• Journal of the Korean Ceramic Society
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• v.50 no.5
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• pp.309-318
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• 2013

Graphene has attracted considerable attention since its first production from graphite in 2004, due to its outstanding physical and chemical properties. The development of production methodsfor large scale, high quality graphene films is an essentialstep toward realizing graphene applications such as transparent, conductive film. Chemical deposition methods, using metal catalystsand gaseous carbon sources, have been extensively developed for large area synthesis. In this paper, wereview recent progress ingraphene production, and survey the role of graphene electrodes in various electronic devices such as touch panels, solar cells, solid statelighting and microelectronic devices.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.2
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• pp.61-67
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• 2006

Dielectric and conductive frequency spectra in 0.01 Hz-13 MHz range have been measured for the composite consisting of PZT inclusions dispersed in $LiCIO_{4}$-doped polyerhylene oxide(Li_PEO) matrix with various volume fractions. The dielectric and conductive spectra of the composites revealed the relaxations related with electrode polarization and interfacial polarization. The observed spectra were reproduced using the empirical dielectric function and we could obtain various parameters related to the above two kinds of polarizations and dicussed about the parameters.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.510-514
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• 1997

The thin film that is electrically conductive and optically transparent is called conductive transparent thin film. ITO(Indium-Tin Oxide) which is a kind of conductive transparent thin film has been widely used in solar cell, transparent electrical heater, selective optical filter, FDP(Flat Display Panel) such as LCD(Liquid Crystal Display), PDP(Plasma Display Panel) and so on. Especially in PDP, ITO films is used as a transparent electrode in order to maintain discharge and decrease consumption power through the improvement of cell structure. In this study, we prepared ITO by reactive r.f. sputtering with indium-tin(Sn 10wt%) alloy target instead of indium-tin oxide target. The ITO films deposited at low temperature 15$0^{\circ}C$ and 8% $O_2$. Partial pressure showed about 3.6 Ω/$\square$. At the end of firing, the resistance of ITO was decreased, the optical transparence was improved above 90%.

• Journal of the Korean institute of surface engineering
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• v.47 no.5
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• pp.269-274
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• 2014

Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.667-672
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• 2004

An experimental study has been carried out to investigate the frosting behavior on the plate of thermally conductive plastic (PBT based resin) by comparing it with those of aluminum and some plastic test specimens (PTFE based resin). It is found that the frosting behavior of plastic specimens with 1 mm thickness shows similar trend to that of aluminum except PTFE. The properties of frost formed on the specimens are found to be affected by both thermal conductivity and surface characteristics of the materials. The results indicate that the heat and mass transfer rates of PBT resin are almost equivalent to those of aluminum.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.87-91
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• 2019

As a highly conductive and transparent electrode, ITO/Ag/ITO multilayers are fabricated using an in-line sputtering method. Optimal thickness conditions have been investigated in terms of the optical transmittance and the electrical conductance. Considering the optical properties, in this study, the experimental characteristics are analyzed based on theoretical phenomena, and they are compared with the simulated results. The simulations are based on the finite-difference-time-domain (FDTD) method in solving linear Maxwell equations. Consequently, the results showed that ITO/Ag/ITO multilayer structures with respective thicknesses of 39.2 nm/10.7 nm/39.2 nm are most suitable with an average transmittance of about 87% calculated for wavelengths ranging from 400-800 nm and a sheet resistance of about $7.1{\Omega}/{\square}$.

• Applied Chemistry for Engineering
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• v.31 no.1
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• pp.73-83
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• 2020

As electronic devices become more advanced and smaller, one of the biggest problems to solve is the heat affecting the efficiency and lifetime of instruments. High thermal conductivity materials, in particular, metal or ceramic ones, have been used to reduce the heat generated from devices. However, due to their low mechanical properties and high weight, thermally conductive composites composed with polymers having a light-weight and good mechanical properties as a matrix and carbon materials having high thermal conductivity as a thermally conductive filler have been attracting great attention. To improve the thermal conductivity of the composites, a phonon scattering must be suppressed to move phonon effectively. In this review, we classified researches related to phonon migration and scattering inhibition of carbon/polymer composites, and discussed various methods to improve thermal conductivity.

• Fashion & Textile Research Journal
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• v.16 no.1
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• pp.145-152
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• 2014

The usage of textile-based sensors has increased due to their many advantages (compared to IT sensors) when applied to body assessment and comfort. Textile-based sensors have different detecting factors such as pressure, voltage, current and capacitance to investigate the characteristics. In this study, textile-based sensor fabrics with sheath-core type conductive yarns were produced and the relationship between capacitance changes and applied load was investigated. The physical and electric properties of textile-based sensor fabrics were also investigated under various laminating conditions. A textile based pressure sensor that uses a sheath-core conductive yarn to ensure the stability of the pressure sensor in the textile-based sensor (the physical structure of the reaction characteristic of the capacitance) is important for the stability of the initial value of the initial capacitance value outside the characteristic of the textile structural environment. In addition, a textile based sensor is displaced relative to the initial value of the capacitance change according to pressure changes in the capacitance value of the sensor due to the fineness of the high risk of noise generation. Changing the physical structure of the fabric through the sensor characteristic of the pressure sensor via the noise generating element of laminating (temperature, humidity, and static electricity) to cut off the voltage output element to improve the data reliability could be secured.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.154-154
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• 2008

Although the screen printing technology using photosensitive carbon nanotube (CNT) paste has many advantages such as low cost, simple process, uniform emission, and capability of mass production, the CNT paste needs to be improved further in CNT dispersion, printability, adhesion, electrical conductivity, population of CNT emitters, etc. Ball milling has been frequently employed to prepare the CNT paste as ball milling can mix its ingredients very well and easily cut the long, entangled CNTs. This study carried out a parametric approach to fabricating the CNT paste in terms of low-energy ball milling and a paste composition. Field emission properties of the CNT paste was characterized with CNT dispersion and electrical conductivity which were measured by a UV-Vis spectrophotometer and a 4-point probe method, respectively. Main variables in formulating the CNT paste include a length of milling time, and amounts of CNTs and conductive inorganic fillers. In particular, we varied not only the contents of conductive fillers but also used two different sizes of filler particles of ${\mu}m$ and nm ranges. Among many variations of conductive fillers, the best field emission characteristics occurred at the 5 wt% fillers with the mixing ratio of 3:1 for ${\mu}m$-and nm-sizes. The amount and size of fillers has a great effect on the morphology, processing stability, and field emission characteristics of CNT emitter dots. The addition a small amount of nm-size fillers considerably improved the field emission characteristics of the photosensitive CNT paste.