• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.413-416
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• 2007

In general, by means of the electrodepositing technique, a copper foil sample was prepared with a high purity and a high density. But the mechanical properties of the electrodepositing copper foil was lower than it's the rolling copper foil. However, the production of copper foil with approximately 36 microns thick in rolling process was very difficult. This paper describes the outline of the high accuracy cold rolling in 6 high mill which was developed for the purpose of rolling very thin accurate gauge copper foil(36 micron thick), and give several rolling characteristic of 600 mm wide copper foil. a) Large strain can be accumulated pass by pass in industrial multi-pass rolling processing to overcome large critical strain for thickness accuracy through optimization of rolling schedule. b) Also, permissible tension for rolling 0.45 $\sim$ 0.036 mm thick copper strip stably in accordance with the each pass work had been established by FEM simulation results. c) During the plate rolling process, considerable values of the forces of material pressure on the tool occur. These pressures cause the elastic deformation of the roll, thus changing the shape of the deformation region. A numerical simulation of roll deflection during cold rolling is presented in the paper. d) The proposed pass schedule can roll very thin copper foil of 36 micron thickness to a tolerance of ${\pm}1$ microns. The validity of simulated results was verified into rolling experiments on the copper foil.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.11
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• pp.66-72
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• 2008

During the plate and foil cold rolling process, considerable values of the force of material pressure on the tool occur. These pressures cause the elastic deformation of the roll, thus changing the shape of the deformation legion. Rolled copper foils should be characterized by a good quality and light dimensional tolerances. Because of automation that is commonly implemented in flat product rolling mills, these products should meet the requirements of tightened tolerances, particularly strip thickness, and feature the greatest possible flatness. The shape of the roll gap is influenced by the elastic deformation of rolls parts of the rolling process affecter of the pressure force. However, to control roll deformation should be difficult. Because the foil thickness is very thin and the permissible deviations in the thickness of foil are small. In this paper, FE-simulation of roll deformation in thin foil cold roiling process is presented.

• Journal of Sensor Science and Technology
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• v.23 no.4
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.49-53
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• 2005

The objective of this research was to establish the size limitation of micro metal forming and analyze the formability of foil. Flat-rolled ultra thin metallic copper foil($3{\mu}m$ in thickness) was used as a forming material and foil was annealed to improve the formability at the temperature of $385^{\circ}C$. Forming die was fabricated by using etching technique of DRIE(deep reactive ion etching) and HNA isotropic etching. For the forming die and coupe. foil were vacuum packed and the forming was conducted as applying hydrostatic pressure of 250MPa to the vacuum packed unit. We successfully obtained the micro channels of $12\~14{\mu}m$ width and $9{\mu}m$ depth from micro forming process we designed. We also investigated the thickness strain distribution of foil from experiment and FE simulation result. Micro channels had a good formability of smooth surface and size accuracy. We expect that micro metal forming technology will be applied to production of micro parts.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.245-248
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1059-1062
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• 2003

Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

• Korean Journal of Materials Research
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• v.17 no.1
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• pp.56-59
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• 2007

Recently, requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. In this study, we evaluated the surface morphology, crystal phase ana surface roughness of the copper film electrodeposited by pulse method without using additives. Homogeneous and dense copper crystals were formed on the titanium substrate, and the optimum condition was 25% duty cycle. Moreover, the surface roughness(Ra), $0.295{\mu}m$, is the smallest value in this condition. It is thought that this copper foil is good for electromigration inhibition due to the preferential crystal growth of Cu (111)

• Journal of the Korean Society for Precision Engineering
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• v.24 no.2 s.191
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• pp.134-139
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• 2007

Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.873-877
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• 2005

The burr of micro drilling and micro cutting on thin metal film is a major obstacle to mass production for micro PCB boards in micro technologies of personal computing and telecom explosion. As the burr affects on the assembling process, it is necessary to study continuously on control or elimination of the burr. In order to get higher valued products, it is also needed to competitive techniques with the high resolution. In this paper, we studied experimentally the burr generation that when it is processed on the copper foil by laser in micro-hole machining. Unlike mechanical machining the burr produced on substrate is a resultants of melt and re-solidification of a melten metal which was heated and treated by laser. And higher laser energy increases the size of burr. Therefor in micro-drilling with laser, it is difficult to reduce the effects of burr for very thin metal sheets. We investigated the stale of the burr and analyzed the laser ablation Cu micro machining with respect to laser intensity and processing time.