• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.349-352
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• 1989

Poling piezoelectric ceramic-polymer composites with 0-3connectivity is difficult because of the high dielectric constant of most of the ferroelectric filler materials, and the high resistivity of the polymer matrix. To aid in poling this type of composite, conductivity of the polymer phase can be controlled by adding small amount of a semiconductor phase such as germanium, carbon or silicon. In this study, flexible piezoelectric composites of $PbTiO_3$ powder and Eccogel polymer were developed using small amounts of a semiconducting phase. These composites were poled rapidly at low voltages, resulting in properties superior to composites prepared without a conductive phase. The effect of addition of various conductive phase with different volume percentage on the dielectric and piezoelectric properties of the composite are discussed here.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.234-234
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• 2015

Metallic microwires are a promising material for use as a filler in various conductive composite structures. Because of their high anisotropy in shape, a low percolation threshold could be achieved, which is beneficial to a low-cost fabrication and better electrical conductivity even under an extremely low solid content. Here we developed a facile method to fabricate the Cu (core)-Ni (shell) microwires.

• Elastomers and Composites
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• v.52 no.2
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• pp.136-142
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• 2017

Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

• Polymer(Korea)
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• v.38 no.6
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• pp.782-786
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• 2014

Various kinds of thermal conductive ceramic/polymer composites (aluminum nitride, aluminum oxide, boron nitride, and silicon carbide/epoxy) were prepared by a casting method and their optical images were observed by FE-SEM. Among these, SiC/epoxy composite shows inhomogeneous dispersion features of SiC and air voids in the epoxy matrix layer, resulting in undesirable thermal conductive properties. To enhance the thermal conductivities of SiC/epoxy composites, the epoxy wetting method which can directly infiltrate the epoxy droplet onto filtrated SiC cake was employed to fabricate the homogeneously dispersed SiC/epoxy composite for ideal thermal conductive behavior, with maximum thermal conductivity of 3.85W/mK at 70 wt% of SiC filler contents.

• Journal of Adhesion and Interface
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• v.9 no.3
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• pp.7-13
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• 2008

The particulate type silicon carbide (SiC) and fiber type carbon fiber (CF) filler, of similar thermal conductivities, were mixed with polyetheretherketone (PEEK) to investigate the filler effects on the thermal diffusivity. The SiC and CF fillers had a good and uniform dispersion in PEEK matrix. Thermal diffusivities of PEEK composites were measured from ambient temperature up to $200^{\circ}C$ by laser flash method. The diffusivities were decreased as increasing temperature due to the phonon scattering between PEEK-filler and filler-filler interfaces. Thermal diffusivity of PEEK composites was increased with increasing filler content and the thermal conductivities of two-phase system were compared to the experimental results and it gave ideas on the filler dispersion, orientation, aspect ratio, and filler-filler interactions. Nielson equation gave a good prediction to the experimental results of PEEK/SiC. The easy network formation by CF was found to be substantially more effective than SiC and it gave a higher thermal diffusivities of PEEK/CF than PEEK/SiC.

• Polymer(Korea)
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• v.29 no.2
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• pp.161-165
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• 2005

$\alpha,\omega-Vinyl$ poly(dimethyl-methylphenyl) siloxane propelymer (VPMPS ) was prepared by the equilibrium polymerization of octamethylcyclotetrasiloxane $(D_4)$, 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane $(D_3^{MePh})$, and 1,1,3,3-tetramethyl-1,3-divinylsiloxane (MVS) as end-blocker. And also, $\alpha,\omega-hydrogen$ poly(dimethyl-methyltrifluoropropyl)siloxane prepolymer (HPDMFS) was prepared from $D_4$, 1,3,5-trimethyl-1,3.5-trifluoropropylcyclotrisiloxane $(D_3^{MeF3P})$, and 1,1,3,3-tetramethyldisiloxane. Poly(organosiloxane) rubber composite containing high thermal conductive filler was prepared by compounding VPMPS, HPDMFS, spherical alumina, and catalyst in high speed dissolver. The crosslinking density of poly (organosiloxane) composite was measured by oscillation rheometer. Poly(organosiloxane) composites of TC-POXR-2 and TC-POXR-4 prepared by controlling average diameters of thermal conductive filler, spherical alumina according to Horsfield's packing model were shown to 1.13 W/mK for TC-POXR-2 and 1.19 W/mK for TC-POXR-4.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Macromolecular Research
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• v.10 no.5
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• pp.253-258
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• 2002

The multi-wall carbon nanotubes (MWNTs) with graphite crystal structure were synthesized by the catalytic decomposition of a ferrocene-xylene mixture in a quartz tube reactor to use as the conductive filler in the binary polymer matrix composed of poly(vinylidene fluoride) (PVdF) and poly(vinyl pyrrolidone) (PVP) for the EMI (electromagnetic interference) shielding applications. The yield of MWNTS was significantly dependent on the reaction temperature and the mole ratio of ferrocene to xylene, approaching to the maximum at 800 $^{\circ}C$ and 0.065 mole ratio. The electrical conductivity of the MWNTs-filled PVdF/PVP composite proportionally depended on the mass ratio of MWNTs to the binary polymer matrix, enhancing significantly from 0.56 to 26.7 S/cm with the raise of the mass ratio of MWNTs from 0.1 to 0.4. Based on the higher electrical conductivity and better EMI shielding effectiveness than the carbon nanofibers (CNFs)-filled coating materials, the MWNTs-filled binary polymer matrix showed a prospective possibility to apply to the EMI shielding materials. Moreover, the good adhesive strength confirmed that the binary polymer matrix could be used for improving the plastic properties of the EMI shielding materials.

• Elastomers and Composites
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• v.48 no.1
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• pp.76-84
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• 2013

The term 'Piezoresistive effect' describes a change in the electrical resistance of the material from deformed to its original shape by the external pressure, e.g., elongation, compression, etc. This phenomenon has various applications of sensors for monitoring pressure, vibration, and acceleration. Although there are many materials which have the piezoresistive effect, rubber (nano)composites with conductive fillers have attracted a great deal of attention because the piezoresistive effect appears at the various range of pressure by controlling the type of filler, particle size, particle shape, aspect ratio of particles, and filler content. Especially one can obtain the composites with elasticity and flexibility by using the rubber as a matrix. This paper aims to review the piezoresistive effect itself, their basic principles, and the various conductive rubber-composites with piezoresistive effect.

• Composites Research
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• v.31 no.6
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• pp.412-420
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• 2018

In this work, phenolic resins containing conductive carbon fillers, such as, petroleum coke, carbon black, and graphite, were used to improve the surface heating elements by impregnating a pitch-based carbon paper. The influence of conductive carbon fillers on physicochemical properties of the carbon paper was investigated through electrical resistance measurement and thermal analysis. As a result, the surface resistance and interfacial contact resistivity of the carbon paper were decreased linearly by impregnating the carbon fillers with phenol resins. The increase of carbon filler contents led to the improvement of electrical and thermal conductivity of the carbon paper. Also, the heating characteristics of the surface heating element were examined through the applied voltage of 1~5 V. With the applied voltage, it was confirmed that the surface heating element exhibited a maximum heating characteristic of about $125.01^{\circ}C$(5 V). These results were attributed to the formation of electrical networks by filled micropore between the carbon fibers, which led to the improvement of electrical and thermal properties of the carbon paper.