• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.9
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• pp.717-723
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• 2009

Ni/Al ('/' denotes deposition sequence) contacts were deposited on Al-implanted 4H-SiC for ohmic contact formation, and the conduction properties were characterized and compared with those of Ni-only contacts. The thicknesses of the Ni and Al thin film were 30 nm and 300 nm, respectively, and the films were sequentially deposited bye-beam evaporation without vacuum breaking. Rapid thermal anneal (RTA) temperature was varied as follows : $840^{\circ}C$, $890^{\circ}C$, and $940^{\circ}C$. The specific contact resistivity of the Ni contact was about $^{\sim}2\;{\pm}\;10^{-2}\;{\Omega}{\cdot}cm^2$, However, with the addition of Al overlayer, the specific contact resistivity decreased to about $^{\sim}2\;{\pm}\;10^{-4}\;{\Omega}{\cdot}cm^2$, almost irrespective of RTA temperature. X-ray diffraction (XRD) analysis of the Ni contact confirmed the existence of various Ni silicide phases, while the results of Ni/Al contact samples revealed that Al-contaning phases such as $Al_3Ni$, $Al_3Ni_2$, $Al_4Ni_3$, and $Ab_{3.21}Si_{0.47}$ were additionally formed as well as the Ni silicide phases. Energy dispersive spectroscopy (EDS) spectrum showed interfacial reaction zone mainly consisting of Al and Si at the contact interface, and it was also shown that considerable amounts of Si and C have diffused toward the surface. This indicates that contact resistance lowering of the Ni/Al contacts is related with the formation of the formation of interfacial reaction zone containing Al and Si. From these results, possible mechanisms of contact resistance lowering by the addition of Al were discussed.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1917-1921
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• 2008

Ultraviolet-nanoimprint lithography (UV-NIL) is promising technology for cost effectively defining micro/nano scale structure at room temperature and low pressure. In addition, this technology is fascinating because of it's possibility for high-throughput patterning without complex processes. However, to acquire good micro/nano patterns using this technology, there are some challenges such as uniformity and fidelity of patterns, etc. In this paper, we have focused on uniform contact mechanism and performed contact mechanics analysis. The dimension of the flexible sheet to get adequate uniform contact area has been obtained from contact mechanics simulation. Based on this analysis, we have made a uniform pressurizing device and confirmed its uniform pressurized zone using a pressure sensing paper.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.71-76
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• 2005

The defects evaluation of the interior and the surface would be considered as vital characteristics in predicting the total life span of the steel structure. More importantly, the understandings in the interior composite of welding zone and the notifications in the presence, the formation, and the positioning of the non-metallic inclusion are necessary as well, since there were signs of relatively high defect frequency presented in the welding zone. The ultrasonic testing is a highly recommended technique chosen from among other techniques because of variety of advantages in conducting the non-destructive testing for the welding zone. However, the ultrasonic testing had technical disadvantages referred as followings; the problems due to the couplant between the PZT and the specimen, the formations that were miniature and complex, the moving subject, and the high temperature surrounding the specimen. This research was conducted to resolve the technical disadvantages of the contact ultrasonic testing by studying the non-contact ultrasonic testing where the ultrasonic waves were transferred by the laser, and revealing the specimen defects at its interior part and its surface part. The ultimate goal of this research was to develop a non-destructive evaluation applying the laser manipulated ultrasonic method for the steel structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.577-580
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• 2003

Stress state of chip formation zone is one of the main problems in metal cutting mechanics. In two-dimensional case this process is usually considered as consistent shears of work material along single of several shear surfaces. separating chip from workpiece. These shear planes are assumed to be trajectories of maximum shear stress forming corresponding slip-line field. This paper suggests new approach to the constriction of slip-line field, which Implies uniform compression in chip formation zone. On the base of given model it has been found that imaginary shear line in orthogonal cutting is close to the trajectory of maximum normal stress and the problem about its determination have been considered. It has been shown that there is a second central slip-line field inside chip, which corresponds well to experimental data about stress distribution on tool rake face and tool-chip contact length. The suggested model could be useful in solution of various problems of machining.

• Geomechanics and Engineering
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• v.21 no.6
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• pp.571-582
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• 2020

Aiming at the mechanical and structural characteristics of the contact zone composite rock, the uniaxial compression tests and numerical studies were carried out. The interaction forms and formation mechanisms at the contact interfaces of different materials were analyzed to reveal the effect of interaction on the mechanical behavior of composite samples. The research demonstrated that there are three types of interactions between the two materials at the contact interface: constraint parallel to the interface, squeezing perpendicular to the interface, and shear stress on the interface. The interaction is mainly affected by the differences in Poisson's ratio and elastic modulus of the two materials, stronger interface adhesion, and larger interface inclination. The interaction weakens the strength and stiffness of the composite sample, and the magnitude of weakening is positively correlated with the degree of difference in the mechanical properties of the materials. The tensile-shear stress derived from the interaction results in the axial tensile fracture perpendicular to the interface and the interfacial shear facture. Tensile cracks in stronger material will propagation into the weaker material through the bonded interface. The larger inclination angle of the interface enhances the effect of composite tensile/shear failure on the overall sample.

• Journal of Mechanical Science and Technology
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• v.16 no.8
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• pp.1117-1126
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• 2002

A conducting crack in an electrostrictive ceramic under combined electric and mechanical loading is investigated. Analysis based on linear dielectric model predicts that the surfaces of the crack are not open completely but they are contact near the crack tip. The complete solution for the crack with a contact zone in a linear electrostrictive ceramic under combined electric and mechanical loading is obtained by using the complex variable formula. The asymptotic problems for a semi-infinite crack with a partial opening zone as well as for a fully open semi-infinite crack in a nonlinear electrostrictive ceramic are analyzed in order to investigate the effect of the electrical nonlinearity on the stress intensity factor under small scale nonlinear conditions. Particular attention is devoted to a finite crack in the nonlinear electrostrictive ceramic subjected to combined electric and mechanical loading. The stress intensity factor for the finite crack under small scale nonlinear conditions is obtained from the asymptotic analysis.

• Transactions of Materials Processing
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• v.14 no.4 s.76
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• pp.375-383
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• 2005

The shear spinning process, where the plastic deformation zone is localized in a very small portion of the workpiece, shows a promise for increasingly broader application to the production of axially symmetric parts. In this paper, the three components of the working force are calculated by a newly proposed deformation model in which the spinning process is understood as shearing deformation after uniaxial yielding by bending, and shear stress, $\tau_{rz}$, becomes k, yield limit in pure shear, in the deformation zone. The tangential force are first calculated and the feed force and the normal force are obtained by the assumption of uniform distribution of roller pressure on the contact surface. The optimum contact area is obtained by minimizing the bending energy required to get the assumed deformation of the blank. The calculated forces are compared with experimental results. A comparison shows that theoretical prediction is reasonably in good agreement with experimental results

• Journal of Welding and Joining
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• v.20 no.2
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• pp.71-76
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• 2002

Currently knowledge of strain in welds has mainly been obtained from strain gage method; that is directly attaching the gage to the most of the material. The very flew non-contact methods are still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. The paper is on the measurement of the strain caused by the characteristics and the temperature changes of the GTA welded zone employed with 3D ESPI system that is functionally modified through the laser ESPI system. This system may be applied the steel plate such as for the electronics, chemistry, flood instrument and electronic appliances.