• Title/Summary/Keyword: Copper Plating

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Development of Acid Resistance Velocity Sensor for Analyzing Acidic Fluid Flow Characteristics (산성 용액 내 유속 측정을 위한 내산성 센서 개발)

  • Choi, Gyujin;Yoon, Jinwon;Yu, Sangseok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.10
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    • pp.629-636
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    • 2016
  • This study presents the development of an acid resistance velocity sensor that is used for measuring velocity inside a copper sulfate plating bath. First, researchers investigated the acid resistance coating to confirm the suitability of the anti-acid sensor in a very corrosive environment. Then, researchers applied signal processing methods to reduce noise and amplify the signal. Next, researchers applied a pressure-resistive sensor with an operation amplifier (Op Amp) and low-pass filter with high impedance to match the output voltage of a commercial flowmeter. Lastly, this study compared three low-pass filters (Bessel, Butterworth and Chebyshev) to select the appropriate signal process circuit. The results show 0.0128, 0.0023, and 5.06% of the mean square error, respectively. The Butterworth filter yielded more precise results when compared to a commercial flowmeter. The acid resistive sensor is capable of measuring velocities ranging from 2 to 6 m/s with a 2.7% margin of error.

Study of adhesion properties of flexible copper clad laminate having various thickness of Cr seed layer under constant temperature and humidity condition (항온항습 조건하에서 Ni/Cr 층의 두께에 따른 FCCL의 접합 신뢰성 평가)

  • Choi, Jung-Hyun;Noh, Bo-In;Yoon, Jeong-Won;Kim, Yong-Il;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2010.05a
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    • pp.80-80
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    • 2010
  • 전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.

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Preparation and Application of Nanofiltration Membranes (NF막 제조 및 응용공정)

  • 이규호;오남운;제갈종건
    • Proceedings of the Membrane Society of Korea Conference
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    • 1998.06a
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    • pp.135-153
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    • 1998
  • Nanofiltration (NF) is a recently introduced term in membrane separation. In 1988, Eriksson was one of the first authors using the word 'nanofiltration' explicitly. Some years before, FilmTech started to use this term for their NF50 membrane which was supposed to be a very loose reverse osmosis membrane or a very tight ultrafiltration membrane. Since then, this term has been introduced to indicate a specific boundary of membrane technology in between ultrafiltration and reverse osmosis. The application fields of the NF membranes are very broad as follows: Demeneralizing water, Cleaning up contaminated groundwater, Ultrapure water production, Treatment of effleunts containing heavy metals, Offshore oil platforms, Yeast production, Pulp and paper mills, Textile production, Electroless copper plating, Cheese whey production, Cyclodextrin production, Lactose production. The earliest NF membrane was made by Cadotte et al, using piperazine and trimesoyl chloride as monomers for the formation of polyamide active layer of the composite type membrane. They coated very thin interfacially potymerized polyamide on the surface of the microporous polysulfone supports. The NF membrane exhibited low rejections for monovalent anions (chloride) and high rejections for bivalent anions (sulphate). This membrane was called NS300. Some of the earliest NF membranes, like the NF40 membrane of FilmTech, the NTR7250 of Nitto-Denko and the UTC20 and UTC60 of Toray, are formed by a comparable synthesis route as the NS300 membrane. Commercially available NF membranes nowadays are as follows: ASP35 (Advanced Membrane Technology), MPF21; MPF32 (Kiryat Weizmann), UTC20; UTC60; UTC70; UTC90 (Toray), CTA-LP; TFCS (Fluid Systems), NF45; NF70 (FilmTec), BQ01; MX07; HG01; HG19; SX01; SX10 (Osmonics), 8040-LSY-PVDI (Hydranautics), NF CA30; NF PES 10 (Hoechst), WFN0505 (Stork Friesland). The typical ones among the commercially available NF membranes are polyamide composite membrane consisting of interfacially polymerized polyamide active layer and microporous support. While showing high water fluxes and high rejections of multivalent ions and small organic molecules, these membranes have relatively low chemical stability. These membranes have low chlorine tolerance and are unstable in acid or base solution. This chemical instability is appearing to be a big obstacle for their applications. To improve the chemical stability, we have tried, in this study, to prepare chemically stable NF membranes from PVA. The ionomers and interfacially polymerized polyamide were used for the modification of'the PVA membranes. For the detail study of the active layer, homogeneous NF membranes made only from active layer materials were prepared and for the high performance, composite type NF membranes were prepared by coating the active layer materials on microporous polysulfone supports.

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Ingredient analysis of 태환이식 excavated from 황남대총 남분 and the characteristics (황남대총 남분출토 태환이식의 성분분석과 그 특징)

  • Ju, Jin-ok;Kang, Dai-il
    • 보존과학연구
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    • s.27
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    • pp.129-143
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    • 2006
  • This report is on a scientific investigation of 3 pairs of 금제태환이식 which were excavated from 황남대총 납분. 태환 is a main part of 태환이식 and it could be classified with 4 types in how to produce, especially how many the golden petal was used. In this investigation, they,3 pairs of 금제태환이식 from 황남대총 남분, were in 3 of 4 types and also I could find that this result was not on the technical progress but on the ingredient of metal. Also, In the result of ingredient assay, I could find that although they were in one pair of 태환 one piece was made in gold and silver alloy and the other piece was made in 99.5 percent of pure Ag with gold amalgam plating. And the another pair was getting red from others because of making in 33percent of Ag and 77 percent of gold, high Ag content. And All pairs of 태환 have a small quantity of Copper. As above, although they are one pair they have the difference of how to produce and the difference of volume and ingredient content, it means that these pairs of 태환 from 황남대총 남분 were made in pressure of time. From now on, if we investigate the ingredient and how to produce of 태환이식 in the local comparative analysis, namely natural science method, we can find out the metal art technique and the social aspect of the ancient times as not analogical inference but scientific basis.

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A Study on Improving the Current Density Distribution of the Cathode by the Bipolar Phenomenon of the Auxiliary Anode through the Hull Cell Experiment (헐셀을 통한 보조 양극의 바이폴라 현상에 의한 음극의 전류밀도 분포 개선 영향성 연구)

  • Young-Seo Kim;Yeon-Soo Jeong;Han-Kyun Shin;Jung Han Kim;Hyo-Jong Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.1
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    • pp.71-78
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    • 2023
  • The possibility of improving plating thickness distribution was investigated through quantitative consideration of bipolar electrodes without external power applied. By having the cathode tilted with respect to the anode, the potential distribution in the electrolyte solution adjacent to the cathode is different due to the difference in iR drop due to the path difference to the anode in each region of the cathode. The purpose of this study is to observe the bipolar characteristics in the case of an auxiliary anode for the non-uniform potential distribution of such a Hull cell. In particular, in order to evaluate the possibility of improving the non-uniform thickness distribution of the cathode by utilizing these bipolar characteristics, it was verified through experiments and simulations, and the electric potential and current density distribution around the bipolar electrode were analyzed. The electroplating in a Hull cell was performed for 75 min at a current density of 10 mA/cm2, and the average thickness is about 16 ㎛. The standard deviation of the thickness was 10 ㎛ in the normal Hull cell without using the auxiliary anode, whereas it was 3.5 ㎛ in the case of using the auxiliary cathode. Simulation calculations also showed 8.9 ㎛ and 3.3 ㎛ for each condition, and it was found that the consistency between the experimental and simulation results was relatively high, and the thickness distribution could be improved through using the auxiliary anode by the bipolar phenomenon.