• ALGAE
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• v.26 no.3
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• pp.265-275
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• 2011

This study examined the bioaccumulation of the heavy metals copper (Cu) and zinc (Zn) by the giant kelp, Macrocystis pyrifera, by exposing meristematic kelp tissue to elevated metal concentrations in seawater within laboratory aquaria. Specifically, we carried out two different experiments. The first examined metal uptake under a single, ecologically-relevant elevation of each metal (30 ppb Cu and 100 ppb Zn), and the second examined the relationships between varying levels of the metals (i.e., 15, 39, 60, 120, 240, and 480 ppb Cu, and 50, 100, 200, 300, 500, and 600 ppb Zn). Both experiments were designed to contrast the uptake of the metals in isolation (i.e., when only one metal concentration was elevated) and in combination (i.e., when both metals' concentrations were elevated). Following three days of exposure to the elevated metal concentrations, we collected and analyzed the M. pyrifera tissues using inductively coupled plasma atomic emissions spectroscopy. Our results indicated that M. pyrifera bioaccumulated Cu in all treatments where Cu concentrations in the seawater were elevated, regardless of whether Zn concentrations were also elevated. Similarly, M. pyrifera bioaccumulated Zn in treatments where seawater Zn concentrations were elevated, but this occurred only when we increased Zn alone, and not when we simultaneously increased Cu concentrations. This suggests that elevated Cu concentrations inhibit Zn uptake, but not vice versa. Following this, our second experiment examined the relationships among varying seawater Cu and Zn concentrations and their bioaccumulation by M. pyrifera. Here, our results indicated that, as their concentrations in the seawater rise, Cu and Zn uptake by M. pyrifera tissue also rises. As with the first experiment, the presence of elevated Zn in the water did not appear to affect Cu uptake at any concentration examined. However, although it was not statistically significant, we observed that the presence of elevated Cu in seawater appeared to trend toward inhibiting Zn uptake, especially at higher levels of the metals. This study suggests that M. pyrifera may be useful as a bio-indicator species for monitoring heavy metal pollution in coastal environments.

• Journal of The Korean Society of Clinical Toxicology
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• v.4 no.2
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• pp.175-179
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• 2006

Welders are exposed to a number of hazards including metal fumes, toxic gases, electricity, heat, noise, and radiation such as ultraviolet and infrared light. We encountered a patient who developed non-cardiogenic pulmonary edema within a day after cutting copper pipe with an oxyethylene torch. The patient was a 26-year-old welder. He complained of dyspnea, generalized myalgia, and febrile sensation the following morning. The patient's chest X-ray and chest CT scan showed extensively distributed and ill-defined centrilobular nodules. Both his symptoms and chest X-ray abnormalities improved spontaneously. We attributed the patient's symptoms to non-cardiogenic pulmonary edema due to nitrogen dioxide, reasoning that: 1) the pipe consisted only of copper, according to material safety data sheet (MSDS); 2) a previous report in the literature demonstrated increased nitrogen dioxide levels under similar conditions; 3) the patient's clinical course and radiologic findings were very reminiscent of non-cardiogenic pulmonary edema following accidental exposure to nitrogen dioxide.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Korean Journal of Ecology and Environment
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• v.53 no.2
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• pp.165-172
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• 2020

Heavy metals are common pollutants in the freshwater environment and have toxicological effect in habitat organisms. The heavy metals highly accumulated in sediment and organism, and observed various physiological responses. In this study, we investigated the molecular response to heavy metal toxicity (Al, Aluminum; Cr, Chromium; Cu, copper; Mn, Manganese; Zn, Zinc) through expression of heat shock protein 40, 70, 90 (HSP40, 70, 90), cytochrome 450 (CYP450), Glutathione S-transferase (GST) and Serine-type endopeptidase (SP). HSPs showed up-regulation in Cu and Zn exposures. Furthermore, HSPs expression in treated groups tended to be higher than the control group. The tendency of CYP450 and GST mRNA expression was higher for Cr and Cu than for other exposure group. The expression of SP gene was low at Al exposure and other group were measured to be similar to control. These results suggest that heavy metal toxicity in freshwater ecosystem may affect physiological and molecular process. Also, the comprehensive gene expression in the aquatic midge Chironomus riparius give useful information to potential molecular biomarkers for assessing heavy metal toxicity.

• Journal of Life Science
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• v.30 no.4
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• pp.321-330
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• 2020

The aim of this study was to investigate the effect of copper (II) chloride (CuCl₂) on zebrafish. Zebrafish were exposed to various CuCl₂ concentrations and subjected to different exposure times to determine the median lethal concentration (LC₅₀) values. To evaluate stress responses, we measured whole-body cortisol levels and behavioral parameters using the open field test (OFT) or the novel tank test (NTT). The zebrafish were exposed to CuCl₂ solution at concentrations of 1.5-150 ㎍/l or a vehicle for 1 hr before behavioral tests or sample collection for whole-body cortisol. The LC₅₀ values were 30.3, 25.3, and 14.8 ㎍/l at 24, 48, and 96 hr, respectively. The NTT showed that mobility, velocity, and distance covered were significantly lower in zebrafish exposed to CuCl₂ than in the control group (p<0.05), while the turn angle was significantly higher in zebrafish exposed to a CuCl₂ concentration of 150 ㎍/l than in the control group (p<0.05). The OFT also showed that mobility, velocity, and distance covered were significantly lower and the turn angle and meandering were significantly higher in zebrafish exposed to all concentrations of CuCl₂ than in the control group (p<0.05). The whole-body cortisol levels were significantly higher in zebrafish exposed to CuCl₂ than in the control group (p<0.05). These results suggest that exposure to lethal CuCl₂ concentrations induces an intense toxic and stress response in zebrafish, causing behavioral changes and increasing whole-body cortisol levels.

• ALGAE
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• v.22 no.4
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• pp.319-323
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• 2007

This study was conducted with using chlorophyll a fluorescence (indicated as photosynthetic activity) to examine the toxic effect of 96 h exposure of heavy metals and herbicides on the benthic diatom Nitzschia sp. which was isolated from pristine sediment in Pamquat Harbour, Nova Scotia, Canada. Samples of benthic diatom were exposed to 0, 0.01, 0.1 and 1 mg L–1 of copper, 0, 1, 10 and 100 mg L–1 of chrome (VI), 0, 2.45, 24.5 and 245 mg L–1 of paraquat dichloride, and 0, 4.37, 43.7 and 437 mg L–1 of alachlor during 96 hours. The effective quantum yield of photochemistry (ΔF/Fm’) was evaluated by subjecting light acclimated samples to saturating pulses of light using a pulse amplitude modulated (PAM) fluorometer. The impact of heavy metals on Nitzschia sp. photosynthesis was not severe in < 1 mg L–1 but in the high concentrations (> 1 mg L–1) clearly increased toxic stress during 96 h. Herbicides had a limited impact during the exposure period but clearly increased stress on the benthic diatom with increasing concentrations. Acute response of Nitzschia sp. to selected heavy metals and herbicides was characterized, and the capacity of a benthic diatom to tolerate and recover from toxic stress was assessed.

• Journal of the Korean Solar Energy Society
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• v.33 no.5
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• pp.24-33
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• 2013

Renewable energy industries, including sola cell plants, has been ever increasing ones for reducing fossil fuel consumption and strengthening national energy policy. In this paper we tried to identify occupational health hazards in solar cell-related industries operated in Korea. Poly silicon, silicon ingot and wafer, solar cell and module are major processes for producing solar cells. Poly silicon operations may cause hazards to workers from metal silicon, silanes, silicon, hydro fluoric acid and nitric acid. Solar cells could not be constructed without using metals such as aluminum and silver, acids such as hydrofluoric acid and nitric acid, bases such as sodium hydroxide and potassium hydroxide, and solvent and phosphorus chloride oxide. Workers in module assembly process may exposed to isopropanol, flux, solders that contain lead, tin and/or copper. To prevent occupational exposure to these hazards, it is essential to identify the hazards in each process and educate workers in industries with proper engineering and administrative control measures.

• Journal of the Korean Wood Science and Technology
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• v.43 no.2
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• pp.265-273
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• 2015

In general, when wood products are used outdoors for a certain period of time the surface color of wood changes due to light, water, heat and so on. This color change can be considered importantly for the product's market value. In this study, the color change of ACQ (Alkaline Copper Quaternary) and CBHDO (CuO $H_3BO_3$ N-cyclohexyldiazenium-anion) treated wood and untreated wood was investigated during 2-year weathering test. From this experimental study, it was found that the colors of the treated wood changed more reddish and yellowish from green. Meanwhile, the untreated wood turned to grey color rapidly. Also, the color of the treated wood in short-term exposure changed closer to the inherent color of the fresh natural wood than that of the untreated woods.

• Journal of Electrochemical Science and Technology
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• v.12 no.2
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• pp.188-203
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• 2021

The specific benefits of the modified films formed on preliminary anodized aluminum, including the versatility of their potential applications impose the need for evaluation of the exploitation reliability of these films. In this aspect, the durability of Cu and Ni modified anodized aluminum oxide (AAO) films on the low-doped AA1050 alloy was assessed through extended exposure to a 3.5% NaCl model corrosive medium. The electrochemical measurements by means of electrochemical impedance spectroscopy (EIS) and potentiodynamic scanning (PDS) after 24 and 720 hours of exposure have revealed that the obtained films do not change their obvious barrier properties. In addition, supplemental analyses of the coatings were performed, in order to elucidate the impact of the AC-deposition of Cu and Ni inside the pores. The scanning electron microscopy (SEM) images have shown that the surface topology is not affected and resembles the typical surface of an etched metal. The subsequent energy dispersive X-ray spectroscopy (EDX) tests have revealed a predominance of Cu in the combined AAO-Cu/Ni layers, whereas additional X-ray photoelectron (XPS) analyses showed that both metals form oxides with different oxidation states due to alterations in the deposition conditions, promoted by the application of AC-polarization of the samples.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.