• The Journal of Advanced Prosthodontics
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• v.10 no.3
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• pp.197-204
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• 2018

PURPOSE. To determine the extent of treatment traces, the roughness depth, and the quantity of titanium nitride (TiN) removed from the surface of CAD/CAM abutments after treatment with various instruments. MATERIALS AND METHODS. Twelve TiN coated CAD/CAM abutments were investigated for an in vitro study. In the test group (9), each abutment surface was subjected twice (150 g vs. 200 g pressure) to standardized treatment in a simulated prophylaxis measure with the following instruments: acrylic scaler, titanium curette, and ultrasonic scaler with steel tip. Three abutments were used as control group. Average surface roughness (Sa) and developed interfacial area ratio (Sdr) of treated and untreated surfaces were measured with a profilometer. The extent of treatment traces were analyzed by scanning electron microscopy. RESULTS. Manipulation with ultrasonic scalers resulted in a significant increase of average surface roughness (Sa, P<.05) and developed interfacial area ratio (Sdr, P<.018). Variable contact pressure did not yield any statistically significant difference on Sa-values for all instruments (P=.8). Ultrasonic treatment resulted in pronounced surface traces and partially detachment of the TiN coating. While titanium curettes caused predominantly moderate treatment traces, no traces or detectable substance removal has been determined after manipulation with acrylic curettes. CONCLUSION. Inappropriate instruments during regular plaque control may have an adverse effect on the integrity of the TiN coating of CAD/CAM abutments. To prevent defects and an increased surface roughness at the transmucosal zone of TiN abutments, only acrylic scaling instruments can be recommended for regular maintenance care.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.5
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• pp.607-619
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• 1999

Cortical support is an important factor, as the engagement of the fixture in strong compact bone offers an increased load-carrying capacity and initial stability. Because of the poor bone quality in the posterior mandible and other anatomic considerations, it has been suggested that implant fixtures be placed in these locations with apical engagement of the lingual cortical plate for so-called bicortication. The purpose of this investigation was to determine the effect of cortical engagements and in addition polyoxymethylene(POM) intramobile connector(IMC) of IMZ implant on implant load transfer in edentulous posterior segment of mandible, using three-dimensional (3D) finite element analysis models composed of cortical and trabecular bone involving single implant. Variables such as (1) the crestal peri-implant defect, (2) the apical engagement of lingual cortical plate, (3) the occlusal contact position (a vertical load at central fossa or buccal cusp tip), and (4) POM IMC were investigated. Stress patterns were compared and interfacial stresses along the bone-implant interface were monitored specially. Within the scope of this study, the following observations were made. 1) Offset load and angulation of fixture led to increase the local interfacial stresses. 2) Stresses were concentrated toward the cortical bones, but the crestal peri-implant defect increased the interfacial stresses in trabecular bone. 3) For the model with bicortication, it was noticed that the crestal cortical bone provided more resistance to the bending moment and the lingual cortical plate provided more support for the vertical load. But Angulation problem of the fixture from the lingual cortical engagement caused the local interfacial stress concentrations. 4) It was not clear that POM IMC had the effect on stress distribution under the present experimental conditions, especially for the cases of crestal peri-implant defect.

• The korean journal of orthodontics
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• v.47 no.4
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• pp.238-247
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• 2017

Objective: The aim of this study was to compare recycled and unused orthodontic miniscrews to determine the feasibility of reuse. The comparisons included both miniscrews with machined surfaces (MS), and those with etched surfaces (ES). Methods: Retrieved MS and ES were further divided into three subgroups according to the assigned recycling procedure: group A, air-water spray; group B, mechanical cleaning; and group C, mechanical and chemical cleaning. Unused screws were used as controls. Scanning electron microscopy, energy-dispersive X-ray spectrometry, insertion time and maximum insertion torque measurements in artificial bone, and biological responses in the form of periotest values (PTV), bone-implant contact ratio (BIC), and bone volume ratio (BV) were assessed. Results: Morphological changes after recycling mainly occurred at the screw tip, and the cortical bone penetration success rate of recycled screws was lower than that of unused screws. Retrieved ES needed more thorough cleaning than retrieved MS to produce a surface composition similar to that of unused screws. There were no significant differences in PTV or BIC between recycled and unused screws, while the BV of the former was significantly lower than that of the latter (p < 0.05). Conclusions: These results indicate that reuse of recycled orthodontic miniscrews may not be feasible from the biomechanical aspect.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1053-1061
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• 2015

This paper discusses the analysis of the curl deformation behavior when a dynamic force is applied to a tearing tube installed on a flat die to predict the energy absorption capacity and deformation behavior. The deformation of the tips of the curling strips was obtained when the curl tips and tube body are in contact with each other, and a formula describing the energy dissipation rate caused by the deformation of the curl tips is proposed. To improve this formula, we focused on the variation of the curl radius and the reduced thickness of the tube. A formula describing the mean curl radius is proposed and verified using the curl radius measurement data of collision test specimens. These improved formulas are added to the theoretical model previously proposed by Huang et al. and verified from the collision test results of a tearing tube.

• Journal of the Ergonomics Society of Korea
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• v.29 no.2
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• pp.203-210
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• 2010

For the development of a better product which fits to the target user population, physical workloads such as reach and visibility are evaluated using digital human simulation in the early stage of product development; however, ergonomic workload assessment mainly relies on visual observation of reach envelopes and view cones generated in a 3D graphic environment. The present study developed a quantitative assessment method of physical workload in a digital environment and applied to the evaluation of a Korean utility helicopter (KUH) cockpit design. The proposed assessment method quantified physical workloads for the target user population by applying a 3-step process and identified design features requiring improvement based on the quantified workload evaluation. The scores of physical workloads were quantified in terms of posture, reach, visibility, and clearance, and 5-point scales were defined for the evaluation measures by referring to existing studies. The postures of digital humanoids for a given task were estimated to have the minimal score of postural workload by finding all feasible postures that satisfy task constraints such as a contact between the tip of the index finger and a target point. The proposed assessment method was applied to evaluate the KUH cockpit design in the preliminary design stage and identified design features requiring improvement. The proposed assessment method can be utilized to ergonomic evaluation of product designs using digital human simulation.

• The Journal of the Korea Contents Association
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• v.11 no.10
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• pp.1-10
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• 2011

In this paper, we proposed the skin color based hand and finger detection technology for the gesture recognition in CCTV surveillance. The aim of this paper is to present the methodology for hand detection and propose the finger detection method. The detected hand and finger can be used to implement the non-contact mouse. This technology can be used to control the home devices such as home-theater and television. Skin color is used to segment the hand region from background and contour is extracted from the segmented hand. Analysis of contour gives us the location of finger tip in the hand. After detecting the location of the fingertip, this system tracks the fingertip by using only R channel alone, and in recognition of hand motions to apply differential image, such as the removal of useless image shows a robust side. We explain about experiment which relates in fingertip tracking and finger gestures recognition, and experiment result shows the accuracy above 96%.

• International Journal of Korean Welding Society
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• v.2 no.2
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• pp.19-25
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• 2002

In recent years, techniques for micro-assembly with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. It is also known that adhesional force between micro-objects exposed to Electron Beam irradiation of SEM increases with the elapsed time. Therefore, mechanical manipulation techniques using a needle-shaped tool by adhesional force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these could not have been supported theoretically. Some techniques even need the process of trial-and-error. Thus, in this paper, mechanical and adhesional micro-manipulation are analyzed theoretically by introducing new physical factors, such as adhesional force and rolling-resistance, into the kinematic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, they are revealed that how the micro-sphere behavior depends on the given conditions, and that it is possible to cause the fracture of the desired contact Interfaces selectively by controlling the force direction in which the tool-tip loads to the sphere. Based on the acquired knowledge, a mode diagram, which indicates the micro-sphere behavior for the given conditions, is designed. By referring to this mode diagram, the practical technique of the pick and place manipulation of a micro-sphere under an SEM by the selective interface fracture is proposed.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.9
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• pp.1605-1614
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• 1992

The effects of % overload (% O.L), baseline stress intensity factor range (.DELTA. $K_{b}$) and dimension-less crack depth (a/W) are examined for the retardation behaviors after a single overload and high-low block loads in 7075-T73 aluminum alloy. And wheeler model, which is one of the fatigue life prediction models, is modified to predict retardation life using these test results. The retardation cycles( $N_{d}$) increased with a decrease in a/W and an increase in % O.L. and (.DELTA. $K_{b}$) These effects are more severe after high-low block loads than single overload. In the case of single overload, the main mechanisms of the retardation are the crack closure and the relaxation of K due to crack branching. But in the case of high-low block loads, that of the main mechanism is the crack closure caused by the accumulated compressive residual stree at the crack tip, which is related with the contact of fracture surfaces. Test results were multiple regression analyzed and got regressed shaping correction factors, (n)$_{REG}$, as function of %O.L., a/W and (.DELTA. $K_{b}$) Wheeler model is modified by using these (n)$_{REG}$. The number of delay cycles calculated by modified Wheeler model were in good agreement with the test results of this study.y.udy.y.y.y.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.466-466
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• 2011

There have been several methods to fabricate carbon nanotube (CNT) emitters, which include as-grown, spraying, screen-printing, electrophoresis and bonding methods. Unfortunately, these techniques generally suffer from two main problems. One is a weak mechanical adhesion between CNTs and the cathode. The as-grown, spraying and electrophoresis methods show a weak mechanical adhesion between CNTs and the cathodes, which induces CNT emitters pulled out under a high electric field. The other is a severe degradation of the CNT tip due to organic binders used in the fabrication process. The screen-printing method which is widely used to fabricate CNT emitters generally shows a critical degradation of CNT emitters caused by the organic binder. Such kinds of problems induce a short lifetime of the CNT field emitters which may limit their practical applications. Therefore, a robust CNT emitter which has the strong mechanical adhesion and no degradation is still a great challenge. Here, we introduce a simple and effective technique for fabrication of CNT field emitter, namely filtration-taping-transfer method. The CNT emitters fabricated by the filtration-taping-transfer method show the low turn-on electric fields, the high emission current, good uniformity and good stability. The enhanced emission performance of the CNT emitters is mainly attributed to high emission sites on the emitter area, and to good ohmic contact and strong mechanical adhesion between the emitters and cathodes. The CNT emitters using a simple and effective fabrication method can be applied for various field emission applications such as field emission displays, lamps, e-beam sources, and x-ray sources. The detail fabrication process will be covered at the poster.