• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1030-1035
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• 2003

The nanoimprint lithography technology makes higher density of semiconductor device and larger capacity of storage media. In this technology the induced damage while detaching polymer pattern from mold should be minimized. In order to analyze the problem, the basic knowledge of adhesion between the polymer and the mold is required. In this study a contact experiment of polyisobutylene specimen with spherical steel tip and polyisobutylene bead tip was conducted using nano indenter. During the contact experiment with various loading rate under load control the contact behavior of viscoelastic material was measured, i.e., the load and displacement between the tip and the specimen were measured. The data was analyzed by HBK model to obtain the stress intensity factor of contact edge and the contact radius as a function of time. Also the adhesion energies between steel/polyisobutylene and polyisobutylene/polyisobutylene were obtained employing the analysis of the crack of viscoelastic material by Schapery.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.133-136
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• 2004

In this study, the characteristics of 3C-SiC ohmic contact were investigated. Titanium-tungsten(TiW) films were used for contact metalization. The ohmic contact resistivity between 3C-SiC and TiW was measured by HP4155 and then calculated with the circular transmission line method(C-TLM). And also the physical properties of TiW and the interface between TiW and 3C-SiC were analyzed using XRD and AES. TiW films make a good role of a diffusion barrier and their contact properties with 3C-SiC are stable at high temperature.

• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.115-119
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• 2015

The power relay can be easily controlled with high voltage and current through the contacts. For this reason, has become widely used range in a variety of applications. In this study, we measured the contact resistance between the bouncing phenomenon of contact due to the change of load. The results of the experiment, the contact resistance increases with the deterioration of the contact, it is possible to predict the life of the relay contacts through the contact resistance. And relay bounce duration time have occurred in 3.5 ms or less. In addition, it is possible to use the results to design an arc suppression circuit device.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.44-49
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• 2000

Recently, PM-high speed steel(PM-HSS) has reportedly been a good alternative material for rolling mill because of its superior peformance to conventional HSS. This paper has been aimed to investigate the possibility for application to rolling contact element for PM-HSS by X-ray diffraction technique. The X-ray elastic constant for PM-HSS has been found by X-ray diffraction during the four-point bending test. Residual stress and half-value breadth on the contact surface during rolling contact fatigue process by X-ray diffraction have also been measured. The result of this study shows that the application of X-ray diffraction technique to PM-HSS could be as possible alternative material as conventional HSS. Half-value breadth on rolling contact surface by X-ray diffraction is not changed during rolling contact fatigue process. On the other hand, the residual stress is changed. This suggests that dislocation reaction has been hardly occurred in rolling contact, depending on supersaturated carbon in PM-HSS.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.109-109
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• 2006

Screen printing (SP) metal contact is typically applied to the solar cells for mass production. However, SP metal contact has low aspect ratio, low accuracy, hard control of the substrate penetration and unclean process. On the other hand, photo lithograpy (PL) metal contact can reduce defects by metal contact. In this investigation, PL metal contact was obtained the multi-layer structure of Ti/Pd/Ag by e-beam process. We applied SP metal contact and PL metal contact to single crystalline silicon solar cells, and demonstrated the difference of conversion efficiency. Because PL metal contact silicon solar cell has Jsc (short circuit current density) better than silicon solar cell applied SP metal contact.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1315-1321
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• 2005

Using hyper-elastic material has been increased gradually and its range was extended all over the industrial. In addition, the performance prediction of this material was required not only experimental methods like metal material but also numerical methods. In this study, we presented the process how to use numerical method for hyper-elastic material and then, it was applied for seat-ring of butterfly valve by using this process. The finite element analysis was executed to evaluate the mechanical characteristics of hyper-elastic material and search the optimum model considered conditions and features. According to that model the coefficient was obtained by using Contact analysis.

• 한국주조공학회지
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• 제26권2호
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• pp.92-97
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• 2006

Contact material is widely used as electrical parts. Ag-Cd alloy has a good wear resistance and stable contact resistance. But the disadvantages of Ag-Cd alloy are coarse Cd oxides and harmful metal, Cd. To solve the disadvantages of that, Ag-Sn alloy that has stable and fine Sn oxide at high temperature has been developed. In order to optimize Sn amount that affects the formation of the oxide layer on the surface, we worked for the microstructures and properties of Ag-Sn material fabricated by rapid solidification process. The experimental procedure were melting using high frequency induction, melt spinning, and internal oxidation. We have shown that the optimized Sn amount for high hardness is 7.09 wt%Sn. Surface oxide layer forms when Sn amount is over 9.45 wt%. The size of Sn oxide is 20 nm.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.208-209
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• 2008

Ni/Ti/Al multilayer system was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Compared with conventional process using Ni, Ni/Ti/Al contact shows perfect ohmic behavior, and possesses much lower contact resistance of about $2.5\times10^{-4}\Omega{\cdot}cm^2$ after $930^{\circ}C$ RTA, which is about 2 orders of magnitude smaller than that of Ni contact. Contact resistance gradually increased as the RTA temperature was lowered in the range of 840 ~ $930^{\circ}C$, and about $3.4\times10^{-4}\Omega{\cdot}cm^2$ was obtained at the lowest RTA temperature of $840^{\circ}C$. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance.

• 한국전산구조공학회논문집
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• 제31권1호
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• pp.23-29
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• 2018

무릎 임플란트에서 접촉압력이 마모에 큰 영향을 미친다. 본 연구에서는 본 연구기관에서 개발한 무릎 임플란트 모델을 이용하여 유한요소해석을 하였다. 연구와 산업에서 실제로 사용하는 조합을 이용하여 총 10가지의 무릎 임플란트의 재료조합에 대한 접촉압력을 분석하였다. 무릎이 30도, 45도 60도 기울어져있을 때의 하중을 가하여 접촉압력을 구하였다. 접촉압력을 계산한 결과 티타늄합금-UHMWPE 조합에서 가장 작은 접촉압력이 나왔다. UHMWPE의 경우 대퇴골부에 어떠한 재료를 사용하여도 접촉압력이 크게 변하지 않았다. 접촉압력이 가장 큰 조합과 작은 조합을 비교하였을 때 0.77% 차이를 보였다. 반면에 Carbon/PEEK 복합재료의 경우 접촉압력이 가장 큰 경우와 작은 경우를 비교하였을 때 5.3% 차이를 보였다. 이를 통해 Carbon/PEEK 복합재료를 베어링부로 사용할 경우 대퇴골부의 재료가 마모에 영향을 미침을 알 수 있다. 본 연구는 무릎 임플란트 마모예측과 마모를 최소화 연구에 도움이 될 것이라 생각한다.

• The Journal of Advanced Prosthodontics
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• 제5권4호
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• pp.428-433
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• 2013

PURPOSE. The present study was aimed to evaluate the influence of implant contact ratio and stiffness of implant-surrounding materials on the resonance frequency analysis (RFA) values. MATERIALS AND METHODS. Seventy resin blocks that had the different amounts (100, 50, 30, 15%) of resin-implant contact (RIC) were fabricated. Ten silicone putty blocks with 100% silicone-implant contact were also made. The implants with ${\phi}5.0mm{\times}13.0mm$ were placed on eighty specimen blocks. The RFA value was measured on the transducer that was connected to each implant by Osstell Mentor. Kruskal-Wallis and Scheffe's tests (${\alpha}$=.05) were done for statistical analysis. RESULTS. The control resin group with 100% RIC had the highest RFA value of 83.9, which was significantly different only from the resin group with 15% RIC among the resin groups. The silicone putty group with 100% contact had the lowest RFA value of 36.6 and showed statistically significant differences from the resin groups. CONCLUSION. Within the limitations of this in vitro study, there was no significant difference in the RFA values among the resin groups with different RIC's except when the RIC difference was more than 85%. A significant increase in the RFA value was observed related to the increase in stiffness of material around implant.