Acknowledgement
이 논문은 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임(No. NRF-2021M3H4A6A01041234).
References
- S. H. Kim, H. J. Lee, D. Josell, and T. P. Moffat, "Bottomup Cu Filling of Annular through Silicon Vias Microstructure and Texture", Electrochimica Acta, 335, 135612 (2020)
- S. H. Kim, H. K. Shin, C. M. Park, D. U. Kim, P. R. Cha, U. H. Lee, and H. J. Lee, "Shape Change of Cu Pillar Solder Bump During Reflow Process and Its Modeling", Korean. J. Met. Mater., 53, 495 (2015)
- D. Josell, D. Wheeler, W. H. Huber, and T. P. Moffat, "Superconformal Electrodeposition in Submicron Features", Phys. Rev. Lett., 87, 016102 (2001)
- T. P. Moffat, D. Wheeler, M. D. Edelstein, and D. Josell, "Superconformal Film Growth: Mechanism and Quantification", IBM J. Res. Dev., 49, 19 (2005)
- W. P. Dow, M. Y. Yen, S. Z. Liao, Y. D. Chiu, and H. C. Huang, "Filling Mechanism in Microvia Metallization by Copper Electroplating", Electrochimica Acta, 53, 8228 (2008)
- W. P. Dow, C. C. Li, M. W. Lin, G. W. Su, and C. C. Huang, "Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers", J. Electrochem. Soc., 156(8), D314 (2009)
- O. Kardos, "Current Distribution on Microprofiles", Plating 61, 129 (1974)
- A. C. West, M. Matlosz, and D. Landolt, "Primary Current Distribution in the Hull Cell and Related Trapezoidal Geometries", J. Appl. Electrochem., 22, 301 (1992)
- J. Park, S. Choi, R. Hoover, K.-R. Kim, S. Sohn, Y.-H. Shin, S. Phongikaroon, M. Simpson, and I. S. Hwang, "Comparison between Numerical Simulations and Experimental Results on Copper Deposition in Rotating Cylinder Hull Cell", Electrochimica Acta, 164, 218 (2015)
- R. O. Hull, "Apparatus and Process for the Study of Plating Solutions", US Patent 2,149,344, (1935)
- T. M. Braun, D. Josell, M. Silva, J. Kildon, and T. P. Moffat, "Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias", J. Electrochem. Soc., 166, D3259 (2019)
- S.-J. Kim, H.-K. Shin, H. Park, and H.-J. Lee, "A Study on The Effect of Current Density on Copper Plating for PCB through Electrochemical Experiments and Calculations", J. Microelectron. Packag. Soc., 29(1), 49-54 (2022)
- W. Engelmaier, T. Kessler, and R. Alkire, "Current Distribution Leveling Resulting from Auxiliary Bipolar Electrodes", J. Electrochem. Soc., 125, 209 (1978)
- W. K. Yeo, "A Study on Uniformity of Current Distribution in Hull Cell", J. Kor. Inst. Surf. Eng., 27(6), 340 (1994)
- H.-J. Lee, S. Moon, C. M. Park, Y. S. Song, J. H. Park, S. H. Heo, and C. Kang, "Apparatus of Electroplating", Kor. Patent 10-2017-0090271 (2017)
- S. E. Fosdick, K. N. Knust, K. Scida, and R. M. Crooks, "Bipolar Electrochemistry", Angew. Chem. Int. Ed., 52, 10438(2013)