process of metal selenide inside anodic aluminum oxide channel was traced by investigating the series of samples using scanning electron microscopy after reacting for different times. Straight and dense copper selenide and silver selenide nanowires with a uniform diameter were successfully prepared. In case of nickel selenide, nanotubes were preferentially formed. Phase and crystallinity of the nanostructured materials were also investigated.

• Asian-Australasian Journal of Animal Sciences
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• v.19 no.6
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• pp.905-908
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• 2006

The purpose of this research was to study the effects of kefir whey (kefir whey, peptides, lactic acid) on skin care properties including skin lightening effect and acne treatment. The final aim was to develop a new cosmetic product and enhance the value of dairy products. The results of skin lightening tests showed that all three kefir whey components (kefir whey, peptides and lactic acid) had inhibitory ability against melanin synthesis. Furthermore, copper chelating analysis demonstrated that both kefir whey and kefir whey peptides could chelate the copper in tyrosinase, which might explain the mechanism of inhibition. The ability for acne treatment indicated that lactic acid level higher than 60 mg/ml could inhibit the growth of Propionibacterium acne, whereas no inhibition was found with other components.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.489-492
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• 2003

In this paper, we experimented on the deterioration process of power supply cords and analyzed the heating temperature of each part of those cords. We also analyzed the surface states, metallurgical structures surface structures and compositions of the wire melted by over-current. In the results of the analyses, the covering began to be deteriorated from the inside. The heating temperature of extension cord was higher than that of plug body. The dendrite structures appeared at the melted wire. By the SEM and EDS analyses, the dendrite structure showed the growth of copper oxide. We found out the characteristics of PVC insulated flexible cords by over-current from the above experiments and analyses. These results may be useful data in the analyses of deterioration causes of power supply cords.

• Korean Journal of Microbiology
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• v.22 no.4
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• pp.243-247
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• 1984

The effect of the heavy metals copper and cadmium on the natural populations of surface microlayer and subsurface water was investigated. Two microbiological parameters, number of colony-forming bacteria and $^{14}C-glucose$ uptake rate, were evalated. The two natural bacterial populations showed different tolerances of the heavy metals. The ingibition of bacterial growth and activity occurred more strongly in the 1m-depth samples than in neuston populations. The results support the existence of autochthonous bacterioneuston populations in marine environment.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.168-168
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• 2009

핸드폰, 노트북과 같이 최신경량 전자재료로 만들어지는 전자제품의 수요가 급증함에 따라 반도체 배선의 폭이 점점 작아지고, 이로 인해 프린팅공정을 이용한 미세 배선기술이 활발히 개발되고 있다. 이에 본 연구는 미세배선에 높은 전기전도도를 부여하기 위하여 전기도금을 실시하였으며, 균일한 도금층을 얻기 위하여 첨가제에 따른 분극거동을 분석하고 이를 바탕으로 양극 및 음극 형상에 따른 구리의 성장 거동을 시뮬레이션을 통하여 분석하였다. 균일한 증착을 위해서는 첨가제의 역할도 중요하지만 양극과 음극의 형상에 따라서도 구리성장 거동에 영향을 미치는 것을 알 수 있었다.

• Journal of Korea Foundry Society
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• v.43 no.6
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• pp.294-301
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• 2023

The effects of Cu on feeding and macro-porosity characteristics were investigated in hypo- (A356 and 319) and hypereutectic (391) aluminum-silicon alloys. T-section and Tatur tests showed that the feeding and macro-porosity characteristics were significantly different between the hypo- and hypereutectic alloys. The hole and the pipe in the T-section and the Tatur casting in hypereutectic alloy showed a rough and irregular shape due to the faceted growth of the primary silicon, while the results of the hypoeutectic alloys exhibited a rather smooth surface. However, the addition of Cu did not strongly affect the macro-feeding behavior. It is known that copper segregates and interferes the feeding process in the last stage of solidification, possibly leading to form more amount of micro shrinkage porosity by the addition of Cu. The macro porosity formation mechanism and feeding properties were discussed upon T-section and Tatur tests together with an alloying addition.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.29-33
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• 2011

The current density in copper electroplating is directly related with the productivity and then to increase the productivity, the increase in current density is required. To obtain the high mass flow rate, rotating disk electrode(RDE) was employed. High rotational speed in RDE can increase the mass flow rate and then high speed electroplating was possible using RDE to control mass flow. Two types of cathode were used. One is RDE and another is rotating cylindrical electrode(RCE). A constant-current, constant-voltage and linear sweep voltammetry were applied to investigate current and voltage relationship. The maximum current density without evolution of hydrogen gas was increased with rotational speed. Over 400 rpm, maximum current density was higher than 1000 A/$m^2$. The diffusion coefficients of copper calculated from the slope of the plots are $5.5{\times}10^6\;cm^2\;s^{-1}$ at $25^{\circ}C$ and $10.5{\times}10^6\;cm^2\;s^{-1}$ at $62^{\circ}C$. The stable voltage without evolution of hydrogen gas was -0.05 V(vs Ag/AgCl). Additives were added to prevent dendritic growth on cathode deposits. The surface roughness was analyzed with UV-Vis Spectrophotometer. The reflectance of the copper surface over 600 nm was measured and was related with the surface roughness. As the surface roughness improved, the reflectance was also increased.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.67-72
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• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.

• Journal of Advanced Marine Engineering and Technology
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• v.36 no.8
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• pp.1083-1090
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• 2012

Copper alloys are widely used for casting materials including ship's propellers and pump impellers as they provide high corrosion resistance. In addition, the demand for these alloys is increasing with rapid growth of offshore structures and exploitation of various substitute energy sources. However, they require regular maintenance because of erosion and cavitation damages induced by exposure to marine environment at high speed flows for a long period of time. Water cavitation peening have received attention as one of surface modifications for durability improvement of the copper alloys. This is a environment friendly technology without influence of heat and easily applicable to casting materials. In this research, water cavitation peening was employed in distilled water for copper alloy castings as a function of time and evaluation of corrosion resistance was followed in seawater for the modified surface by using electrochemical methods. The result suggests that the water cavitation peening for 2 minutes was found to be the optimal peening parameter in terms of durability and corrosion resistance.