• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.492-495
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• 2008

Efficient top-emitting organic light-emitting diodes were fabricated using copper iodide (CuI) doped NPB as a p-doped hole injection layer to improve hole injection from a silver bottom electrode. The enhanced hole injection is originated from the formation of the charge transfer complex between CuI and NPB. The devices result in high efficiency of 69 cd/A with almost Lambertian emission pattern.

• Bulletin of the Korean Chemical Society
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• 제28권9호
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• pp.1515-1518
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• 2007

A preparative method of Me2SCuX (X = Cl, Br) via one-pot reaction was developed from common chemicals such as benzyl halide, DMSO, and Cu(0). In the reaction mixture small molecules such as methyl halide and dimethyl sulfide etc. were efficiently generated in situ, resulting in the formation of Me2SCuX. Oxidation of Cu(0) in reacting with both benzyl halide (starting material) and methyl halide (in situ generated product) to Cu(I) followed by complexing with dimethyl sulfide (in situ generated product) could explain the formation of Me2SCuX. In particular we found out that heterogeneous reaction of Me2SCuX and arenediazonium tetrafluoroborate in acetonitrile was so effective to afford corresponding bromoaromatics under mild conditions.

• Bulletin of the Korean Chemical Society
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• 제29권9호
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• pp.1811-1814
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• 2008

• Journal of the Korean Crystal Growth and Crystal Technology
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• 제6권3호
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• pp.318-326
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• 1996

This study is to investigate a chemical vapor deposition technique of copper film which is expected to be more useful as metallizations of microcircuit fabrication. An experimental equipment was designed and set-up for this study, and a Cu-precursor used that is a metal-organic compound, named (hfac)Cu(I)VTMS ; (hevaflouoroacetylacetonate trimethyvinylsilane copper). Base pressure of the experimental system is in $10^{-6}$ Torr, and the chamber pressure and the substrate temperature can be controlled in the system. Before the deposition of copper thin film, tungsten or titanium nitride film was deposited onto the silicon wafer. Helium has been used as carrier gas to control the deposition rate. As a result, deposition rate was measured as $1,800\;{\AA}/min$ at $220^{\circ}C$ which is higher than the results of previous studies, and the average surface roughness was measured as about $200\;{\AA}$. A deposition selectivity was observed between W or TiN and $SiO_{2}$ substrates below $250^{\circ}C$, and optimum results are observed at $180^{\circ}C$ of substrate temperature and 0.8 Torr of chamber pressure.

• Bulletin of the Korean Chemical Society
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• 제31권6호
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• pp.1704-1710
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• 2010

The structure of a 2D grid-like copper(II) complex [Cu$(NCO)_2$(pyz)](pyz=pyrazine) (1) consists of 1D chains of Cu-pyz units connected by double end-on (EO) cyanato bridges. Each Cu(II) ion has a distorted octahedral coordination, completed by the four EO cyanato and two pyrazine ligands. Magnetic interactions through EO cyanato and pyrazine bridges in 1 are discussed on the basis of DFT broken-symmetry calculations at the B3LYP level. For model dicopper(II) complexes I (bridged by cyanato) and II (bridged by pyrazine), electronic structure calculations reproduce very well the experimental couplings for the S = 1/2 ferromagnetic and antiferromagnetic exchange-coupled 2D system: the calculated exchange parameters J are +1.25 $cm^{-1}$ and -3.07 $cm^{-1}$ for I and II, respectively. The $\sigma$ orbital interactions between the Cu $x^2-y^2$ magnetic orbitals and the nitrogen lone-pair orbitals of pyrazine are analyzed from the viewpoint of through-bond interaction. The energy splitting of 0.106 eV between two SOMOs indicates that the superexchange interaction should be antiferromagnetic in II. On the other hand, there are no bridging orbitals that efficiently connect the two copper(II) magnetic orbitals in I because the HOMOs of the basal-apical NCO bridge do not play a role in the formation of overlap interaction pathway. The energy separation in the pair of SOMOs of I is calculated to be very small (0.054 eV). This result is consistent with the occurrence of weakly ferromagnetic properties in I.

• Asian-Australasian Journal of Animal Sciences
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• 제27권4호
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• pp.488-494
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• 2014

Twenty-eight Brangus cattle were used to determine the effect of copper and selenium supplementation on performance, feed efficiency, composition of fatty acids in Longissimus dorsi (LD) muscle, and cholesterol concentration in serum and in LD muscle and enzymes activities, reduced glutathione (GSH) and oxidized glutathione (GSSG). The treatments were: i) Control, without copper (Cu) and selenium (Se) supplementation; ii) Se, 2 mg Se/kg of dry matter such as sodium selenite; iii) Cu, 40 mg Cu/kg of dry matter such as copper sulfate; iv) Se/Cu, 2 mg Se/kg of dry matter such as sodium selenite and 40 mg Cu/kg of dry matter such as copper sulfate. LD muscle fatty acid composition was not influenced by the treatments (p>0.05). The serum concentration of cholesterol was not influenced by the treatments (p>0.05), however, the concentration of cholesterol in LD was lower in cattle supplemented with copper and selenium (p<0.05). Oxidized glutathione and reduced glutathione increased (p<0.05) with Cu, Se and Se/Cu supplementation. The supplementation of copper (40 mg/kg DM) and selenium (2 mg/kg DM) altered the metabolism of lipids in confined Brangus cattle, through a decrease in cholesterol deposition in the LD, possibly by changing the ratio between reduced glutathione/oxidized glutathione. Copper and selenium supplementation improved animal performance and feed efficiency (p<0.05) when compared to the control group, providing advantages in the production system, while also benefiting consumers by reducing cholesterol concentration in the meat.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• Korean Journal of Fisheries and Aquatic Sciences
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• 제6권1_2호
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• pp.1-19
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• 1973

Heavy metal concentrations have been determined in fishes and shellfishes sampled from October 1971 to April 1972 in Korea. In general, fish viscera, shellfish muscle and crustacean exoskeleton contained high concentrations of the metals. With regard to the regional variations of the metals, samples of the west coast of Korea contained relatively high concentrations of mercury, copper, cadmium and lead, but those of the south coast contained high levels of cadmium and lead. In particular, the concentrations of copper in the samples of the west coast were almost twice as much those of the other coasts. The concentrations of mercury in the samples, as a whole, ranged from 0.02 to 0.58 ppm with an average of 0.16 ppm. The concentrations of cadmium were higher in the fish viscera and shellfish than the fish muscle, ranging from less than 0.02 to 0.78 ppm with an average of 0.12 ppm in the fish and shellfish muscle samples. The lead concentrations were slightly high in the fish viscera. In the muscle and bone of fish and shellfish, the range was 0.06-4.84 ppm with an average of about 1 ppm. The concentrations of copper were very high in the viscera of fish and shellfish. The shellfish muscle contained almost four times as much copper as in the fish muscle, particularly cephalopods, i. e., squid and octopus, contained very high levels of copper, and oysters collected from Gunsan area on the west coast contained the highest levels of copper. The concentrations of copper ranged from 0.12 to 28.7 ppm with an average of 1.4 ppm in the fish muscle and of 5.9 ppm in the shellfish muscle.

• Journal of the Korea Institute of Military Science and Technology
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• 제21권5호
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• pp.591-598
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• 2018

The reaction characteristics of aluminum-copper(II) oxide composites initiated by the electrostatic discharge were studied as changing the aluminum particle size. Three different sizes of aluminum particles with nano-size copper(II)-oxide particle were used in the study. These composites were manufactured by two methods i.e. a shock-gel method and a self-assembly method. The larger aluminum particle size was, the less sensitive and less violent these composites were based on the electrostatic test. On the analysis of high speed camera about ignition appearances and burning time, the burning speed was faster when aluminum particle size was smaller.

• Journal of the Korean institute of surface engineering
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• 제43권6호
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.