• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.156-159
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• 2003

Surface normal vector and surface velocity are very important parameters to simulate rolling processes precisely. In this study, Local displacement functions are constructed for each node on the contact surface and parameters are found by the least square fitting of displacement on the neighbor nodes. Deformation gradient tensor is calculated from the displacement function and surface normal vector and velocity also can be derived. Flat rolling simulation model is presented on the basis of the suggested contact scheme. Series of rolling process simulation are carried out and the results are compared with the experiments.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1996.06a
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• pp.87-95
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• 1996

The stamping process consists of two stages : First, the blank is held by the blank holder and then it is further formed into the die cavity by punch stroke. In actual stamping process, the accurate prediction of binder wrap is an indispensable step in sheet metal forming analysis because the initial plastic buckling induced by improper die design is directly related with fatal defect at the final stage. In the present work, an approach including the gravity effect of blank material and proper consideration of contact and friction is proposed. Computations are carried out for some actual auto-body parts using 3D FEM code to investigate the validity of the proposed methodology. Comparisons with experimental results show that the suggested scheme can be effectively applied to the precise prediction of binder wrap for arbitrarily curved die faces in which gravity and contact effect must be taken into account.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.395-400
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• 2011

Scanning Probe Lithography is a method to localized oxidation on single crystal silicon wafer surface. This study demonstrates nanometer scale non contact lithography process on (100) silicon (p-type) wafer surface using AFM(Atomic force microscope) apparatuses and pulse controlling methods. AFM-based experimental apparatuses are connected the DC pulse generator that supplies ultra short pulses between conductive tip and single crystal silicon wafer surface maintaining constant humidity during processes. Then ultra short pulse durations are controlled according to various experimental conditions. Non contact lithography of using ultra short pulse induces electrochemical reaction between micro-scale tip and silicon wafer surface. Various growths of oxides can be created by ultra short pulse non contact lithography modification according to various pulse durations and applied constant humidity environment.

• Journal of the Korean Ceramic Society
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• v.54 no.1
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• pp.66-69
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• 2017

In this study, the fabrication and electrical properties of aligned single-walled carbon nanotube (SWCNT) networks using a template-based fluidic assembly process are presented. This complementary metal-oxide-semiconductor (CMOS)-friendly process allows the formation of highly aligned lateral nanotube networks on $SiO_2/Si$ substrates, which can be easily integrated onto existing Si-based structures. To measure outstanding electrical properties of organized SWCNT devices, interfacial contact resistance between organized SWCNT devices and Ti/Au electrodes needs to be improved since conventional lithographic cleaning procedures are insufficient for the complete removal of lithographic residues in SWCNT network devices. Using optimized purification steps and controlled developing time, the interfacial contact resistance between SWCNTs and contact electrodes of Ti/Au is reached below 2% of the overall resistance in two-probe SWCNT platform. This structure can withstand current densities ${\sim}10^7A{\cdot}cm^{-2}$, equivalent to copper at similar dimensions. Also failure current density improves with decreasing network width.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.203-215
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• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• Journal of Mechanical Science and Technology
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• v.17 no.7
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• pp.1026-1035
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• 2003

A computer simulation method for investigating the form generation mechanism in the centerless infeed (plunge) grinding process is described. For a 3-D simulation model of form generation, contact points are assumed to be on least squares contact lines at the grinding wheel, regulating wheel, and work-rest blade. Using force and deflection analyses, the validity of this assumption is shown. Based on the 2-D simulation model developed in the previous work and the least squares contact line assumption, a 3-D model is presented. To validate this model, simulation results were compared with the experimental works. The experiments and computer simulations were carried out using three types of cylindrical workpiece shapes with varying flat length. The experimental results agree well with the simulation. It can be seen that the effect of flat end propagated to the opposite end through workpiece reorientation.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.324-328
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• 2003

The Magnetoeheological fluid has the properties that it's viscosity has dramastic changed under some magnetic fields therefore, Magnetorhlogical fluids has been used for micro polishing of the micro part( for example, a aspherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorhological finshing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fulid ate brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate f3r glass polishing lends support the validity of the approach.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1840-1843
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• 2003

The Magnetorheological fluid has the properties that its viscosity has drastic changed under some magnetic fields therefore, Magnetorheological fluids has been used for micro polishing of the micro part( for example, a aspherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorheological finishing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fluid ate brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate for glass polishing lends support the validity of the approach.

• Coupled systems mechanics
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• v.4 no.3
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• pp.237-249
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• 2015

In the gear meshing process, gear temperature field concerns the meshing surface friction, the friction heat depends on the contact pressure, the contact pressure is affected by the elastic deformation of gears and the temperature field caused by the thermal deformation, so the temperature field, stress field and displacement field should be mutual coupling. It is necessary to consider in meshing gear pair in the operation process of thermodynamic coupling contact stress (TCCS) and thermodynamic coupling deformation (TCD), and based on thermodynamic coupling analysis (TCA) of gear teeth deformation.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.46-52
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• 2004

The Magnetorheological fluid has the properties that its viscosity has drastic changed under some magnetic fields therefore, Magnetorheological fluids has been used fur micro polishing of the micro part(for example, a spherical surface in a micro lens). The polishing process may appears as follows. A part rotating on the spindle is brought into contact with an Magnetorheological finishing(MRF) fluids which is set in motion by the moving wall. In the region where the part and the MRF fluid are brought into contact, the applied magnetic field creates the conditions necessary for the material removal from the part surface. The material removal takes place in a certain region contacting the surface of the part which can be called the polishing spot or zone. The polishing mechanism of the material removal in the contact zone is considered as a process governed by the particularities of the Bingham flow in the contact zone. Resonable calculated and experimental magnitudes of the material removal rate for glass polishing lends support the validity of the approach.