Abstract
Due to the plasma applied from the outside, which acts as an etchant during the etching process, considerable heat is transferred to the wafer and a separate cooling process is performed to effectively remove the heat after the process. In this case, a direct cooling method using a refrigerant is suitable for cooling through effective heat exchange. The direct cooling method using the refrigerant using the latent heat exchange is superior to the cooling method using the sensible heat exchange. Therefore, in this paper, AMESim is used to design a direct refrigerant cooling system using latent heat exchange simulator was built.The constructed simulator is reliable compared with the actual experimental results. It is expected that this simulator will help to design and search for optimal process conditions.
