• Title/Summary/Keyword: Contact diameter

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Finite element analysis on the connection types of abutment and fixture (수종의 내부연결형 임플란트에서 연결부의 형태에 따른 응력분포의 유한요소 분석)

  • Jung, Byeong-Hyeon;Lee, Gyeong-Je;Kang, Dong-Wan
    • The Journal of Korean Academy of Prosthodontics
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    • v.50 no.2
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    • pp.119-127
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    • 2012
  • Purpose: This study was performed to compare the stress distribution pattern of abutment-fixture connection area using 3-dimensional finite element model analysis when 5 different implant systems which have internal connection. Materials and methods: For the analysis, a finite element model of implant was designed to locate at first molar area. Stress distribution was observed when vertical load of 200 N was applied at several points on the occlusal surfaces of the implants, including center, points 1.5 mm, 3.0 mm away from center and oblique load of 200 N was applied $30^{\circ}$ inclined to the implant axis. The finite element model was analyzed by using of 3G. Author (PlassoTech, California, USA). Results: The DAS tech implant (internal step with no taper) showed more favorable stress distribution than other internally connected implants. AS compare to the situations when the loading was applied within the boundary of implants and an oblique loading was applied, it showed higher equivalent stress and equivalent elastic strain when the loading was applied beyond the boundary of implants. Regardless of loading condition, the abutments showed higher equivalent stress and equivalent elastic strain than the fixtures. Conclusion: When the occlusal contact is afforded, the distribution of stress varies depending on the design of connection area and the location of loading. More favorable stress distribution is expected when the contact load was applied within the diameter of fixtures and the DAS tech implant (internal step with no tapering) has more benefits than the other design of internally connected implants.

Effect of metal conditioner on bonding of porcelain to cobalt-chromium alloy

  • Minesaki, Yoshito;Murahara, Sadaaki;Kajihara, Yutaro;Takenouchi, Yoshihisa;Tanaka, Takuo;Suzuki, Shiro;Minami, Hiroyuki
    • The Journal of Advanced Prosthodontics
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    • v.8 no.1
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    • pp.1-8
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    • 2016
  • PURPOSE. The purpose of this study was to evaluate the efficacy of two different metal conditioners for non-precious metal alloys for the bonding of porcelain to a cobalt-chromium (Co-Cr) alloy. MATERIALS AND METHODS. Disk-shaped specimens ($2.5{\times}10.0mm$) were cast with Co-Cr alloy and used as adherend materials. The bonding surfaces were polished with a 600-grid silicon carbide paper and airborne-particle abraded using $110{\mu}m$ alumina particles. Bonding specimens were fabricated by applying and firing either of the metal conditioners on the airborne-particle abraded surface, followed by firing porcelain into 5 mm in diameter and 3 mm in height. Specimens without metal conditioner were also fabricated. Shear bond strength for each group (n=8) were measured and compared (${\alpha}=.05$). Sectional view of bonding interface was observed by SEM. EDS analysis was performed to determine the chemical elements of metal conditioners and to determine the failure modes after shear test. RESULTS. There were significant differences among three groups, and two metal conditioner-applied groups showed significantly higher values compared to the non-metal conditioner group. The SEM observation of the sectional view at bonding interface revealed loose contact at porcelain-alloy surface for non-metal conditioner group, however, close contact at both alloy-metal conditioner and metal conditioner-porcelain interfaces for both metal conditioner-applied groups. All the specimens showed mixed failures. EDS analysis showed that one metal conditioner was Si-based material, and another was Ti-based material. Si-based metal conditioner showed higher bond strengths compared to the Ti-based metal conditioner, but exhibited more porous failure surface failure. CONCLUSION. Based on the results of this study, it can be stated that the application of metal conditioner is recommended for the bonding of porcelain to cobalt-chromium alloys.

Preparation of PMSQ/TiO2 Composite Fine Powder by Sol-Gel Process (Sol-Gel Process를 이용한 PMSQ/TiO2 복합 미립자의 합성)

  • Lee, Dong Hyun;Koo, Sangman
    • Applied Chemistry for Engineering
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    • v.9 no.5
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    • pp.634-638
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    • 1998
  • Monodisperse, spherical $PMSQ/TiO_2$ composite fine powders were prepared by modified sol-gel process where 300 nm $TiO_2$ fine powders were used as seed particles for hetero-condensation with hydrolyzed MTMS (Methyltrimethoxysilane). The reaction was carried out under $N_2$ atmosphere at ambient temperature using $NH_3$ as a catalyst. Methanol was used as a solvent. Powder was obtained by the filtration of the solution with a glass filter and washing with acetone. The stirring rate, reaction temperature, $[H_2O]/[MTMS]$ and $[MTMS]/[TiO_2]$ ratio were varied to investigate shapes and sizes of particles. Monodisperse particles of $1-2{\mu}m$ diameter were obtained with [MTMS]=0.2 M, $[NH_3]=0.6M$, $[H_2O]/[MTMS]=100$, $[MTMS]/[TiO_2]=10-50$ at ambient temperature with mild stirring condition. These composite particles had a contact angle of almost 180 degree contact angle with water, which proves their excellent hydrophobicity. The study of UV absorption spectra showed that they have UV protecting effect.

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Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly (유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석)

  • Lee, Jae Hak;Song, Jun-Yeob;Kim, Seung Man;Kim, Yong Jin;Park, Ah-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.2
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    • pp.31-43
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    • 2019
  • In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

Theoretical and experimental studies on influence of electrode variations in electrical resistivity survey for tunnel ahead prediction (터널 굴착면 전방조사를 위한 전기비저항 탐사에서 전극의 변화가 미치는 영향에 대한 이론 및 실험연구)

  • Hong, Chang-Ho;Chong, Song-Hun;Hong, Eun-Soo;Cho, Gye-Chun;Kwon, Tae-Hyuk
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.21 no.2
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    • pp.267-278
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    • 2019
  • Variety of tunnel ahead prediction methods have been performed for safe tunnel construction during tunnel excavation. Pole-pole array among the electrical resistivity survey, which is one of the tunnel ahead prediction method, has been utilized to predict water-bearing sediments or weak zone located within 5 times of tunnel diameter. One of the most important processes is the estimation of virgin ground resistivity and it can be obtained from the following process: 1) calculation of contact area between the electrodes and the medium, and 2) assumption of the electrodes as equivalent spherical electrodes which have a same surface area with the electrodes. This assumption is valid in a small contact area and sufficient distance between the electrodes. Since the measured resistance, in general, varies with the electrode size, shape, and distance between the electrodes, it is necessary to evaluate the influence of these factors. In this study, theoretical equations were derived and experimental tests were conducted considering the electrode size, shape, and distance of cylindrical electrodes which is the most commonly utilized electrode shape. Through this theoretical and experimental study, it is known that one should be careful to use the assumption of the equivalent half-spherical electrode with large ratio between the penetrated depth and radius of the cylindrical electrode, as the error may get larger.

A Study on Strength and Durability Characteristics of Cemented Weathered Mudstone (풍화 이암 고결토의 강도 및 내구성 특성에 관한 연구)

  • Kim, Seong-Heon;Moon, Hong-Duk;Park, Sung-Sik
    • Journal of the Korean Geotechnical Society
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    • v.35 no.10
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    • pp.33-45
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    • 2019
  • In this study, in order to recycle a large amount of rocks and weathered mudstones produced by civil engineering projects such as railways and highways, as materials for roadbeds or embankment materials, circumferential specimens with a diameter of 5 cm and a height of 10 cm were made. A mudstone that weathered rapidly during rainfall was collected from Pohang construction sites. The weathered mudstone passed through a 2 mm sieve. It was prepared with the cement ratio, the sand ratio, curing condition and curing days. Three specimens were prepared according to each condition and then the unconfined compressive test, durability test and SEM analysis were performed to evaluate the engineering properties of the cemented soil. In the case of 28 days cured specimen, the strength of under-water cured specimens was 32-55% and the durability index was about 15% higher than air cured specimens. In addition, when the CR increased from 8% to 16%, the unconfined compressive strength (UCS) of pure mudstone cemented soil under water increased by about 1.6 times and the durability index increased by about 1.9 times. When the SR increased from 0% to 50%, the UCS of the specimen with SR = 10% was slightly less than or equal to specimen with SR = 0%. Then, as the SR became 30-50%, the UCS increased up to 51%. Unlike the UCS, the durability index increased continuously as the SR increased. As a result of SEM analysis, when SR was 50% rather than SR = 0%, the contact between sand particles increased and they were connected to each other. Such contact between these particles resulted in the increase of strength.

Development and Validation of the GPU-based 3D Dynamic Analysis Code for Simulating Rock Fracturing Subjected to Impact Loading (충격 하중 시 암석의 파괴거동해석을 위한 GPGPU 기반 3차원 동적해석기법의 개발과 검증 연구)

  • Min, Gyeong-Jo;Fukuda, Daisuke;Oh, Se-Wook;Cho, Sang-Ho
    • Explosives and Blasting
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    • v.39 no.2
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    • pp.1-14
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    • 2021
  • Recently, with the development of high-performance processing devices such as GPGPU, a three-dimensional dynamic analysis technique that can replace expensive rock material impact tests has been actively developed in the defense and aerospace fields. Experimentally observing or measuring fracture processes occurring in rocks subjected to high impact loads, such as blasting and earth penetration of small-diameter missiles, are difficult due to the inhomogeneity and opacity of rock materials. In this study, a three-dimensional dynamic fracture process analysis technique (3D-DFPA) was developed to simulate the fracture behavior of rocks due to impact. In order to improve the operation speed, an algorithm capable of GPGPU operation was developed for explicit analysis and contact element search. To verify the proposed dynamic fracture process analysis technique, the dynamic fracture toughness tests of the Straight Notched Disk Bending (SNDB) limestone samples were simulated and the propagation of the reflection and transmission of the stress waves at the rock-impact bar interfaces and the fracture process of the rock samples were compared. The dynamic load tests for the SNDB sample applied a Pulse Shape controlled Split Hopkinson presure bar (PS-SHPB) that can control the waveform of the incident stress wave, the stress state, and the fracture process of the rock models were analyzed with experimental results.

The healing effect of platelet-rich plasma on xenograft in peri-implant bone defects in rabbits

  • Peng, Wang;Kim, Il-kyu;Cho, Hyun-young;Seo, Ji-Hoon;Lee, Dong-Hwan;Jang, Jun-Min;Park, Seung-Hoon
    • Maxillofacial Plastic and Reconstructive Surgery
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    • v.38
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    • pp.16.1-16.9
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    • 2016
  • Background: The association of biomaterial combined with repair factor-like platelet-rich plasma (PRP) has prospective values. Bovine-derived xenograft has been identified as an osteoconductive and biocompatible grafting material that provides osseointegration ability. PRP has become a valuable adjunctive agent to promote healing in a lot of dental and oral surgery procedures. However, there are controversies with respect to the regenerative capacity of PRP and the real benefits of its use in bone grafts. The purpose of this study was to assess the influence of PRP combined with xenograft for the repair of peri-implant bone defects. Methods: Twelve rabbits were used in this study, and the experimental surgery with implant installation was performed simultaneously. Autologous PRP was prepared before the surgical procedure. An intrabony defect (7.0 mm in diameter and 3.0 mm deep) was created in the tibia of each rabbit; then, 24 titanium dental implants (3.0 mm in diameter and 8.5 mm long) were inserted into these osteotomy sites. Thus, a standardized gap (4.0 mm) was established between the surrounding bony walls and the implant surface. The gaps were treated with either xenograft alone (control group) or xenograft combined with PRP (experimental group). After healing for 1, 2, 3, 4, 5, and 6 weeks, the rabbits were sacrificed with an overdose of KCl solution. Two rabbits were killed at each time, and the samples including dental implants and surrounding bone were collected and processed for histological analysis. Results: More newly formed bone and a better bone healing process were observed in control group. The histomorphometric analysis revealed that the mean percentage of bone-to-implant contact in the control group was significantly higher than that of the experimental group (25.23 vs. 8.16 %; P < 0.05, independent-simple t test, analysis of variance [ANOVA]). Conclusions: The results indicate that in the addition of PRP to bovine-derived xenograft in the repair of bone defects around the implant, PRP may delay peri-implant bone healing.

Experimental Study on Characteristics of Steam Condensation in a Sub-cooled Water Pool (과냉각수조에서 증기응축 특성에 관한 실험적 연구)

  • Kim, Hwan-Yeol;Cho, Seok;Song, Chul-Hwa;Chung, Moon-Ki;Choi, Sang-Min
    • Journal of Energy Engineering
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    • v.8 no.2
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    • pp.298-308
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    • 1999
  • Experimental study on characteristics of direct contact condensation of steam discharged into a sub-cooled water pool has been performed using five different sizes of horizontal nozzle over a wide range of steam mass fluxes and pool temperatures. Steam condensation phenomena have been observed visually and by taking pictures of steam jets using a high speed video camera. Two different steam jet shapes such as ellipsoidal shape and conical shape were typically observed for a stable steam jet, depending on the steam mass flux and pool temperature. The steam jet expansion ratio and the steam jet length as well as the condensation heat transfer coefficients were determined. The effect of steam mass flux, pool temperature, and nozzle diameter on these parameters were also discussed. Empirical correlations for the steam jet lengths and the condensation heat transfer coefficients as a function of steam mass flux and condensation driving potential were established. The axial and radial temperature distributions in steam jet and in surrounding water were measured. The effect of steam mass flux, pool temperature, and nozzle diameter were also discussed. The condensation regime map, which consists of six regimes such as chugging, transient chugging, condensation oscillation, stable condensation, bubble condensation oscillation, and intermittent oscillation condensation, were established. In addition, the dynamic pressures at the pool wall were measured. The close relation of dynamic pressure and steam condensation mode, which is also dependent on steam mass flux and pool temperature, was found.

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Via-size Dependance of Solder Bump Formation (비아 크기가 솔더범프 형성에 미치는 영향)

  • 김성진;주철원;박성수;백규하;이상균;송민규
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.1
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    • pp.33-38
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    • 2001
  • We investigate the via-size dependance of as-electroplated- and reflow-bump shapes for realizing both high-density and high-aspect ratio of solder bump. The solder bump is fabricated by subsequent processes as follows. After sputtering a TiW/Al electrode on a 5-inch Si-wafer, a thick photoresist for via formation it obtained by multiple-codling method and then vias with various diameters are defined by a conventional photolithography technique using a contact alinger with an I-line source. After via formation the under ball metallurgy (UBM) structure with Ti-adhesion and Cu-seed layers is sputtered on a sample. Cu-layer and Sn/pb-layer with a competition ratio of 6 to 4 are electroplated by a selective electroplating method. The reflow-bump diameters at bottom are unchanged, compared with as-electroplated diameters. As-electroplated- and reflow-bump shapes, however, depend significantly on the via size. The heights of as-electroplated and reflow bumps increase with the larger cia, while the aspect ratio of bump decreases. The nearest bumps may be touched by decreasing the bump pitch in order to obtain high-density bump. The touching between the nearest bumps occurs during the overplating procedure rather than the reflowing procedure because the mushroom diameter formed by overplating is larger than the reflow-bump diameter. The arrangement as zig-zag rows can be effective for realizing the flip-chip-interconnect bump with both high-density and high-aspect ratio.

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