• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.40-43
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• 2004

Stamps for microcontact processing are fabricated by casting elastomer such as PDMS on a master with a negative of the desired pattern. After curing, the PDMS stamp is peeled away from the master and exposed to a solution of ink and then dried. Transfer of the ink from the PDMS stamp to the substrate occurs during a brief contact between stamp and substrate. Generally, negative-tone masters, which are used for making positive-tone PDMS stamps, are fabricated by using photolithographic technique. The shortcomings of photolithography are a relative high-cost process and require extensive processing time and heavy capital investment to build and maintain the fabrication facilities. The goal of this study is to fabricate a negative-tone master by using Nano-indenter based patterning technique. Various sizes of V-grooves and U-groove were fabricated by using the combination of nanoscratch and HF isotropic etching technique. An achieved negative-tone structure was used as a master in the PDMS replica molding process to fabricate a positive-tone PDMS stamp.

• Applied Chemistry for Engineering
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• v.25 no.1
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• pp.53-57
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• 2014

We describe the preparation of highly-ordered etching pits on the Nb foil through a micromachining. The effects of electrochemical polishing on the formation of uniformly-patterned protective epoxy layer was investigated. Unlike the previous process using $O_2$ plasma, well-ordered etched pits were prepared without any dry processes. As a result, the Nb foil with the well-ordered pits of $10{\mu}m{\times}5{\mu}m$ could be obtained by electrochemical etching in methanolic electrolytes for 10 min.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.34-39
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• 2011

Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.548-550
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• 2010

The droplet motion on a flat substrate with contact angle hysteresis is studied by solving the equations governing the conservation of mass and momentum. The liquid- gas interface is determined by an level-set method which is based on a sharp-interface representation for accurately imposing the matching or coupling conditions at the interface. The method is modified to treat the dynamic contact angle at the liquid-gas-solid interface. The computations are performed to investigate a droplet impact and merging pattern on a flat substrate to find a optimal condition in a micro-line patterning process. The effects of dynamic contact angles on droplet motion are quantified.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.43.1-43.1
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• 2010

In the crystalline silicon solar cells, the full area aluminum_back surface field(BSF) is routinely achieved through the screen-printing of aluminum paste and rapid firing. It is widely used in the industrial solar cell because of the simple and cost-effective process to suppress the overall recombination at the back surface. However, it still has limitations such as the relatively higher recombination rate and the low-to-moderate reflectance. In addition, it is difficult to apply it to thinner substrate due to wafer bowing. In the recent years, the dielectric back-passivated cell with local back contacts has been developed and implemented to overcome its disadvantages. Although it is successful to gain a lower value of surface recombination velocity(SRV), the series resistance($R_{series}$) becomes even more important than the conventional solar cell. That is, it is a trade off relationship between the SRV and the $R_{series}$ as a function of the contact size, the contact spacing and the geometry of the opening. Therefore it is essential to find the best compromise between them for the high efficiency solar cell. We have investigated the optimal design for the local back contact by using PC1D simulation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.10
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• pp.111-116
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• 2020

Flexible tactile sensors, which are primarily used as grippers in robots, are mainly used to handle highly elastic or highly flexible objects. That is, flexible grippers are used when an object cannot be sufficiently controlled by applying a specific output force or taking a specific grabbing action. This is because a flexible tactile sensor needs to measure the pressure applied directly to held objects while deforming according to the shape of the object to be handled. CNT-based sensors used to be made from a highly flexible polymer to give flexibility and it is known that the sensors are greatly affected by the contact resistance of the terminal that connects the sensor to an electrical circuit; therefore, this paper clarifies the contact resistance of MWCNTs-based flexible tactile sensors and terminals. The effects of main and plating materials for terminals are investigated and the combinations of main and plating materials that exhibit contact resistance are measured in a typical industrial environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.108-108
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• 2007

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. The etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity of 300 cPs at ambient temperature. A piezoelectric-driven ink jet printhead is used to dispense $20-40\;{\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. In this study, factors affecting the pattern formation such as printing resolution, jetting property, adhesion strength, etching and strip mechanism, UV pinning energy have been investigated. As a result, microscale Etch resist patterning of printed circuit board with tens of ${\mu}m$ high have been fabricated.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.35 no.3
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• pp.191-196
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• 2022

In this study, the anisotropic mechanical property of fused deposition modeling three-dimensional (3D) printing based on lamination direction was verified by a tensile test. Moreover, the property was applied to solid isotropic materials with penalization-based topology optimization. The case of the lower control arm, one of the automotive suspension components, was considered as a benchmark problem. The optimal topological results varied depending on the external load and anisotropic property. Based on these results, two test specimens were fabricated by varying the lamination direction of 3D printing; a tensile test utilizing 3D non-contact strain gauge was also conducted. The measured strain was compared with that obtained by computer-aided engineering response analysis. Quantitatively, the measurement and analysis results are found to have good agreement. The effectiveness of topology optimization considering the lamination direction of 3D printing was confirmed by the experimental result.

• ETRI Journal
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• v.37 no.2
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1633-1637
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• 2006

We demonstrate a selective vapor-phase deposition of conductive poly(3,4-ethylenedioxythiophene) (PEDOT) thin films on patterned $FeCl_3$. The PEDOT thin films were grown on various substrates by using the vapor-phase polymerization of ethylenedioxythiophene (EDOT) with $FeCl_3$ catalytic layers at 325 K. The selective deposition of the PEDOT thin films using vapor-phase polymerization was accomplished with patterned $FeCl_3$ layers as templates. Microcontact printing was done to prepare patterned $FeCl_3$ on polyethyleneterephthalate (PET) substrates. The selective vapor-phase deposition is based on the fact that the PEDOT thin films are selectively deposited only on the regions exposing $FeCl_3$ of the PET substrates, because the EDOT monomer can be polymerized only in the presence of oxidants, such as $FeCl_3$, Fe($CIO_4$), and iron(II) salts of organic acids/inorganic acids containing organic radicals.