• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.299-301
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• 1989

This study presents a method of preparing $YBa_2Cu_3O_{7-x}$ ceramic and chlorine doping in it for the purpose of Jc enhancement us ins sol-gel process.Tetramethylammonium-hydroxide and pottasium carbonate solution were added to the aqueous solution of Yttrium nitrate, Barium chloride and Copper nitrate for pH control as well as forming hydroxy-carbonate precipitation. Instead of Barium nitrate, Barium chloride was used for doping chloride impurities in the specimen. The resulted materal showed good high Tc-superconductivity after calcination. Tc and Jc value are 92 K and 120.8 $A/cm^2$ respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.157-157
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• 2010

Programmable Metallization Cell (PMC) is a memory device based on the electrolytical characteristic of chalcogenide materials. PMC components of Ge-Se doped with Ag ions were studied with help of the previous studies and copper was used for metallic ions taking into account of economy of components. In this study, we investigated the nature of thin films formed by photo doping of Cu ions into chalcogenide materials for use in solid electrolyte of programmable metallization cell devices. We were able to do more economical approach by using copper which play role of electrolyte ions. The results imply that a Cu-rich phase separates owing to the reaction of Cu with free atoms from chalcogenide materials.

• Journal of Ceramic Processing Research
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• v.20 no.1
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• pp.30-34
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• 2019

Copper (Cu)-incorporated silica aerogel was synthesized by a sol-gel process with two-step drying process for color modification. The microstructure of the silica aerogel was not affected significantly by the Cu concentration and an amorphous structure was maintained without any crystalline impurity phases. The textural properties of the silica aerogels investigated by using N2 adsorption-desorption isotherms exhibited the typical features of mesoporous materials. The pore size and porosity were not changed significantly even with the incorporation of Cu up to 1.5 M, which indicates negligible variation of thermal insulating properties. However, the color of the aerogel changed from white and light greenish to dark greenish with increasing Cu content. The color change of the silica aerogel was due to the modification of the electron energy band structure of silica by the Cu atomic levels. Therefore, the color of the silica aerogel powders could be manipulated by incorporating Cu without degrading the thermal insulating properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.57-57
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• 2009

Programmable Metallization Cell (PMC) is a memory device based on the electrolytical characteristic of chalcogenide materials. We investigated the nature of thin films formed by photo doping of Cu ions into chalcogenide materials for use in solid electrolyte of PMC. We were able to do more economical approach by using copper which play an electrolyte ions role. The results imply that a Cu-rich phase separates owing to the reaction of Cu with free atoms from chalcogenide materials.

• Nuclear Engineering and Technology
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• v.56 no.7
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• pp.2740-2747
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• 2024

The sintering process acquired ferromagnetic copper ferrite ceramic material with a small concentration of Ni ion at 1100 ℃ for 1 h. Previously, copper ferrite with Ni proportions powder was acquired by the wet chemical process according to the relation CuFe_2-xNi_xO₄ where x takes values 0.0, 0.015, 0.03, 0.04, and 0.05. The role of Ni ion in the copper ferrite structure was investigated by X-ray analysis, Scanning electron microscope, EDX analysis, and density measurements. The gamma-ray shielding properties for the fabricated CuFeNiO ceramics samples were evaluated using the Monte Carlo simulation method. The obtained results show an enhancement in the linear attenuation coefficient for the fabricated ceramics with increasing the insertions of Ni ions within the fabricated samples, where increasing the Ni ions concentration between 0 and 1.19 wt% increases the linear attenuation by between 1.581 and 1.771 cm^-1 (at 0.103 MeV), 0.304-0.338 cm^-1 (at 0.662 MeV), and 0.160-0.178 cm^-1 (at 2.506 MeV), respectively. Simultaneously, the radiation protection efficiency for a 1 cm thickness of the fabricated samples increased between 14.8 and 16.3% with increasing the Ni ions between 0 and 1.19 wt%. Although the Ni doping concentration does not exceed 1.5 wt% of the total composition of the fabricated ceramics, the shielding capacity of the fabricated ceramics was enhanced by more than 11%, along the studied energy interval. Therefore, the fabricated samples can be used in gamma-ray shielding applications.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.13-13
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• 2001

현재 초고속 가공 공구의 국내 시장은 150억원이며 향후 3년 내에 1500억원으로 급성 장활 전망이다. 무윤활 초고속 가공을 실현하기 위해서는 윤활특성이 우수한 초고경도 코팅의 개발이 필요하며 이를 통해 기계설비의 수명향상과 폐유문제 해결을 기대할 수 있다. 기존의 고체윤활 코팅은 초고경도 코팅의 상부에 $MoS_2$, Graphite 등 윤활성 박막을 합성하였으나, 이들은 Hexagonal 구조의 연질 박막이며 수분이 존재하는 대기중에서는 윤활 및 내마모 특성이 급격히 저하된다. 환경친화 대체소재 개발의 일원으로 TiN, ZrN 박막 등이 이미 개발되었고 기계적 특성이 우수하여 널리 응용되고 있으나 아직 경도(약 20GPa 내외) 및 윤활성의 한계 (마찰계수 $\mu=O.6$)를 극복하지 못하고 있다. TiN박막 위의 Cu의 첨가는 TiN의 구조와 성질을 크게 변화시키는 것으로 알려져 있다. 따라서 본 연구에서는 TiN 기지 위에 Cu를 도핑함으로써 경도의 상승을 통환 내구력의 향상과 마찰계수의 감소를 통한 윤활성의 향상을 보고자하였다. TiN합성의 안정화를 위하여 magnetron sputtering과 arc ion pIatingd을 병용한 hybrid 공정을 이용하였다. Cu첨가에 따른 결정 성장 거동의 변화를 보기 위해 XRD 분석을 실행하였고, EDS 분석을 통해 Cu target 전류밀도에 의한 기지내의 Cu의 함량변화를 고찰하였으며, 경도 및 윤활특성을 고찰하기 위해서 경도 시험과 마모 시험(ball-on disc type test)를 하였다.

• Current Photovoltaic Research
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• v.3 no.1
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• pp.10-15
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• 2015

Cu doping by copper or $Cu_2Te$ materials enhances p+ formation in CdTe near the back contact interface, allowing better formation of ohmic contact. However, the Cu in CdTe junction is also considered as a principal component of CdTe cell degradation. In this paper, Na-doped ZnTe layer was employed as a back contact material to improve the stability of CdTe solar cells. As a process variable, post $CdCl_2$ treatment of CdS/CdTe film was conducted before or after depositing ZnTe:Na on CdTe. The change of the photovoltaic properties of CdTe cells were investigated with aging time. Low-temperature photoluminescence analysis was conducted to describe the degradation mechanism. The result showed that the CdTe solar cells with better stability compare to Cu contact were achieved using an optimized ZnTe:Na back contact.

• Journal of Hydrogen and New Energy
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• v.33 no.1
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• pp.105-112
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• 2022

Copper (Cu)-based catalysts have been widely used in a methanol steam reforming (MSR) reaction for hydrogen production for air-independent propulsion (AIP) applications and their good catalytic activities have attracted much attention. However, the agglomeration of the catalytic active site Cu causes deteriorating the catalytic performance and suppression of Cu agglomeration is a crucial issue in the AIP applications that the MSR system is typically operated at 250-300℃ for a long time. R. Sakai et al. recently showed a computational study on the anchoring effect that reduces an agglomeration of active sites by doping in a supporter. In order to present the anchoring effect on 𝛾-Al₂O₃ supported Cu-based catalysts, in this study, the adsorption energies of Cu on X-doped (X=ruthenium, phosphorus, silicon) 𝛾-Al₂O₃ were calculated and Cu adsorption energy decreased due to a change of the electronic structure originated from doping, thereby proving the anchoring effect.

• Transactions on Electrical and Electronic Materials
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• v.15 no.1
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• pp.24-27
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• 2014

In this study, the effects of Mn-doping and the electrode materials on the memory characteristics of $ZnO_xS_{1-x}$ resistive random access memory (ReRAM) devices on plastic are investigated. Compared with the undoped Al/$ZnO_xS_{1-x}$/Au and Al/$ZnO_xS_{1-x}$/Cu devices, the Mn-doped ones show a relatively higher ratio of the high resistance state (HRS) to low resistance state (LRS), and narrower resistance distributions in both states. For the $ZnO_xS_{1-x}$ devices with bottom electrodes of Cu, more stable conducting filament paths are formed near these electrodes, due to the relatively higher affinity of copper to sulfur, compared with the devices with bottom electrodes of Au, so that the distributions of the set and reset voltages get narrower. For the Al/$ZnO_xS_{1-x}$/Cu device, the ratio of the HRS to LRS is above $10^6$, and the memory characteristics are maintained for $10^4$ sec, which values are comparable to those of ReRAM devices on Si or glass substrates.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.37-37
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• 2001

TiN coatings were applied for VarIOUS application fields, because of a good wear-resistance and a high hardness. Typically, TiN thin films show the hardness of 25GPa and friction coefficient of 0.6. However, in many field, one is looking for a more improved tool which has low friction coefficient and high wear resistance. The main motivation of this study is to characterize the influence of copper dopant content on TiN thin films. Ti-Cu-N thin films were deposited onto D2 steel substrates by PVD processing with various magnetron current densities (Cu contents). In this work, we synthesized titanium nitride films similar with reported typical titanium nitride films and synthesized Ti-Cu-N thin films with the addition of elemental copper which is measured improved hardness more than pure TiN films with copper content variables. This films has preferred oriented films of (111) direction. In addition, It was found that there is a strong correlation between content of various metal and film characteristics such as preferred orientation, grain size, hardness and friction coefficient and so, in future study, improved mechanical properties of TiN films can be controlled by change in target current density. The Ti-Cu-N film will show apparent hardness improvement and mechanical properties enhancement, when doping element is added onto TiN thin films. Film structure, chemical composition, mechanical properties were investigated by means of X-ray diffraction(XRD), scanning electron microscopy(SEM), transmission electron microscopy (TEM), energy dispersive spectroscopy(EDS), wear resistance tester and nanohardness tester.