• The Korean Journal of Ceramics
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• v.6 no.2
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• pp.168-171
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• 2000

VO$_2$ceramics exhibiting a negative temperature coefficient (NTC) of resistivity have been widely used as temperature dependence resistors. The NTC effect similar to $VO_2$ceramics was observed when a low-thermal-expansion ceramic matrix was loaded near the percolation threshold with conductive metal particles. The resistivity in a composite made from silica glass and 20 vol% Ag filler suddenly decreased from $10^{-7}$ to $10^3\;\Omega$cm at about $300^{\circ}C$.

• Journal of Powder Materials
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• v.23 no.6
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• pp.414-419
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• 2016

Much attention has been paid to thermally conductive materials for efficient heat dissipation of electronic devices to maintain their functionality and to support lifetime span. Hexagonal boron nitride (h-BN), which has a high thermal conductivity, is one of the most suitable materials for thermally conductive composites. In this study, we synthesize h-BN nanocrystals by pyrolysis of cost-effective precursors, boric acid, and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, h-BN nanoparticles with diameters of ~80 nm are synthesized. We demonstrate that the addition of small amounts of Eu-containing salts during the preparation of melamine borate precursors significantly enhanced the crystallinity of h-BN. In particular, addition of Eu assists the growth of h-BN nanoplatelets with diameters up to ~200 nm. Polymer composites containing both spherical $Al_2O_3$ (70 vol%) and Eu-doped h-BN nanoparticles (4 vol%) show an enhanced thermal conductivity (${\lambda}{\sim}1.72W/mK$), which is larger than the thermal conductivity of polymer composites containing spherical $Al_2O_3$ (70 vol%) as the sole fillers (${\lambda}{\sim}1.48W/mK$).

• Korean Journal of Metals and Materials
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• v.56 no.12
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• pp.915-920
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• 2018

With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.

• Korean Journal of Materials Research
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• v.10 no.5
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• pp.364-368
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• 2000

SiC fiber reinforced $Si_3N_4$ matrix composites combined with electrical conductive phases of carbon fiber and WC powder fabricated by hot pressing at 1773K. The ability to predict fracture in the ceramic matrix composites was evaluated by measuring simultaneous load-deflection and electrical resistanc difference-deflection curves in four point bending tests. The changes in electrical resistance differences closely corresponded to the fracture behavior of the composites. Different electrical conductive phases are suited to predicting different stages and rates of fracture. These obsevations how that it is possible to perform "in situ" fracture detection in ceramic composites.

• Journal of the Korean Ceramic Society
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• v.44 no.8
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• pp.424-429
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• 2007

Novel conductive $CO_2$ membranes composed of dual phases, molten carbonates and electronic conducting ceramics, were investigated. As the microstructure control of electronic conducting ceramic supports is extremely important to keep the molten carbonates stable in the membranes by a capillary force applied by the pore structure of the supports, we have scrutinized the microstructure of the electronic conducting supports utilizing microscopic images and gas permeability measurement. From the evaluation of the electrical conductivities of the molten carbonates and the electronic conducting ceramic supports, we found that the ionic conductivity of the molten carbonates could determine $CO_2$ flux through the dual phase membranes if the surface exchange rate were relatively high enough.

• Journal of the Korean Ceramic Society
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• v.47 no.4
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• pp.319-324
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• 2010

Screen printable $MoSi_2$ paste and its ceramic sheet heater were investigated. $MoSi_2$ powder without $Mo_5Si_3$ second phase, which causes so-called pest phenomena, was synthesized by SHS technique. Over glaze was also developed for preventing pest phenomenon. The maximum temperature of $MoSi_2$ ceramic heater was over $500^{\circ}C$. After several heat up and cooling cycle, the $MoSi_2$ heater reveals pest phenomenon. Conductive $MoSi_2$ paste could be used in electronic ceramics, i.e., MLCC, LTCC, HTCC, and etc.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.366-369
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• 2005

Electrochemical discharge machining (ECDM) has been found to be potential fur the micro-machining of non-conductive materials such as ceramics or glass. However this machining process has its own inherent problem that the reproducibility is too low to get the available geometric accuracy fur micromachining applications. One main challenge in reaching this goal is the control of the hydrogen built around the tool-electrode in which happen the discharges. This paper proposes the methods to improve the geometric accuracy using powder-mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy by averaging and decreasing the concentration of spark energy.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.181-184
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• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.352-362
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• 2012

This paper explores the use of a variety of carbon nanoparticles to impart electrical, thermal conductivity, good frictional properties to silicon nitride matrices. We used the highly promising types of carbon as carbon nanotubes, exfoliated graphene and carbon black nanograins. A high-efficiency attritor mill has also been used for proper dispersion of second phases in the matrix. The sintered silicon nitride composites retained the mechanical robustness of the original systems. Bending strength as high as 700 MPa was maintained and an electrical conductivity of 10 S/m was achieved in the case of 3 wt% multiwall carbon nanotube addition. Electrically conductive silicon nitride ceramics were realized by using carbon nanophases. Examples of these systems, methods of fabrication, electrical percolation, mechanical, thermal and tribological properties are discussed.

• The Korean Journal of Ceramics
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• v.2 no.4
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• pp.188-192
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• 1996

Diamond based electronic devices promise to exhibit unique properties. In order to realize devices diamond has to be doped to render it electrically conductive. In the present work the doping of diamond and of polycrystalline CVD diamond films are reviewd with particular emphasis to ion-implantation doping and to attempts to dope diamond by in-diffusion of the dopants. The quest for finding ways to obtain n-type conductivity in diamond will be critically examined.