• 한국정밀공학회지
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• 제17권6호
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• pp.96-102
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• 2000

The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

• 융복합기술연구소 논문집
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• 제6권2호
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• pp.1-7
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• 2016

The rotating electrodynamic wheels can produce three-axial forces on the conductive target. The forces are linked strongly each other, and their magnitudes depend on the rotating speed of the wheel. However, the wheels can be used effectively as an actuating principle for transfer system of conductive material. The conductive material is a pipe with a constant cross-section or a conductive plate. In this paper, a few applications using the electrodynamic wheels as transferring means are introduced including the full description of the real hardware implementation.

• 한국전기전자재료학회논문지
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• 제28권12호
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• pp.813-820
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• 2015

We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.

• 전기전자학회논문지
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• 제22권1호
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• pp.193-196
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• 2018

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

• 대한기계학회논문집A
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• 제30권8호
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• pp.949-956
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• 2006

The method of Greenwood and Williamson is extended to obtain a solution to the coupled non-linear problem of steady-state electrical and thermal conduction across a crack in a conductive layer, for which the electrical resistivity and thermal conductivity are functions of temperature. The problem can be decomposed into the solution of a pair of non-linear algebraic equations involving boundary values and material properties. The new mixed-boundary value problem given from the thermal and electrical boundary conditions for the crack in the conductive layer is reduced in order to solve a singular integral equation of the first kind, the solution of which can be expressed in terms of the product of a series of the Chebyshev polynomials and their weight function. The non-existence of the solution for an infinite conductor in electrical and thermal conduction is shown. Numerical results are given showing the temperature field around the crack.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.1105-1107
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• 1999

The purpose of termination for high voltage tests of XLPE power cable is to prevent flashover during the breakdown test of specimen as well as to withstand the specified voltage between its conductor and screen without failure. For easier treatment and simpler construction of testing termination, resistivity grading method using semi-conductive material was employed. Based on the fundamental theory, its failure characteristics by changing the resistivity of semi-conductive material on the insulation surface was investigated. With two layers construction by difference resistivity on their surfaces, much improved result than that of one resistivity was obtained through the experiment for MV cable.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.417-417
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• 2009

Although a transparent conductive film (TCF) belongs to essential supporting materials for many device applications such as touch screens, flat panel displays, and sensors, a conventional transparent conductive material, indium-tin oxide (ITO), suffers from considerable drawback because the price of indium has soared since 2001. Despite a recent falloff, a demand of ITO is expected to increase sharply in the future due to the trend of flat panel display technologies toward flexible, paper-like features. There have been recently extensive studies to replace ITO with new materials, in particular, carbon nanotubes (CNTs) since CNTs possess excellent properties such as flexibility, electrical conductivity, optical transparency, mechanical strength, etc., which are prerequisite to TCFs. This study fabricated TCFs with single-walled carbon nanotubes (SWCNTs) produced by arc discharge. The SWCNTs were dispersed in water with a surfactant of sodium dodecyl benzene sulfonate (NaDDBS) under sonication. Carbon black and fullerene nanoparticles were added to the SWCNT-dispersed solution to enhance contact resistance between CNTs. TCFs were manufactured by a filtration and transfer method. TCFs added with carbon black and fullerene nanoparticles were characterized by scanning electron microscopy (SEM), UV-vis spectroscopy (optical transmittance), and four-point probe measurement (sheet resistance).

• 한국지반환경공학회 논문집
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• 제24권1호
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• pp.15-23
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• 2023

그라우팅 공법은 연약지반의 차수 및 보강을 목적으로 시공되는 공법이다. 그라우트가 지반 내에 주입될 때, 지반을 구성하는 지반의 형태, 토립자의 크기, 공극율 및 지하수의 유무에 따라 그라우트가 침투 및 확산하는 형태가 다양하게 나타나고 있으나, 그라우팅 설계 시에는 이러한 요인을 적용하기 어려운 실정이다. 따라서, 본 연구에서는 전도성 재료를 함유한 그라우트를 지반내로 주입하는데 있어서 전도성 재료 첨가에 따른 그라우트의 침투 성능을 파악하기 위하여 실내시험을 수행하였다. 주입시험에서는 전도성 재료를 혼합수의 0%, 3% 및 5%를 그라우트에 첨가하고, 원지반 조건을 자갈과 규사로 구성된 다양한 지반으로 조성하였다. 전도성 그라우트는 전용주입장치를 사용하여 모형지반 내로 압력에 의해 주입되면서 주입시간(t), 압력(p), 유속(v) 및 주입량(q)를 계측하고, 모형지반 내 주입된 경화체를 채취하여 침투성능을 평가하였다. 그라우트 주입실험 결과에서는 전도성 재료의 사용량과 그라우트 주입율은 역의 관계를 나타내었으며, 모형지반 토립자 크기에 따라 침투형태가 변화되는 것을 확인하였다. 전도성 재료를 함유한 그라우트는 지반 내 침투가 비교적 양호하고 경화체의 강도 및 내구성이 우수하여 그라우트의 침투범위 측정을 위한 첨가제로 사용하는 것이 가능하다고 판단하였다.

• 공업화학
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• 제21권2호
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• pp.115-128
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• 2010

마이크로 프로세서 및 항공 우주산업의 기술 발전에 따른 냉각 조건이 까다로워짐에 따라 각종 산업에서 열 전도 향상을 통한 기기 내에서 외부로의 열 배출은 최근 각광을 받고 있다. 특히 열 전도성 고분자 복합재료의 경우 매우 다양한 물질을 사용하여 그 요구조건에 맞는 부품의 생산이 가능하고 가공 편의성으로 인한 마이크로 부품에서부터 큰 부속품까지 그 사용 범위가 넓다. 방열 소재로 사용되는 고분자 복합재료의 열전도도 예측 모델 식을 알아보고 방열 소재에 대해 알아보며 상업적으로 많이 사용되고 있는 충전제에 대해 다룬다. 또한 최근의 고분자 복합재료 방열소재의 동향에 대해 알아본다.

• 한국전기전자재료학회논문지
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• 제22권3호
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.