• Title/Summary/Keyword: Contact Material

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트라이볼로지 손상을 억제하기 위한 구조물 모서리부 설계: 제1부 - 설계공식 개발 (Design of Structure Corners Restraining Tribological Failures: Part I - Development of Design Formula)

  • 김형규
    • Tribology and Lubricants
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    • 제31권4호
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    • pp.163-169
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    • 2015
  • This paper describes a design method for the corner radius of a contacting body using the theoretical approach of contact mechanics. A complete contact, as in the case of a sharp-cornered punch, produces singular contact traction: whereas, in an incomplete contact, the singular contact traction disappears because of the rounded corners, and the contact edges are within the rounded regions. The design method aims to determine the conditions of the contact force as well as the material properties in an incomplete contact. The incomplete contact changes into the complete contact again when the contact edges exceed the rounded regions owing to either an increased contact force or the compliance of the materials. The contact length of a rounded punch is used as a parameter to derive the required conditions. As a result, a design formula is obtained, which provides a minimum allowable radius when the materials, normal contact force, and the length of a flat region of the punch are predetermined. This work consists of two parts: Part I includes a theoretical background, design method, and formula, and Part II describes the actual process with the investigation of design parameters.

AI 이온 주입된 p-type 4H-SiC에 형성된 Ni/AI 오믹접촉의 전기 전도 특성 (Conduction Properties of NitAI Ohmic Contacts to AI-implanted p-type 4H-SiC)

  • 주성재;송재열;강인호;방욱;김상철;김남균;이용재
    • 한국전기전자재료학회논문지
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    • 제22권9호
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    • pp.717-723
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    • 2009
  • Ni/Al ('/' denotes deposition sequence) contacts were deposited on Al-implanted 4H-SiC for ohmic contact formation, and the conduction properties were characterized and compared with those of Ni-only contacts. The thicknesses of the Ni and Al thin film were 30 nm and 300 nm, respectively, and the films were sequentially deposited bye-beam evaporation without vacuum breaking. Rapid thermal anneal (RTA) temperature was varied as follows : $840^{\circ}C$, $890^{\circ}C$, and $940^{\circ}C$. The specific contact resistivity of the Ni contact was about $^{\sim}2\;{\pm}\;10^{-2}\;{\Omega}{\cdot}cm^2$, However, with the addition of Al overlayer, the specific contact resistivity decreased to about $^{\sim}2\;{\pm}\;10^{-4}\;{\Omega}{\cdot}cm^2$, almost irrespective of RTA temperature. X-ray diffraction (XRD) analysis of the Ni contact confirmed the existence of various Ni silicide phases, while the results of Ni/Al contact samples revealed that Al-contaning phases such as $Al_3Ni$, $Al_3Ni_2$, $Al_4Ni_3$, and $Ab_{3.21}Si_{0.47}$ were additionally formed as well as the Ni silicide phases. Energy dispersive spectroscopy (EDS) spectrum showed interfacial reaction zone mainly consisting of Al and Si at the contact interface, and it was also shown that considerable amounts of Si and C have diffused toward the surface. This indicates that contact resistance lowering of the Ni/Al contacts is related with the formation of the formation of interfacial reaction zone containing Al and Si. From these results, possible mechanisms of contact resistance lowering by the addition of Al were discussed.

단결정 실리콘 태양전지의 후면 전극형성에 관한 비교분석 (Analysis of the Formation of Rear Contact for Monocrystalline Silicon Solar Cells)

  • 권혁용;이재두;김민정;이수홍
    • 한국전기전자재료학회논문지
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    • 제23권7호
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    • pp.571-574
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    • 2010
  • Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

Pin-on-Disc식 미끄럼마모시험 시 마모 거동에 미치는 접촉면적 및 하중 조합의 영향 (Effects of Combination of the Load and the Apparent Area of Contact on Sliding Wear behavior of Mild Steel in a Pin-on-disc Type Apparatus)

  • 이한영
    • Tribology and Lubricants
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    • 제29권2호
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    • pp.85-90
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    • 2013
  • The effects of contact pressure on the sliding wear behavior of mild steel in a pin-on-disc type apparatus were investigated. Sliding wear tests were conducted with various combinations of the load and apparent area of contact. The wear behavior of mild steel as a function of sliding speed was independent of contact pressure. However, the wear rate at different sliding speeds was influenced by the load regardless of the apparent area of contact. This was attributed to the fact that there may be no difference in the real area of contact for any combination of the load and apparent area of contact.

립실의 접촉력 및 온도분포 해석에 관한 연구 (A Study on the Contact Force and Temperature Distribution of Lip Seals)

  • 김청균;전인기;김종억
    • 대한기계학회논문집
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    • 제18권6호
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    • pp.1559-1566
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    • 1994
  • Using the finite element method, the contact force, contact band width and temperature distribution of lip seals analyzed for the interference including some nonlinearities such as material nonlinearity, geometrical nonlinearity and nonlinear contact boundary condition. The calculated results showed that the contact stress concentrated on the contact zone between the garter spring and the rubber toward the flex side, the contact edge of lip seals. The high contact forces due to the increased interference separate the sealing gap between the lip edge and the rotating shaft. This may lead to leak the sealed oil.

탄소성접촉면의 나노스케일 열접촉저항 (Thermal contact resistance on elastoplastic nanosized contact spots)

  • 이상영;조현;장용훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2214-2219
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    • 2008
  • The thermal contact resistance(TCR) of nanosized contact spots has been investigated through a multiscale analysis which considers the resolution of surface topography. A numerical simulation is performed on the finite element model of rough surfaces. Especially, as the contact size decreases below the phonon mean free path, the size dependent thermal conductivity is considered to calculate the TCR. In our earlier model which follows an elastic material, the TCR increases without limits as the number of nanosized contact spots increases in the process of scale variation. However, the elastoplastic contact induces a finite limit of TCR as the scale varies. The results are explained through the plastic behavior of the two contacting models. Furthermore, the effect of air conduction in nanoscale is also investigated.

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원형 핀과 구멍의 접촉에서 헤르츠 응력장 가정을 위한 조건 (Conditions for Assuming Hertzian Stress for the Contact between a Circular Pin and Hole)

  • 김형규
    • Tribology and Lubricants
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    • 제31권5호
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    • pp.189-194
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    • 2015
  • This paper focuses on the conformal contact problem. A typical example of conformal contact is the contact between a pin and hole. In particular, this paper focuses on the condition for assuming a contact stress field to be a Hertzian pressure profile by using well-known classical solutions associated with Hertzian contact. Persson first developed the conformal contact analysis method around half a century ago, but there have been no significant improvements since then. The present research also adopted this method, but developed new solutions from the viewpoint of application to structural design. The analysis began with a comparison between Persson°Øs conformal contact stress and the Hertzian stress fields. The next step was to check the differences in the normalized stress values of both. This study used the tolerance for the difference in the peak stresses of Persson°Øs solution and the Hertz solution to validate the Hertzian assumption. This gave the range for the difference in radii of the pin and hole when the contact force and mechanical properties of the material are specified. The results showed that, at a tolerance of 5%, the Hertzian assumption is valid if half of the contact angle is less than 35°ý. In addition, the Hertzian assumption holds even for a relatively long contact length, in contrast to the general incomplete contact problem. This paper discusses these results along with other aspects of the application to the design.

이중 탄성중합체 시일의 절단부 오일누유 예측 (Oil Leakage Prediction through Cut Part of Double Elastomeric Seal)

  • 이택성;김연희
    • 한국전산구조공학회논문집
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    • 제36권3호
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    • pp.165-171
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    • 2023
  • 건설기계와 특장차의 상부와 하부 구조를 연결하는 로터리 조인트는 축과 하우징이 회전하면서 유압을 전달하는데 오일의 유로에 누유를 방지하기 위해 여러 개의 시일이 조립된다. 시일재료는 강성이 커서 조립에 어려움이 있기 때문에 자른 후 조립하는 방법을 모색하였다. 절단면의 모양은 L형과 /형으로 하였고 유압이 작용할 때 누유 기준은 절단면에 발생하는 접촉압력으로 하였다. 시일의 구조와 재료는 이중 탄성중합체로 구성되며 강성이 큰 PE 재질만 절단한 경우에 대하여 비선형 접촉 구조해석을 수행하였다. 연구결과 절단 길이가 짧을수록 누유 방지에 유리하며 PE와 하우징이 접촉하는 윗면보다 NBR과 PE가 접촉하는 아랫면으로 누유될 가능성이 큰 것으로 나타났다.

CMP 연마입자의 마찰력과 연마율에 관한 영향 (Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP))

  • 김구연;김형재;박범영;이현섭;박기현;정해도
    • 한국전기전자재료학회논문지
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    • 제17권10호
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    • pp.1049-1055
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    • 2004
  • Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

삼차원 곡면에 대한 접촉해석기법의 개발 (Development of Contact Algorithms for Three Dimensional Surfaces)

  • 박채현;박종진
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 1994년도 추계학술대회 논문집
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    • pp.157-164
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    • 1994
  • Finite element analysis of material deformation is successfully utilized to understand metal forming processes such as forging, extrusion and deep drawing. However, such analysis involves contact problems; a free node touches a die surface and a contact node slips along the die surface. In the present investigation, appropriate contact algorithms were developed assuming that a three dimensional surface can be divided into bilinear patches and that nodal velocities are linear during an incremental time. The algorithms were coded into a computer program and tested for a simple surface. Comparison of the test result with that obtained from a commercial code is presented and discussed.

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