• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.9 no.3
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• pp.173-178
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• 2009

We have investigated the electrical properties of oxide metal thin film device. The device has been fabricated top-top electrode structure and its transport properties are measured in order to study the resistance change. Electrical properties with linear voltage sweep on a electrodes are used to show the variation of resistance of oxide metal thin film device. Fabricated oxide metal thin film device with MIM structure is changed from a low conductive Off-state to a high conductive On-state by the external linear voltage sweep. The $Si/SiO_2/MgO$ device is switched from a high resistance state to a low resistance state by forming. Consequently, we believe oxide metal is a promising material for a next-generation nonvolatile memory and other electrical applications.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.59-62
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• 2013

At an infra-red (IR) wavelength of 1,064 nm, a diode-pumped Q-switched $Nd:YVO_4$ laser was used for the direct patterning of various transparent conductive oxide (TCO) thin films on glass substrate. With various laser beam conditions, the laser ablation results showed that the indium tin oxide (ITO) film was removed completely. In contrast, zinc oxide (ZnO) film was not etched for any laser beam conditions and indium gallium zinc oxide (IGZO) was only ablated with a low scanning speed. The difference in laser ablation is thought to be due to the crystal structures and the coefficient of thermal expansion (CTE) of ITO, IGZO, and ZnO. The width of the laser-patterned grooves was dependent on the film materials, the repetition rate, and the scanning speed of the laser beam.

• Korean Journal of Materials Research
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• v.27 no.12
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• pp.695-698
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• 2017

ZnMgBeGaO/Ag/ZnMgBeGaO multilayer structures were sputter grown and characterized in detail. Results indicated that the electrical properties of the ZnMgBeGaO films were significantly improved by inserting an Ag layer with proper thickness (~ 10 nm). Structures with thicker Ag films showed much lower optical transmission, although the electrical conductivity was further improved. It was also observed that the electrical properties of the multilayer structure were sizably improved by annealing in vacuum (~35 % at $300^{\circ}C$). The optimum ZnMgBeGaO(20nm)/Ag(10nm)/ZnMgBeGaO(20nm) structure exhibited an electrical resistivity of ${\sim}2.6{\times}10^{-5}{\Omega}cm$ (after annealing), energy bandgap of ~3.75 eV, and optical transmittance of 65 % ~ 95 % over the visible wavelength range, representing a significant improvement in characteristics versus previously reported transparent conductive materials.

• Journal of Mechanical Science and Technology
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• v.16 no.10
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• pp.1222-1228
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• 2002

This research is the development of a flexible tactile sensor array for service robots using PVDF (polyvinylidene fluoride) film for the detection of a contact state in real time. The prototype of the tactile sensor which has 8${\times}$8 array using PVDF film was fabricated. In the fabrication procedure, the electrode patterns and the common electrode of the thin conductive tape were attached to both sides of the 281$\mu\textrm{m}$ thickness PVDF film using conductive adhesive. The sensor was covered with polyester film for insulation and attached to the rubber base for a stable structure. The proposed fabrication method is simple and easy to make the sensor. The sensor has the advantages in the implementing for practical applications because its structure is flexible and the shape of the each tactile element can be designed arbitrarily. The signals of a contact force to the tactile sensor were sensed and processed in the DSP system in which the signals are digitized and filtered. Finally, the signals were integrated for taking the force profile. The processed signals of the output of the sensor were visualized in a personal computer, and the shape and force distribution of the contact object were obtained. The reasonable performance for the detection of the contact state was verified through the sensing examples.

• Bulletin of the Korean Chemical Society
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• v.31 no.11
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• pp.3109-3114
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• 2010

Flexible composite films of $V_2O_5$ and conductive polypyrrole ($V_2O_5$/PPy) were grown by facile electrochemical polymerization, wherein an anodization potential was applied to the substrate electrode in an electrolyte solution containing pyrrole monomer and dispersed $V_2O_5$ particles. The coating of polypyrrole (PPy) on the surface of $V_2O_5$ particles was induced by the oxidative catalytic action of $V_2O_5$ during the electrochemical polymerization of pyrrole. PPy in the composite film connects the isolated $V_2O_5$ particles. This results in the formation of conductive networks in the composite film cathode, thereby enhancing the Li+ ion diffusion to the surface of the isolated $V_2O_5$ particles and thus increasing the accessibility of the $Li^+$ ions. The specific capacity tests of the Li rechargeable batteries revealed that the discharge capacity of this composite film cathode was higher, i.e., $497\;mAhg^{-1}$, than that of $V_2O_5$/PPy powder or pristine $V_2O_5$.

• Journal of the Korean Graphic Arts Communication Society
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• v.26 no.1
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• pp.39-50
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• 2008

We have manufactured Ag pastes for gravure printing by adding different solvent contents. Then the gravure printability and properties of conductive patterns gravure-printed by the different rheology characteristics of pastes were investigated. The dispersity of pastes was increased and the viscosity and shear rate dependence of viscosity for pastes were decreased by increasing the solvent content. Also storage modulus G', loss modulus G" and angular frequency value when G" starts to be bigger than G' of pastes were increased by decreasing the solvent content. These mean a flow drop of paste. As a result of gravure printing using two plates which have different line counts(175line and 350line), conductive patterns printed using 175line were spreaded more but Ag packing, thickness and conductivity of the conductive patterns were better than those printed using 350line. And the spread values of conductive patterns were increased with solvent contents but the best properties for Ag packing, surface roughness and conductivity of the conductive pattern were obtained by paste (3) which has 550cps of viscosity at $100s^{-1}$ and tan ${\delta}$ > 1 at 10rad/s. As a result of gravure printing using 350 line plate and paste (3), the conductive pattern has $1.2{\mu}m$ of film thickness and $1.9{\times}10^{-5}{\Omega}{\cdot}cm$ of conductivity.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.348-348
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• 2009

The conductive coating method is used for various industrial fields. For example, Sputtering process is used to coat ITO layer in LCD or OLED panel manufacture process and fabricate a base layer of substrate of an electric printing device. However, conventional coating processes (beam sputtering, spin coating etc.) has a problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers have proposed various printing process instead of conventional coating processes. In this paper, we propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Furthermore, the effect of the nozzle and also the applied voltage on different configuration of the nozzle head was also studied for better understanding of the Electro Static deposition process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.65-66
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• 2006

Solubility of single wall carbon nanotubes (SWNTs) has been determined in various dispersing media by using the solvent parameters such as Kamlet-Taft parameter and 3-dimensional parameters. Nitric acid-treated SWNTs exhibit significantly improved solubility in hydrogen bondable solvents as well as in solvent mixtures. The forming bucky gel with ionic liquid allows for the new group of dissolving solvent. The dissolution behavior of SWNTs provides a route for SWNT dispersion/exfoliation in preparing electrically conductive films such as transparent electrode.

• Applied Chemistry for Engineering
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• v.29 no.3
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• pp.330-335
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• 2018

A new approach for the fabrication of organic-organic conducting composite thin films using simultaneous co-vaporization vapor phase polymerization (SC-VPP) of two or more monomers that have different polymerization mechanisms (i.e., oxidation-coupling polymerization and radical polymerization) was reported for the first time. In this study, a PEDOT-PSMA composite thin film consisting of poly(3,4-ethylenedioxythiophene)(PEDOT) and poly(styrene-co-maleic anhydride)(PSMA) was prepared by SC-VPP process. The preparation of organic-organic conductive composite thin films was confirmed through FT-IR and $^1H-NMR$ analyses. The surface morphology analysis showed that the surface of PEDOT-PSMA thin film was rougher than that of PEDOT thin film. Therefore, PEDOT-PSMA exhibited lower electrical conductivity than that of PEDOT. But the conductivity can be improved by adding 2-ethyl-4-methyl imidazole as a weak base. The contact angle of PEDOT-PSMA was about $50^{\circ}$, as compared to $62^{\circ}$ for PEDOT. The demonstrated methodology for preparing an organic-organic conductive hybrid thin film is expected to be useful for adjusting intrinsic conductive polymer (ICP)'s surface properties such as mechanical, optical, and roughness properties.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.