• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제49권8호
• /
• pp.438-444
• /
• 2000

We report the effects of etch process parameters on the ohmic contact formation in the plasma etching of GaN. Planar inductively coupled plasma system with $CH_4/H_2/Ar$gas chemistry has been used as etch reactor. The contact resistance and the specific contact resistance have been investigated using transfer length method as a function of RF bias power and %Ar gas concentration in total flow rate. AES(Auger electron spectroscopy) analysis revealed that the etched GaN has nonstoichiometric Ga rich surface and was contaminated by carbon and oxygen. Especially large amount of carbon was detected at the sample etched for high bias power (or voltage) condition, where severe degradation of contact resistance was occurred. We achieved the low ohmic contact of $2.4{\times}10^{-3} {\Omega}cm^2$ specific contact resistance at the input power 400 W, RF bias power 150 W, and working pressure 10mTorr with 10 sccm $CH_4$, 15 sccm H2, 5 sccm Ar gas composition.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
• /
• pp.235-240
• /
• 2009

Crystlline silicon solar cells markets are increasing at rapid pace. now, crystlline silicon solar cells markets screen-printing solar cell is occupying. screen-printing solar cells manufacturing process are very quick, there is a strong point which is a low cost. but silicon and metal contact, uses Ag & Al pates. because of, high contact resistance, high series resistance and sintering inside process the electric conductivity decreases with 1/3. and In pastes ingredients uses Ag where $80{\sim}90%$ is metal of high cost. because of low cost solar cells descriptions is difficult. therefore BCSC(Buried Contact Solar Cell) is developed. and uses light-induced plating, ln-line galvanization developed equipments. Ni/Cu matel contact solar cells researches. in Germany Fraunhofer ISE. In order to manufacture high-efficiency solar cells, metal selections are important. metal materials get in metal resistance does small, to be electric conductivity does highly. efficiency must raise an increase with rise of the curve factor where the contact resistance of the silicon substrate and is caused by few with decrement of series resistance. Ni metal materials the price is cheap, Ti comes similar resistance. Cu and Ag has the electric conductivity which is similar. and Cu price is cheap. In this paper, Ni/Cu/Ag metal contact cell with screen printing manufactured, silicon metal contact comparison and analysis.

• 한국기계가공학회지
• /
• 제17권4호
• /
• pp.39-46
• /
• 2018

Two surfaces that have relative motion show different characteristics according to surface roughness or surface patterns in all lubrication areas. For two rough surfaces with mixed lubrication, this paper proposes a new approach that includes the contact characteristics of the surfaces and a probabilistic method for a numerical analysis of lubrication. As the contact area of the two surfaces changes according to the loading conditions, asperity contact is very important. An average flow model developed by Patir-Cheng is central to the study of lubrication for rough surfaces. This average flow model also refers to a multi-asperity contact model for deriving a modified Reynolds equation and calculating the lubricant characteristics of a bearing surface with random roughness during fluid flow. Based on the average flow model, this paper carried out a numerical analysis of lubrication using a contact model by considering a load change made by the actual contact of asperities between two surfaces. Lubrication properties show different characteristics according to the surface patterns. This study modeled various geometric surface patterns and calculated the characteristics of lubrication.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
• /
• pp.186-187
• /
• 1994

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
• /
• pp.352-354
• /
• 1995

The optical and electrical properties of High Speed AlGaAs infrared LED by using metal wet etch process instead of metal lift-off process are investigated. The power out increases when metal contact is patterned by wet etch process. Forward voltage and Reverse voltage for metal wet etch process represent higher value than the metal lift-off process. The aging effect of power out also indicates good results with wet etch process. The wet etch process for metal contact reveals reliable LED device properties.

• 한국전기전자재료학회논문지
• /
• 제23권8호
• /
• pp.632-637
• /
• 2010

The measurement of contact wire wear in electric railways is one of the key test parameters to increase speed and maintain safety in electric railways. Wear caused by continuous interaction between pantographs and contact wires has a negative effect on current collection quality and severely damaged contact wires might cause hazardous accidents. This paper introduces a non-contact optical-based contact wire wear measuring system that will replace conventional wear detecting methods conducted by maintenance vehicles or workers. The system is implemented by high-speed cameras that can collect images of contact wires during vehicle operation, a laser used to create images profile of the contact wire surface, and a computer used to process the collected images. The proposed system is designed to assist maintenance of overhead contact lines by creating geometrically plotted images of contact wires to detect contact wire wear during operation on conventional lines or high-speed lines.

• Transactions on Electrical and Electronic Materials
• /
• 제9권4호
• /
• pp.137-142
• /
• 2008

The parasitic resistance is studied to silicon/metal contact junction for improving device performance and to lower contact/serial resistance silicide in natural sequence. In this paper constructs the stepwise Ni silicide process for parasitic resistance reduction for silicon/metal contact junction. We have investigated multi-step Ni silicide on SiGe substrate with stepwise annealing method as an alternative to compose more thermally reliable Ni silicide layer. Stepwise annealing for silicide formation is exposed to heating environment with $5^{\circ}C/sec$ for 10 seconds and a dwelling for both 10 and 30 seconds, and ramping-up and the dwelling was repeated until the final annealing temperature of $700\;^{\circ}C$ is achieved. Finally a direct comparison for single step and stepwise annealing process is obtained for 20 nm nickel silicide through stepwise annealing is $5.64\;{\Omega}/square$ at $600\;^{\circ}C$, and it is 42 % lower than that of as nickel sputtered. The proposed stepwise annealing for Ni silicidation can provide the least amount of NiSi at the interface of nickel silicide and silicon, and it provides lower resistance, higher thermal-stability, and superior morphology than other thermal treatment.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회A
• /
• pp.1098-1102
• /
• 2008

To increase the ink transfer rate in the micro-gravure-offset printing, the liquid transfer process between two separating plates is investigated. During the liquid transfer process, in which one plate is fixed and the other one moves vertically, a sessile droplet is separated into two droplets. The volume ratio of the two droplets depends on the contact angles of the two plates. In a numerical study of the ink transfer processes, liquid transfer between two parallel separating plates and between a trapezoidal cavity and an upward moving plate are simulated, as models of the printing of ink from the offset pad onto the substrate and the picking up of ink from the gravure plate by the offset pad, respectively. Also, in experimental study, to obtain various surface contact angles, chemical treatment, plasma treatment, and electrowetting- on-dielectric (EWOD) surface are considered. The transfer rate between two plates is calculated by analyzing the droplet images. From the results, the optimal surface contact angles of the units of the micro-gravure-offset printing can be characterized.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2014년도 추계학술대회 논문집
• /
• pp.975-977
• /
• 2014

Recently, As portability of storage device has been increased, it is important to analyze the precise anti-shock analysis. For non-operational shock analysis, the accuracy of non-operational shock simulation has been improved. However, because operational shock analysis includes nonlinear process, it is hard to get clear result from operational shock simulation. In this paper, by using Lagrange multiplier method, the FE model including ramp-disk contact of nonlinear process will be analyzed. Through this, we find ramp-disk contact affect the dynamic of slider. Additionally, for the more accurate analysis, we should include ramp-disk contact process at the FE model.

• 소성∙가공
• /
• 제12권1호
• /
• pp.18-25
• /
• 2003

This paper explains the process design for improving tool life in the conventional hot forging process. The thermal load and the thermal softening are happened by contact between the hotter billet and the cooler tools in hot forging process. Tool life decreases considerably due to the softening of the surface layer of a tool was caused by a high thermal load and long contact time between the tools and the billet. Also, tool life is to a large extent limited by wear, heat crack and plastic deformation in hot forging process. Above all, the main factors which affect die accuracy and tool life we wear and the plastic deformation of a tool. The newly developed techniques for predicting tool life are applied to estimate the production quantity for a spindle component and these techniques can be applied to improve the tool life in hot forging process.