• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.100-103
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• 2018

Due to the plasma applied from the outside, which acts as an etchant during the etching process, considerable heat is transferred to the wafer and a separate cooling process is performed to effectively remove the heat after the process. In this case, a direct cooling method using a refrigerant is suitable for cooling through effective heat exchange. The direct cooling method using the refrigerant using the latent heat exchange is superior to the cooling method using the sensible heat exchange. Therefore, in this paper, AMESim is used to design a direct refrigerant cooling system using latent heat exchange simulator was built.The constructed simulator is reliable compared with the actual experimental results. It is expected that this simulator will help to design and search for optimal process conditions.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.209-212
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• 2006

Line heating with water cooling is generally adapted process in the shipyards for the forming hull surface. The purpose of this paper is to develop a model of thermal deformation in water cooling process after the line heating. In order to simulate the cooling process, heat transfer analysis was performed by assuming the effects of water cooling as a negative heat-source. Experiment for the line heating with water cooling was performed for 9 models of plates in order to verify the cooling model. By using the suggested model for the water cooling process, it could be observed that the present method predict the plate deformations in the line heating more accurately.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.106-110
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• 2017

Due to the plasma applied from the outside, which acts as an etchant during the etching process, considerable heat is transferred to the wafer and a separate cooling process is performed to effectively remove the heat after the process. In this case, a direct cooling method using a refrigerant is suitable for cooling through effective heat exchange. The direct cooling method using the refrigerant using the latent heat exchange is superior to the cooling method using the sensible heat exchange. Therefore, in this paper, AMESim is used to design a direct refrigerant cooling system using latent heat exchange simulator was built.The constructed simulator is reliable compared with the actual experimental results. It is expected that this simulator will help to design and search for optimal process conditions.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.11
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• pp.1267-1273
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• 2009

Hot press forming can produce high-strength components by rapidly cooling between closed punch and die after hot forming using quenchable boron steel austenized in a furnace. In the hot press forming process, the cooling rate is influenced by the size, position and arrangement of the cooling channel and the file condition of cooling water in the die. Also, mechanical properties of the final components and operation time are related to cooling rate. Therefore, the design of optimized cooling channel is one of the most important works. In this paper, the effect of position and size of the cooling channel on the cooling rate was investigated by using design of experiment and FE analysis in hot press bending process. Therefore the optimum cooling channel ratio was presented in the HPB.

• Transactions of Materials Processing
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• v.19 no.4
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• pp.203-209
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• 2010

In the hot press forming process (HPF), a martensitic structure is obtained by controlling the cooling rate when cooling a boron sheet that is heated up to over $900^{\circ}C$. The HPF process has various advantages such as the improvement in formability and material properties and minimal spring back of the deformed materials. The factors related to the cooling rate depend on the heat transfer characteristics between heated materials and dies. Therefore, in this study, the cooling rate is controlled by adjusting the heat transfer coefficient of the material at the pressing process. And, the mechanical properties and microstructure of the deformed material is demonstrated during the HPF process where cold dies are used to form the heated steel plate. This is achieved by varying the major forming conditions that control the cooling rate regarded as the most important process parameter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.185-188
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• 1997

The influence of slow cooling and annealing time in $O_2$ during melting and growth step in MPMG process on J$_{c}$ was investigated. Through the measurement of J$_{c}$ SEM and XRD, it can be observed that the critical characteristics were related with the slow cooling time and annealing time in 02 for melting and growth step of MPMG process. The distribution of critical current density with slow cooling time was the porabolic form and the value of J. was the highest at the 40 hour slow cooling time. And also, the value of J$_{c}$, along the annealing time in $O_2$ in the case of the slow cooling time 40 hour was inclined to increase with annealing time. Consequently, it can be suggested that proper slow cooling titre and annealing time along slow cooling in MPMG process be important to improve the critical characteristics.stics.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.1
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• pp.63-72
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• 2011

In recent years, hot-stamped components are more increasingly used in the automotive industry in order to reduce weight and to improve the strength of vehicles. In hot stamping process, blank is hot formed and press hardened in a tool. However, in hot stamping without cooling channel, temperature of the tool increases gradually in mass production thus cannot meet the critical cooling rate to obtain high strength over 1500MPa. Warpage occurs in the hot stamped component due to non-uniform stress state caused by unbalanced cooling. Therefore, tools should be uniformly as well as rapidly cooled down by the coolant which flows through cooling channel. In this paper, optimal design method of cooling channel to obtain uniform and high strength of the component is proposed. Optimized cooling channel is applied to the hot press V-bending process. As a result of measuring strength, hardness and microstructure of the hot formed parts, it is known that the design methodology of cooling channel is effective to the hot stamping process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.121-128
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• 2012

The optimization of cooling system parameters for designing injection mold is very important to acquire the highest part quality. In this paper, the integration of computer simulations of injection molding and Analysis of Variance(ANOVA) with orthogonal array was used as a design tool to optimize the cooling system parameters aimed at minimizing the part warpage. The design optimizer was applied to find the optimum levels of cooling system parameters for a dustpan. This optimization resulted in more uniform temperature distribution over the part and significant reduction of a part warpage, showing the capability of present method as an effective design tool. The whole optimization process was performed systematically in a proper number of cooling simulations. The design optimizer can be utilized effectively in the industry practice for designing mold cooling system with less cost and time.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.11
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• pp.103-108
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• 2019

The cooling rate and the uniformity of mold temperature, in the injection molding process, possess great influences on the productivity and quality of replications. The conformal cooling channel, which is of a uniform spacing from the mold cavity by the metal additive manufacturing process, receives much attention recently. The purpose of this study is to develop a mold core with a curved conformal cooling channel for a pottery-shaped thick-wall cosmetic container through the hybrid method of direct metal tooling (DMT) process. In this study, we design a mold core that contains the curved cooling channel for the container. A method that divides the cavity is proposed and the DMT process is carried out to form the curved cooling channel. The test mold core, with the curved conformal cooling channel, has been fabricated by the proposed method to confirm the feasibility of the design concept. We show that no leakage is observed for the additive manufactured test mold core, and its physical properties demonstrate that it can be sufficiently used as the injection mold core.