• Journal of KSNVE
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• v.7 no.3
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• pp.499-509
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• 1997

During the process of oxide removal from work rolls in sheet metal manufacture, filamentary brushes frequently exhibit a bouncing or chatter behavior. The dynamics of this phenomenon is investigated through the development of expressions for the non-linear contact stiffness between the brush and the roll. With formulation of simple structural models, the time responses in the presence and absence of friction under random excitation are investigated. Possible solutions for the minimization or avoidance of this bouncing or chatter problem are also suggested.

• Korean Journal of Materials Research
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• v.14 no.8
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• pp.573-578
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• 2004

Newly developed silicide materials for ULSI should have the appropriate electrical property of low resistant as well as process compatibility in conventional CMOS process. We prepared $NiCoSi_x$ silicides from 15 nm-Co/15 nm-Ni/Si structure and performed contact dry etch process to confirm the dry etch stability and compatibility of $NiCoSi_x$ layers. We dry etched the photoresist/SiO/silicide/silicon patterns with $CF_4\;and\;CHF_3$ gases with varying powers from 100 to 200 W, and pressures from 45 to 65 mTorr, respectively. Polysilicon and silicon active layers without silicide were etched $0\sim316{\AA}$ during over etch time of 3min, while silicon layers with proposed $NiCoSi_x$ silicide were not etched and showed stable surfaces. Our result implies that new $NiCoSi_x$ silicides may replace the conventional silicides due to contact etch process compatibility.

• Transactions of Materials Processing
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• v.7 no.1
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.10
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• pp.840-846
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• 1991

In case of the rapid thermal process by halogen lamps, an optical pyrometer is generally used to measure the temperature. It is, however, necessary to measure the temperature by the thermocouple when the process temperature is lower than 700$^{\circ}C$ and the correction of the temperature is required. Contact by the PdAg paste is commonly used out but in this case it is impossible to see the effect of surface states of the substrate, which is critical in the rapid thermal process. In this study, real temperature ramping speed of silicon substrates coveredwith various thin films such as SiO$_2$2, Si$_{3}N_{4}$, dopants, and conductive layers (Ti or Co) was investigated by a mechanical contact of the thermocouple. And the results were compared with the case in which the contact was made by the PdAg paste. Effect of process ambient was also studied. It was found that depending on the surface state, overshoot more than 100$^{\circ}C$ could occur. It was also found that in case of the substrate covered with conductive layers, mechanical contact might render the correct temperature.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.226-232
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• 2005

Contact material is widely used in the field of electrical parts. Ag-CdO material has a good wear resistance and stable contact resistance. In order to establish optimizing heat treatment condition, rolling temperature and oxidation process, we studied the microstructure of Ag-CdO material with various conditions. The experimental procedure were melting using high frequency induction, heat treatment, rolling and internal oxidation. And we experimented on difference process, Post-oxidaion. In this study, we obtained the optimizing heat treatment condition was $700^{\circ}C$ for 15 min. and the optimizing rolling temperature was $730^{\circ}C$. In investigation of the microstructure of oxidized material, coarse oxide and depleted oxidation layer existed. The hardness was average Hv 70. When we used Post-oxidation, oxides were finer than prior process and depleted oxidation layer did not exist. The hardness of Post-oxidation material was average Hv 80. And the optimizing rolling temperature was $800^{\circ}C$.

• Tribology and Lubricants
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• v.31 no.4
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• pp.163-169
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• 2015

This paper describes a design method for the corner radius of a contacting body using the theoretical approach of contact mechanics. A complete contact, as in the case of a sharp-cornered punch, produces singular contact traction: whereas, in an incomplete contact, the singular contact traction disappears because of the rounded corners, and the contact edges are within the rounded regions. The design method aims to determine the conditions of the contact force as well as the material properties in an incomplete contact. The incomplete contact changes into the complete contact again when the contact edges exceed the rounded regions owing to either an increased contact force or the compliance of the materials. The contact length of a rounded punch is used as a parameter to derive the required conditions. As a result, a design formula is obtained, which provides a minimum allowable radius when the materials, normal contact force, and the length of a flat region of the punch are predetermined. This work consists of two parts: Part I includes a theoretical background, design method, and formula, and Part II describes the actual process with the investigation of design parameters.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.2
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• pp.170-177
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• 1992

Contact resistance and contact leakage current of the Al/TiSiS12T/Si system are investigated for NS0+T and PS0+T junctions. SALICIDE (Self Aligned Silicide) process was used to make the Al/TiSiS12T/Si system. Titanium disilicide is one of the most common silicides because of its thermal stability, ability to form selective formation and low resistivity. In this paper, RTA temperature effect and Junction implant dose effect were evaluated to characterize contact resistance and contact leakage current. The TiSiS12T contact resistance to NS0+T silicon is lower than that to PS0+T silicon, and TiSiS12T of contact leakage current to NS0+T silicon is lower than that to PS0+T silicon. Contact resistance and contact leakage current of the Al/TiSiS12T/Si system by this method were possible for VLSI application.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.6
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• pp.152-159
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• 2001

In multibody dynamic analysis including contact and impact, there are two major analysis methods, i.e., piecewise analysis and continuous analysis. Modeling of contact phenomena is mainly classified with a Kelvin-Voigt model or a model of Hertz contact model. In this paper, a contact module fur AutoDyn7 program was developed and implemented. Both the Kelvin-Voigt model and a model of Hertz contact law were developed. The process of this module is composed of contact distinction and the contact force calculation. Two examples were verified and compared to the commercial program DADS.

• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Journal of the Korean Society of Industry Convergence
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• v.10 no.4
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• pp.213-219
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• 2007

Glass-to-metal contact should be prevented in the design of any structural glass component. Because glass is extremely brittle and will fracture readily if even a small point load is applied. If the assembly includes a glass component supported by metallic structure, designers should provide a pliable interface of some kind between the two parts. But there happens high demand of glass-to metal contact in semiconductor industries due to adoption of dry cleaning process as one of the good solution to reduce running cost - carry out equipments cleaning with high corrosive and etching gas such as CF4 with keeping process temperature as the same as high service temperature. Therefore the quartz glass have to be received compression by direct contact with metal as the form of weight itself and vacuum pressure and fatigue by vibrations caused by process during the process. In this paper investigation will be carried out on fracture behavior of quartz glass contacted with metal directly under local load and fatigue given by process vibration with apparatus which can give $lox{\backslash}cal$ load and vibration through PZT ceramics to give guideline to prevent unintended fracture of quartz glass.