• Nuclear Engineering and Technology
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• 제52권4호
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• pp.734-741
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• 2020

A new air-cooled waste heat removal system with a direct contact heat exchanger was designed for SMRs requiring 200 MW of waste heat removal. Conventional air-cooled systems use fin structure causing high thermal resistance; therefore, a large cooling tower is required. The new design replaces the fin structure with a vertical string type direct contact heat exchanger which has the most effective performance among tested heat exchangers in a previous study. The design results showed that the new system requires a cooling tower 50% smaller than that of the conventional system. However, droplet formation on a falling film along a string caused by Rayleigh-Plateau instability decreases heat removal performance of the new system. Analysis of Rayleigh-Plateau instability considering drag force on the falling film surface was developed. The analysis results showed that the instability can be prevented by providing thick string. The instability is prevented when the string radius exceeds the capillary length of liquid by a factor of 0.257 under stagnant air and 0.260 under 5 m/s air velocity.

• 한국기계가공학회지
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• 제15권3호
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• pp.36-43
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• 2016

Carbon fiber-reinforced silicon carbide (Cf-SiC) and SiC / SiC composites have high thermal conductivity, and excellent corrosion and wear resistance, a low coefficient for thermal expansion and are lightweight. This is why they are commonly used in parts of the aerospace industry to develop an aircraft thrust deflector, jet vane, combustion chamber, elevens, body flap, and a shingle. So, understanding how this state-of-the-art Cf-SiC affects both internal and external crack detection and determining issues during the manufacturing process of composite materials, should be evaluated according to valuation techniques in the external environment. In this paper, we apply a non-contact air ultrasonic technique of non-destructive testing techniques to perform a study on internal defect detection identification and assessment of carbon-fiber reinforced silicon carbide composites to perform basic research and applied research.

• 에너지공학
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• 제8권2호
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• pp.272-278
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• 1999

본 연구에서는 지름 30mm, 길이 45mm인 brass와 aluminium 원통 실린더의 접촉면이 ⅰ) 진공 상태에 있을 때 , ⅱ) silicone grease를 충전하였을 때 , ⅲ) silicone grease와 aluminium 분말 (#325) 혼합물을 충전하였을 때의 열접촉저항을 측정하였고, 그 결과를 Fouche 의 해석 모델과 비교하였다. 진공상태에서 비접촉면의 열접촉저항은 표면의 가공 상태에 따라 (2~100)$\times$$10^{-5}$($m^2$$^{\circ}C$/W)의 분포를 나타내었고 접촉 표면을 연마하였을 때에는 거친 표면에 비하여 약 30~50%의 열접촉저항저감을 나타내었다. 그러나, silicone grease를 충전했을 때에는 열접촉저항 값이 약 5~10정도 감소하는 경향을 나타내었다. Fouche 모델을 이용한 해석 결과는 silicone grease로 충전한 접촉면에 대해서 각 10~30%범위에서 아주 잘 일치하였다.

• 전자공학회논문지A
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• 제28A권10호
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• pp.814-820
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• 1991

TaSi$_2$ was formed by rapid thermal annealing(RTA) on BF$_2$ doped single crystalline silicon substrates. The formation and various properties of TaSi$_2$ have been investigated by using 4-point probe, HP414, XRD, and SEM. And the redistribution of boron with RTA has been observed by SIMS. Implanted boron was diffused out into the TaSi$_2$ for RTA temperature but did not significantly affect the formation temperature of TaSi$_2$. Also, the contact resistance for TaSi$_2$/p$^{+}$ region had a low value 22$\Omega$, at contact size of 0.9$\mu$m, and the native oxide formed on Si-substrates by BF$_2$ implantation retarded the formation of TaSi$_2$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.243-247
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• 2003

The effect of accelerated weathering(UV) on three type of ethylene propylene diene monomer(EPDM) composite used for higher voltage insulator were investigated by weather-emoter. For weatherability of EPDM composite, surface resistance, dielectric breakdown strength, change of contact angle, surface composition were measured according to UV accelerated weathering time. From the resort of the measurement of surface resistivity, contact angle of EPDM composite decreased and showed chalking and cracking phenomenon when UV weathweing time was for 1500 h and 2000 h. The analysis of surface atomic composition indicated that surface aluminiu(Al) content was detected due to chalking phenomenon after 1500 h of UV weathering, Oxygen content of all composite increased due to the oxidation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• International Journal of Air-Conditioning and Refrigeration
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• 제13권2호
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• pp.99-106
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• 2005

Falling film heat transfer has been widely used in many applications in which heat and mass transfer occur simultaneously, such as evaporative coolers, cooling towers, absorption chillers, etc. In such cases, it is desirable that the falling film spreads widely on the surface to form a thin liquid film to enlarge contact surface and to reduce the thermal resistance across the film and/or the flow resistance to the vapor stream over the film. In this respect, hydrophilic treatment of the surface has been tried to improve the surface wettability by decreasing the contact angle between the liquid and the surface. However, the hydrophilic treatment was found not very effective to increase the surface wettedness of inclined surfaces, since the liquid flow forms rivulet patterns instead of a thin film as it flows down the inclined surface and accelerates gradually by the gravity. In this work, a novel method is suggested to improve the surface wettedness enormously. In this work, the surface is treated to have a thin hydrophilic porous layer on the surface. With this treatment, the liquid can spread widely on the surface by the capillary force resulting from the porous structure. In addition to this, the liquid can be held within the porous structure to improve surface wettedness regardless of the surface inclination. The experiment on the evaporative cooling of inclined surfaces has been conducted to verify the effectiveness of the surface treatment. It is measured that the latent heat transfer increases almost by $80\%$ at the hydrophilic porous layer coated surface as compared with the untreated surface.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.490.2-490.2
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• 2014

Since the general solar cells accept sun light at the front side, excluding the electrode area, electrons move from the emitter to the front electrode and start to collect at the grid edge. Thus the edge of gridline can be important for electrical properties of screen-printed silicon solar cells. In this study, the improvement of electrical properties in screen-printed crystalline silicon solar cells by contact treatment of grid edge was investigated. The samples with $60{\Omega}/{\square}$ and $70{\Omega}/{\square}$ emitter were prepared. After front side of samples was deposited by SiNx commercial Ag paste and Al paste were printed at front side and rear side respectively. Each sample was co-fired between $670^{\circ}C$ and $780^{\circ}C$ in the rapid thermal processing (RTP). After the firing process, the cells were dipped in 2.5% hydrofluoric acid (HF) at room temperature for various times under 60 seconds and then rinsed in deionized water. (This is called "contact treatment") After dipping in HF for a certain period, the samples from each firing condition were compared by measurement. Cell performances were measured by Suns-Voc, solar simulator, the transfer length method and a field emission scanning electron microscope. According to HF treatment, once the thin glass layer at the grid edge was etched, the current transport was changed from tunneling via Ag colloids in the glass layer to direct transport via Ag colloids between the Ag bulk and the emitter. Thus, the transfer length as well as the specific contact resistance decreased. For more details a model of the current path was proposed to explain the effect of HF treatment at the edge of the Ag grid. It is expected that HF treatment may help to improve the contact of high sheet-resistance emitter as well as the contact of a high specific contact resistance.