• Journal of Powder Materials
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• v.18 no.5
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• pp.423-429
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• 2011

Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.104.2-104.2
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• 2007

• Journal of Powder Materials
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• v.23 no.6
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• pp.414-419
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• 2016

Much attention has been paid to thermally conductive materials for efficient heat dissipation of electronic devices to maintain their functionality and to support lifetime span. Hexagonal boron nitride (h-BN), which has a high thermal conductivity, is one of the most suitable materials for thermally conductive composites. In this study, we synthesize h-BN nanocrystals by pyrolysis of cost-effective precursors, boric acid, and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, h-BN nanoparticles with diameters of ~80 nm are synthesized. We demonstrate that the addition of small amounts of Eu-containing salts during the preparation of melamine borate precursors significantly enhanced the crystallinity of h-BN. In particular, addition of Eu assists the growth of h-BN nanoplatelets with diameters up to ~200 nm. Polymer composites containing both spherical $Al_2O_3$ (70 vol%) and Eu-doped h-BN nanoparticles (4 vol%) show an enhanced thermal conductivity (${\lambda}{\sim}1.72W/mK$), which is larger than the thermal conductivity of polymer composites containing spherical $Al_2O_3$ (70 vol%) as the sole fillers (${\lambda}{\sim}1.48W/mK$).

• Journal of the Korea Concrete Institute
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• v.20 no.3
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• pp.369-374
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• 2008

Two types of conductive materials are selected and their applicable properties are investigated so as to give the capability of self-diagnosis of fracture in composite mortar, concrete and reinforced concrete. In this study, for giving selfdiagnosis capability, the powder of cokes and milled carbon fiber as conductive materials are selected and intermixed with mortar, concrete and reinforced concrete. After examining change in the value of electric resistance before and after the occurrence of cracks at each flexural load-stage in composite mortar, concrete or reinforced concrete, the relationships of each factors (electric resistance, crack and flexural load) are analyzed. As the results, it can be recognized that conductive materials with powder of cokes and milled carbon fiber can be applied for self-diagnosis of flexural fracture in composite mortar, concrete and reinforced concrete specimen.

• Journal of the Korean Society of Safety
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• v.19 no.4 s.68
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• pp.80-85
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• 2004

Electromagnetic interference(EMI) shielding characteristics of composite filled with Cu flake and carbon brush powder as hybrid conductive filler and EAF slag have been studied. The coaxial transmission line method of ASTM D4935-99 was used to measure the EMI Shielding effectiveness of composites as formulation in frequency rage $100\~1,000MHz$ The SE also increases with the increase in flier loading. The hybrid filler filled composites show higher SE compared to that of only Cu flake. The correlation between SE and conductivity of the various composites is also discussed. The results indicate that the composites having higher filler loading$({\geq}40wt.\%)$ can be used for the purpose of safety materials to protect hazardous electromagnetic interference.

• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1466-1468
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• 2009

The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.

• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.1
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• pp.113-120
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• 2007

A new material was tested and its applicability was investigated so as to give the capability of self-diagnosis of fracture in composite mortar. In the research for giving self-diagnosis capability, conductive mortar intermixed with cokes and carbon fiber powder(milled carbon fiber) was developed and its using for self-diagnosis material was proposed. Then after examining change in the value of electric resistance and AE characteristics before and after the occurrence of cracks at each weight-stage, the relationships of each factors were analyzed. As the results, it can be recognized that a new composite material with cokes and carbon fiber powder(milled carbon fiber) can be applied for self-diagnosis of fracture in mortar specimen.

• Korean Journal of Metals and Materials
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• v.46 no.12
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• pp.817-822
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• 2008

Metal matrix composite (MMC) materials having low electrical contact resistance based on 316L stainless steel (STS) matrix alloy with $ZrB_2$ particles were fabricated for PEMFC (Polymer Electrolyte Membrane Fuel Cell) separator by powder metallurgy (PM). The effects of the boride particle addition into the matrix alloy on microstructure, surface morphology, and interfacial contact resistance (ICR) between the samples and gas diffusion layer (GDL) were investigated. Both conventional and PM 316L STS samples showed high ICR due to the existence of non-conductive passive film on the alloy surface. The addition of the boride particles, however, remarkably reduced ICR of the samples. SEM observation revealed that the boride particles were protruded out of the matrix surface and particle density existing on the surface increased with increasing the boride content, causing increase of the total contact area between the conductive particles and GDL. ICR of the samples also decreased with increasing the boride content resulted from the increased contact area.

• Applied Chemistry for Engineering
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• v.23 no.6
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• pp.554-560
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• 2012

Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.