• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.563-566
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• 2002

Copper complexes have been directly incorporated into cellulose acetate (CA) and the resulting light blue colored homogeneous films of 5-20 wt.% copper acetate complex concentrations are found to be thermally stable up to 200 $^{\circ}C$. The reaction chem istry of Cu in CA has been investigated by reacting them with small gas molecules such as CO, H2, D2, O2, NO, and olefins in the temperature range of 25-160 $^{\circ}C$, and various Cu-hydride, -carbonyl, -nitrosyl, and olefin species coordinated to Cu sites in CA are characterized by IR and UV/Vis spectroscopic study. The reduction of Cu(II) complexes by reacting with H2 gas at the described conditions results in the formation of Cu2O and copper metal nanoparticles in CA, and their sizes in 30-120 nm range are found to be controlled by adjusting metal complex concentration in CA and/or the reduction reaction conditions. These small copper metal particles show various catalytic reactivity in hydrogenation of olefins and CH3CN; CO oxidation; and NO reduction reactions under relatively mild conditions.

• Bulletin of the Korean Chemical Society
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• v.30 no.5
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• pp.1113-1117
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• 2009

The one-dimensional coordination polymers, $[Cu^{II}(L)(NO_3)_2]_n$ (1) and {$[Cu^{II}(L)(NO_3)]{\cdot}2H_2O}_{2n} (2), were synthesized from $Cu(NO_3)_2{\cdot}3H_2O$ and 2-[(pyridin-3-ylmethyl)amino]ethanol (L, PMAE) in methanol by controlling the molar ratio of copper(II) salt. Copper(II) ion in 1 has one pyridine group of PMAE whose an aminoethanol group coordinates adjacent copper(II) ion. As the pyridine group is bonded to neighboring copper(II) ion, 1 becomes a one-dimensional chain. Contrary to 1, the structure of 2 shows that the oxygen atom of ethoxide group is bridged between two copper(II) ions, which forms a dinuclear complex. Additionally, the pyridine group of PMAE included one dinuclear unit is coordinated to the other dimeric one each other, which leads to a one-dimensional polymer. Due to the structural differences, 1 exhibits weak antiferromagnetic interaction, while 2 shows strong antiferromagnetic interaction. Due to direct spin exchange via oxygen of PMAE 2 has a much strong spin coupling than 1.

• Journal of the Korean Wood Science and Technology
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• v.25 no.4
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• pp.92-98
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• 1997

To make good use of chitosan forming complex with heavy metals in wood preservative treatment, woods impregnated with chitosan and copper sulfate were prepared. Amounts of leached copper, decay resistance, anti-mold efficacy, iron corrosion rates, moisture regain rates and degradation pattern in chitosan pre-treated and untreated wood were compared. After leaching test, amounts of leached copper from chitosan pre-treated wood had a much smaller than chitosan untreated wood, and good decay resistance was retained even after leaching test. From these results, it was proved that chitosan-copper complex formed in wood played and important role for decay durability. In chitosan pre-treated wood, damage values by test molds became remarkably smaller, but the growth of test molds was not perfectly inhibited. Distinct differences in iron corrosion rates between chitosan pre-treated and untreated woods was not recognized but chitosan pre-treated wood showed the lower moisture regain rates than chitosan untreated wood because of water insoluble chitosan membrane formed in wood. After leaching test, the tracheid walls in the wood treated with 2.0% copper sulfate only were eroded by the fungal attacks, but those in the wood pre-treated with chitosan remained almost intact.

• Clean Technology
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• v.19 no.4
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• pp.487-491
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• 2013

To efficiently desorb gold and copper-cyanide complexes adsorbed onto Dowex21K XLT resin, the mixed solvent with HCl and acetone which is a kind of dipolar aprotic solvent was used as a desorbing agent. The desorption efficiency for gold-cyanide complex was the highest as about 94% when the mixing ratio of HCl and acetone based on volume was the 7:3, however, the value decreased as the ratio of acetone increased. In the case of copper-cyanide complex, most of them was desorbed when the amount of HCl was relatively higher than that of acetone, however, desorption efficiency decreased as the ratio of acetone increased. The desorption efficiency for gold and copper-cyanide complexes was the 94 and 100%, respectively at the 0.6 M of HCl with the 7 (HCl) : 3 (Acetone) of mixing ratio and desorption efficiency for gold-cyanide complex not increased any more even though higher HCl concentration was used. And the desorption efficiency for gold and copper-cyanide complexes was about 100% at the S/L raio ${\leq_-}1.0$ whereas desorption efficiency for gold-cyanide complex was very low as about 20-29% at the S/L ratio > 1.0. Also, most of desorption process for gold and copper-cyanide complexes was completed within 120 min.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.632-638
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• 2021

With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH₂) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.

• Journal of Environmental Health Sciences
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• v.19 no.2
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• pp.40-45
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• 1993

A solvent extraction system of copper-thiocyanate complex into various types of alkylamines such as secondary, tertiary and quaternary ammonium salt for the determination of trace copper by atomic absorption spectrometry is presented. The maximum extraction of copper shows at 0.1 M-thiocyanate and single extraction with 10 ml of 1% amine-MIBK from 50 ml of aqueous solution is enough to be quantitative for micro amounts of copper. The effect of amine diluents and of diverse ions are also examined.

• Bulletin of the Korean Chemical Society
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• v.16 no.3
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• pp.202-204
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• 1995

The ultraviolet photochemistry of N,N'-bis(salicylidene)ethylenediamine copper(II), Cu(sal)2en, was investigated with low pressure mercury lamp. Redution of Cu(Ⅱ) and formation of Cl- were shown on 254 nm irradiation both for aerated and deaerated chlorinated hydrocarbon solvent such as CH2Cl2, chloroform, and 1,2-dichloroethane. Relatively long lived $({\tau}=100{\mu}sec)$ intermediate was detected by flash photolysis. Overall photo-process can be described as the formation of Cl- and new copper complex, product(1) by chlorohydrocarbon mediation, photoinduced reduction by abstraction of halogen from solvent, followed by redox induced substitution of axial ligand with chlorine. Product(1) is possibly Cu(III) chlorosalicylaldeimido complex and cyclic -CH2CH2- moiety is absent in the structure. 247nm band of Cu(sal)2en should contain ligand to metal charge transfer character.

• Bulletin of the Korean Chemical Society
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• v.29 no.5
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• pp.1033-1037
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• 2008

A copper cyclam-type complex was successfully immobilized onto mesoporous silica SBA-16. Characterization by NIR spectroscopy and TGA analysis confirmed that copper cyclam complex is immobilized onto mesoporous SBA-16. The Cu(II)-Cyclam-SBA-16 was proven to be a good catalyst for oxidation reaction of cyclohexene with conversion up to 77.8% after 13 h reaction and providing a high selectivity to cyclohexenol and 3-hydroperoxycyclohex-1-ene. The results suggest that the copper species play a major role as catalyst via reversible redox cycles as proven by cyclic voltammetry analysis.

• YAKHAK HOEJI
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• v.26 no.2
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• pp.97-103
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• 1982

This paper presents anti-inflammatory effects of nonsteroidal anti-inflammatory drugs and their copper complexes, and the change of content of copper in serum, liver, brain and edema foot induced by 1% carrageenan in rats, and also investigation of stomach hemorrhage. The results were as follows. 1. The content of copper decreased in liver and brain, however, the concentration of copper significantly increased in serum and edema site after carrageenan injection in rats. 2. The content of copper in serum and edema site was decreased after administration of anti-inflammatory drugs. 3. Edema inhibition rate of aspirin was, higher than that of copper (II) aspirinate, but edema inhibition rate of copper complex of naproxen was markedly higher than that of naproxen. 4. Hemorrhage of stomach of copper salicylate was higher than that of sodium salicylate, but hemorrhage of stomach of sodium naproxen was higher than that of copper naproxen.

• Journal of the Korean institute of surface engineering
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• v.29 no.2
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.