• Title/Summary/Keyword: Contact Interface

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Efficient Shadow-Test Algorithm for the Simulation of Dry Etching and Topographical Evolution (건식 식각 공정 시뮬레이션을 위한 효율적인 그림자 테스트 알고리즘과 토포그래피 진화에 대한 연구)

  • Kwon, Oh-Seop;Ban, Yong-Chan;Won, Tae-Young
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.2
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    • pp.41-47
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    • 1999
  • In this paper, we report 3D-simulations of a plasma etching process by employing cell-removal algorithm takes into account the mask shadow effect os well as spillover errors. The developed simulator haas an input interface to take not only an analytic form but a Monte Carlo distribution of the ions. The graphic user interface(GUI) was also built into the simulator for UNIX environment. To demonstrate the capability of 3D-SURFILER(SURface proFILER), we have simulated for a typical contact hole structure with 36,000($30{\times}40{\times}30$) cells, which takes about 20 minutes with 10 Mbytes memory on sun ultra sparc 1. as an exemplary case, we calculated the etch profile during the reactive ion etching(RIE) of a contact hole wherein the aspect ratio is 1.57. Furthermore, we also simulated the dependence of a damage parameter and the evolution of topography as a function of the chamber pressure and the incident ion flux.

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Stress Analysis and Lead Pin Shape Design in PGA (Pin Grid Array) Package (PGA (Pin Grid Array) 패키지의 응력해석 및 Lead Pin 형상설계)

  • Cho, Seung-Hyun;Choi, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.29-33
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    • 2011
  • Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

A STUDY ON THE STABILITY OF IMPLANT SCREW BY USE OF THE SEALER (Sealer의 사용이 임프란트 나사의 안정성에 미치는 영향)

  • Lee Heung-Tae;Kim Nak-Hyung;Chung Chae-Heon
    • The Journal of Korean Academy of Prosthodontics
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    • v.39 no.4
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    • pp.366-375
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    • 2001
  • The objective of this study was to investigate the surface contact and screw joint stability between screw and implant interface by use of sealer. The implants evaluated in this study were Steri-Oss futures(Hexlock $3.8D{\times}10mm$: Steri-Oss, Yorba Linda, CA), and Steri-Oss staight abutment. Titanium alloy screws were used to secure abutments to implants. The other titanium alloy screws applicating sealer(Impla-Seal, Implant Support Systems, Inc. Irvine, CA) were used to secure abutments to implants. In one another sample, 6kg of force was applied during simulated intraoral movements after abutment screws were secured to the implants with sealer. All samples were cross sectioned with sandpaper and polished with $0.1{\mu}m\;Al_2O_3$. Then samples were recorded with an scanning electron microscope. The results were as follows : 1. In the case of titanium alloy screw, irregular contacts and relatively large gap were present at thread mating surface. Also abutment screw/implant interface demonstrate incomplete seating and only one surface contact of threads between implant and screw. 2. In the case of titanium alloy screw applecating sealer, sealer was present between implant and screw. Therefore implant and screw had relatively close and tight contact without the presence of large gap. 3. On the other hand, in the case of titanium alloy screw applicating sealer and dynamic loading of suprastructures, sealer was partially present between implant and screw. Conclusively, sealer fills voids, creating a barrier to moisture and bacteria. In addition, loading of suprastructures may change the situation and limit the indications for gap sealing.

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A Comparison of Spot Weldability with Electrode Force Changes in Surface Roughness Textured Steel (가압력 변화에 따른 표면조도처리 강판의 저항 점 용접성 비교)

  • Park, Sang-Soon;Park, Yeong-Do;Kim, Ki-Hong;Choi, Yung-Min;Rhym, Young-Mok;Kang, Nam-Hyun
    • Journal of Welding and Joining
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    • v.26 no.2
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    • pp.75-84
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    • 2008
  • With the development of surface roughness textured steel for automotive body-in-white assemble, one of key issues is to understand the role of the surface roughness in textured steel sheets. To investigate effect of surface roughness on weldability in prepared steels, electrode force was varied. Steel sheets (T-H) with high surface roughness ($Ra\;=\;1.94\;{\mu}m$) reduced electrode life. It was attributed to the higher contact resistance at the electrode-sheet interface in the presence of the high surface roughness. The increased electrode diameter decreased current density, therefore reducing weld electrode life due to small weld button size. When an increased electrode force was used, a significant increase in the electrode life was observed in welding of high surface roughness steel sheet. This study suggested that contact resistance at the electrode-sheet interface was the dominant factor, as compared to the sheet-sheet interface for determining electrode life in welding of surface roughness textured steel.

Investigation of continuous and discontinuous contact cases in the contact mechanics of graded materials using analytical method and FEM

  • Yaylaci, Murat;Adiyaman, Gokhan;Oner, Erdal;Birinci, Ahmet
    • Computers and Concrete
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    • v.27 no.3
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    • pp.199-210
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    • 2021
  • The aim of this paper was to examine the continuous and discontinuous contact problems between the functionally graded (FG) layer pressed with a uniformly distributed load and homogeneous half plane using an analytical method and FEM. The FG layer is made of non-homogeneous material with an isotropic stress-strain law with exponentially varying properties. It is assumed that the contact at the FG layer-half plane interface is frictionless, and only the normal tractions can be transmitted along the contacted regions. The body force of the FG layer is considered in the study. The FG layer was positioned on the homogeneous half plane without any bonds. Thus, if the external load was smaller than a certain critical value, the contact between the FG layer and half plane would be continuous. However, when the external load exceeded the critical value, there was a separation between the FG layer and half plane on the finite region, as discontinuous contact. Therefore, there have been some steps taken in this study. Firstly, an analytical solution for continuous and discontinuous contact cases of the problem has been realized using the theory of elasticity and Fourier integral transform techniques. Then, the problem modeled and two-dimensional analysis was carried out by using ANSYS package program based on FEM. Numerical results for initial separation distance and contact stress distributions between the FG layer and homogeneous half plane for continuous contact case; the start and end points of separation and contact stress distributions between the FG layer and homogeneous half plane for discontinuous contact case were provided for various dimensionless quantities including material inhomogeneity, distributed load width, the shear module ratio and load factor for both methods. The results obtained using FEM were compared with the results found using analytical formulation. It was found that the results obtained from analytical formulation were in perfect agreement with the FEM study.

Investigations of Pd Based hybrid ohmic contacts to high-low doped n-type GaAs

  • Baik, Hong-Koo;Kwak, Joon-Seop
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1997.06a
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    • pp.231-236
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    • 1997
  • To improve electrical properties and uniformity of high-low doped n-type GaAs, new ohmic contacts with a low-resistance and the superior uniformity was developed using a concept of hybrid ohmic contact. The hybrid ohmic contact displayed good surface and interface morphology and had minimum contact resistivity of 3${\times}$10-6 $\Omega$$\textrm{cm}^2$ in a wide annealing temperature ranged from 340$^{\circ}C$ to 420$^{\circ}C$, which was much wider than that of conventional ohmic contacts. The microstructural analysis showed that the Pd/Ge ohmic contact at low annealing temperature (∼300$^{\circ}C$) and also annealing temperature (∼400$^{\circ}C$), resulting ij hybrid ohmic contacts.

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Effect of Elastic/Plastic Mismatch on the Contact Crack Initiation in Asymmetric Layered Composite (층상형 비대칭성 복합재료의 탄성/소성 불일치가 접촉 균열의 개시에 미치는 영향)

  • Kim, Sang-Kyum;Lee, Kee-Sung
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.04a
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    • pp.195-198
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    • 2005
  • The role of elastic/plastic mismatch on the contact crack initiation is investigated for designing desirable surface-coated asymmetric layered composites. Various layered composites such as $Si_3N_4$ ceramics on $Si_3N_4+BN$ composite, soda-lime glass on various substrates with different elastic modulus for the analysis. Spherical indentation is conducted for producing contact cracks from the surface or interface between the coating and the substrate layer. A finite element analysis of the stress fields in the loaded layer composites enables a direct correlation between the damage patterns and the stress distributions. Implications of these conclusions concerning the design of asymmetric layered composites indicate that the elastic modulus mismatch is one of the important parameter for designing layered composite to prevent the initiation of contact cracks.

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Mixed Lubrication Analysis of Cam/Tappet Interface on the Direct Acting Type Valvetrain System

  • Cho, Myung-Rae;Shin, Heung-Ju;Han, Dong-Chul
    • Journal of Mechanical Science and Technology
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    • v.15 no.6
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    • pp.685-692
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    • 2001
  • This paper reports on the mixed lubrication characteristics between the cam and the tappet contact surface of direct acting type valve train systems. First, the dynamic characteristics are solved by using the lumped mass method to determine the load conditions at the contact point. Then, the minimum oil film thickness is calculated with consideration of elastohydrodynamic line contact theory and the friction force is obtained by using the mixed lubrication model which separates the hydrodynamic and the boundary friction. Finally, the average surface temperatures are calculated by using the flash temperature theory. The results show that, there are some peaks in the friction force due to the asperity contact friction, and flash temperature at the position of minimum oil film thickness. It is thought that there is a relationship between the surface temperature and cam surface wear, and therefore, the analysis on the worn cam profile has been performed.

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Analysis of the Solidification Process at a Vertical Wall With Thermal Contact Resistance (접촉열저항이 있는 수직벽에서의 응고과정 해석)

  • 이진호;모정하;황기영
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.1
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    • pp.193-201
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    • 1995
  • The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.

Analysis of Multi-Chained and Multiple Contact Characteristics of Foot Mechanisms in Aspect of Impulse Absorption (다수 체인과 다중 접촉 성격을 지닌 발 메커니즘에 대한 충격량 흡수 기반 해석)

  • Seo, Jong-Tae;Oh, Se Min;Yi, Byung-Ju
    • The Journal of Korea Robotics Society
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    • v.12 no.2
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    • pp.161-172
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    • 2017
  • Foot mechanisms play the role of interface between the main body of robotic systems and the ground. Biomimetic design of the foot mechanism is proposed in the paper. Specifically, multi-chained and multiple contact characteristics of general foot mechanisms are analyzed and their advantages are highlighted in terms of impulse. Using Newton-Euler based closed-form external and internal impulse models, characteristics of multiple contact cases are investigated through landing simulation of an articulated leg model with three kinds of foot. It is shown that in comparison to single chain and less articulated linkage system, multi-chain and articulated linkage system has superior characteristic in terms of impulse absorption as well as stability after collision. The effectiveness of the simulation result is verified through comparison to the simulation result of a commercialized software.