• Animal Bioscience
• /
• 제35권3호
• /
• pp.484-493
• /
• 2022

Objective: This study was conducted to evaluate the effects of the supplementation of diets of broiler chickens with hot-melt extruded CuSO₄ (HME-Cu) on their growth performance, nutrient digestibility, gut microbiota, small intestinal morphology, meat quality, and copper (Cu) bioavailability. Methods: A total of 225 broilers (Ross 308), one-day old and initial weight 39.14 g, were weighed and distributed between 15 cages (15 birds per cage) in a completely randomized experimental design with 3 treatments (diets) and 5 replicates per treatment. Cages were allotted to three treatments including control (without supplemental Cu), IN-Cu (16 mg/kg of CuSO₄), and HME-Cu (16 mg/kg of HME processed CuSO₄). Results: The HME-Cu treatment tended to increase the overall body weight gain (p<0.10). The apparent digestibility of Cu was increased by supplementation of HME-Cu at phase 2 (p<0.05). The Escherichia coli count in cecum tended to decrease with the supplementation with Cu (p<0.10). In addition, the HME-Cu treatment had a higher pH of breast meat than the control and IN-Cu treatments (p<0.05). Significant increases in the cooking loss, water-holding capacity, and lightness in the breast were observed in the HME-Cu treatment compared to the control (p<0.05). The Cu content of excreta increased with the Cu supplementation (p<0.05). The concentration of excreta Cu in broilers was decreased in the HME-Cu compared to the IN-Cu in phase 2 (p<0.05). The Cu concentration in the liver was increased with the HME-Cu supplementation, compared with the control diets (p<0.05). Conclusion: This study showed that HME-Cu supplementation at the requirement level (16 mg/kg diets) in broiler diets did not affect the growth performance and the physiological function of Cu in broilers. However, supplementation of Cu in HME form improved the meat quality and the bioavailability of Cu.

• Bulletin of the Korean Chemical Society
• /
• 제34권12호
• /
• pp.3615-3620
• /
• 2013

Two novel copper(II) bromide complexes with pyridine containing Schiff base ligands, $Cu(pmed)Br_2$ and $Cu(pmed)Br_2$ where pmed = N'-((pyridin-2-yl)methylene)ethane-1,2-diamine (pmed) and dpmed = N,N-diethyl-N'-((pyridin-2-yl)methylene)ethane-1,2-diamine (dpmed) were synthesized and characterized using X-ray single crystal structure analysis, optical and magnetic susceptibility measurements. Crystal structural analysis of $Cu(pmed)Br_2$ showed that the copper(II) ion has a distorted square-pyramidal geometry with the trigonality index of ${\tau}=0.35$ and two intermolecular hydrogen bonds, which result in the formation of two dimensional networks in the ab plane. On the other hand, $Cu(pmed)Br_2$ displayed a near square-pyramidal geometry with the value of ${\tau}=0.06$. In both compounds, the NNN Schiff base and one Br atom occupy the basal plane, whereas the fifth apical position is occupied by the other Br atom at a greater Cu-Br apical distance. The reported complexes show $g_{\mid}$ > $g_{\perp}$ > 2.0023 with a $d_{x2-y2}$ ground state and a penta-coordinated square pyramidal geometry. Variable temperature magnetic susceptibility measurements showed that the developed copper(II) complexes follow the Curie-Weiss law, that is there are no magnetic interactions between the copper(II) ions since the Cu--Cu distance is too far for magnetic contact.

• 공업화학
• /
• 제33권6호
• /
• pp.574-580
• /
• 2022

Dendrite 형태의 구리 입자 표면을 은으로 무전해 도금을 하는 과정에서, 치환도금(displacement plating)과 화학 환원도금(reducing electroless plating)을 병용하여 다양한 silver-coated copper (Ag@Cu) 입자들을 제조하였다. Ag@Cu 입자들의 물리화학적 특성은 SEM-EDS, TGA, XPS, XRD 및 BET 등으로 분석하였으며, 환원반응에 의하여 코팅되는 은은 구리 입자 표면에 나노 입자 형태로 형성되는 것을 확인할 수 있었다. Ag@Cu 입자들을 에폭시 수지와 복합화하여 도전성 필름을 제조하고 그의 열적 안정성을 평가하였다. 치환 반응과 환원 반응의 차이가 Ag@Cu 필름의 초기 저항 및 열적 안정성에 미치는 영향에 관하여 연구하였다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.382.2-382.2
• /
• 2014

We explain a method to fabricate multi-layered transparent conductive films (TCF) using graphene oxide (GO), copper powder and polyurethane (PU) solution. The flexible graphene nanosheets (GNSs) serve as nanoscale connection between conductive copper nanoparticles (CuNps) and PU nanofibers, resulting in a highly flexible TCF. To fabricate conductive films with high transmittance, polyurethane (PU) nanofibers were used for a conductive network consisting of CuNps and GNSs (CuNps-GNSs). In this experiment, copper powder and graphene oxides were mixed in deionized water with the ultrasonication for 2 h. NaBH4 solution is used as a reduction agents of CuNps and GNSs (CuNps-GNSs) under a nitrogen atmosphere in the oil bath at 100% for 24 h to mixed. The purified and dispersed CuNp-GNS were obtained in deionized water, and diluted to a 10wt.% based on the contents of GNSs. Polyurethane (PU) nanofibers on a PET substrate were formed by electrospinning method. PET slides coated with the PU nanofibers were immersed into CuNp-GNS solution for several second, rinsed briefly in deionized water, and dried to obtain self-assembled CuNp-GNS/PU films. The morphology of the multi-layered films were characterized with a field emission scanning electron microscope (FE-SEM, Hitachi S-4700) and atomic force microscope (AFM, PSIA XE-100). The electrical property was analysed by the I-V measurement system and the optical property was measured by the UV/VIS spectroscopy.

• 공업화학
• /
• 제8권2호
• /
• pp.161-171
• /
• 1997

인쇄회로기판의 식각폐수를 전기화학적 방법을 이용하여 양극에서 이를 재생하고, 음극에서 구리를 석출하기 위한 실험을 행하였다. 양극에서의 Cu(I)의 산화에 따른 Cu(I)/Cu(II) 변화는 Pt와 Ag/AgCl/4M KCl 전극사이의 전위차를 이용하여 측정하였으며, 반응의 진행에 따른 양극에서의 염소기체 발생은 용액내에 Cu(I)의 농도를 일정치 이상으로 유지시키고, 비다공성 흑연전극을 이용하여 억제할 수 있었다. 그리고, 음극에서의 구리석출은 전류밀도 $360mA/cm^2$, 구리이온농도 12g/l 일때 가장 효율적이며 석출된 구리는 dendrite구조임을 알 수 있었다. 또한 석출효율과 회수방법을 고려할 때 음극으로서 Ti전극을 사용할 경우 가장 우수한 효율을 얻을 수 있었다. 전해온도가 증가함에 따라서 전류효율은 낮아졌으며, 전력효율은 $50^{\circ}C$에서 최대값을 나타내었다.

• Bulletin of the Korean Chemical Society
• /
• 제27권10호
• /
• pp.1572-1576
• /
• 2006

A dimeric precursor, $[Cu(dmae)(OCOCH_3)(H_2O)]_2$ for the CVD of copper metal films, (dmaeH = N,N-dimethylaminoethanol) was synthesized by the reaction of copper(II) acetate monohydrate ($Cu(OCOCH_3)_2{\cdot}H_2O$) and dmaeH in toluene. The product was characterized by m.p. determination, elemental analysis and X-ray crystallography. Molecular structure of $[Cu(dmae)(OCOCH_3)(H_2O)]_2$ shows that a dimeric unit $[Cu(dmae)(OCOCH_3)(H_2O)]_2$ is linked to another through hydrogen bond and it undergoes facile decomposition at 300 C to deposit granular copper metal film under nitrogen atmosphere. The decomposition temperature, thermal behaviour, kinetic parameters, evolved gas pattern of the complex, morphology, and the composition of the film were also investigated.

• 한국분말재료학회지
• /
• 제30권4호
• /
• pp.332-338
• /
• 2023

Thermite welding is an exceptional process that does not require additional energy supplies, resulting in welded joints that exhibit mechanical properties and conductivity equivalent to those of the parent materials. The global adoption of thermite welding is growing across various industries. However, in Korea, limited research is being conducted on the core technology of thermite welding. Currently, domestic production of thermite powder in Korea involves recycling copper oxide (CuO). Unfortunately, controlling the particle size of waste CuO poses challenges, leading to the unwanted formation of pores and cracks during thermite welding. In this study, we investigate the influence of powder particle size on thermite welding in the production of Cu-thermite powder using waste CuO. We conduct the ball milling process for 0.5-24 h using recycled CuO. The evolution of the powder shape and size is analyzed using particle size analysis and scanning electron microscopy (SEM). Furthermore, we examine the thermal reaction characteristics through differential scanning calorimetry. Additionally, the microstructures of the welded samples are observed using optical microscopy and SEM to evaluate the impact of powder particle size on weldability. Lastly, hardness measurements are performed to assess the strengths of the welded materials.

• 문화기술의 융합
• /
• 제9권6호
• /
• pp.855-859
• /
• 2023

질산구리삼수화물염(copper(II) nitrate trihydrate) 수용액을 공업용 전분(starch)에 함침 시킨 전구체를 이용하여 산화구리(CuO) 나노 입자를 합성하였다. 주사전자현미경(SEM)을 통하여 질산구리삼수화물염 수용액이 함침된 전구체에 대한 구조를 분석하였고, 전구체에 대한 열처리 온도를 증가 시킴에 따라 생성되는 산화구리 입자의 입자 크기와 결정 구조를 X선회절분석법(XRD)과 주사전자현미경(SEM)으로 분석하였다. 분석 결과에 따르면, 전구체에서 유기물질이 완전히 열분해 되어지는 온도는 450-490℃이며, 열처리하는 온도가 증가함에 따라 생성되는 산화구리 입자의 크기와 결정성이 증가하는 것을 확인할 수 있었고, 또한 500-800℃에서 1시간씩 열처리하여 얻은 산화구리 입자의 크기는 100nm-2㎛인 것으로 나타났다. 하소 온도 400℃에서 산화구리 결정상이 형성되고, 800℃까지는 산화구리 단일상만 존재하며, 하소 온도의 증가에 따라 생성되는 입자의 크기가 커지는 것을 확인하였다.

• 한국분말재료학회지
• /
• 제12권3호
• /
• pp.192-200
• /
• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.275.1-275.1
• /
• 2014

The effects of the interfacial buffer layer and temperature on the organic bulk heterojunction (BHJ) nanostructures of copper phthalocyanine (CuPc) and fullerene (C60) systems were investigated using real time in-situ x-ray scattering. In the CuPc:C60 BHJ structures, standing-on configured ${\gamma}$-CuPc phase was formed by co-deposition of CuPc and C60. Once formed ${\gamma}$-phase was thermally stable during the annealing upon $180^{\circ}C$. Meanwhile, the insertion of CuI buffer layer prior to deposition of the CuPc:C60 BHJ layer induced lying-down configured CuPc crystals in the BHJ layer. The lying CuPc peak intensity and the lattice parameter were increased by the thermal annealing. This increment of the intensity seemed to be related to the strain at the interface between CuPc:C60 and CuI, which was proportional to the enhancement of the power conversion efficiency of the device.