• Journal of Electrical Engineering and Technology
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• v.8 no.2
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• pp.364-370
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• 2013

In the current paper, we propose a new modeling algorithm to analyze the coupling between an incident electromagnetic field (EMF) and a twisted conducting line, which is a kind of non-uniform line. Typically, analysis of external field coupling to a uniform transmission line (TL) is implemented by the Baum-Liu-Tesche (BLT) equation so that the induced load responses can be obtained. However, it is difficult to apply this method to the analysis of a twisted conducting line. To overcome this limitation, we used a chain matrix composed of ABCD parameters. The proposed algorithm expands the dimension of the previous chain matrix to consider the EMF coupling effectiveness of each twisted pair, which is then applied to multi-conductor transmission line (MTL) theory. In addition, we included a comparative study that involves the results of each method applied in the conventional BLT equation and new proposed algorithm in the uniform two-wire TL case to verify the proposed method.

• The Transactions of the Korean Institute of Power Electronics
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• v.8 no.6
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• pp.488-495
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• 2003

In recent years, the multilevel inverter synthesizing the output voltage with step pulse has been widely used rather than PWM method as a solution for high power and high voltage applications. This method takes advantage of lower switching losses due to one switching for one period. This paper proposes a simple method to obtain the conducting angle. This method is implemented by using voltage-second areas of the divided reference voltage according to the output voltage levels. It Is possible to reduce an amount of calculation because it is not required to solve the simultaneous equations by an iterative method. Also, the proposed method can get the conducting angle by means of on-line.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.3
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• pp.177-180
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• 2020

This paper focuses on the 1,200-V level reverse conducting-insulated gate bipolar transistor (RC-IGBT). The structure of the RC-IGBT has an n+ collector at the collector terminal. The breakdown voltage, V_th, V_ce-sat, and turn-off time, and the electrical characteristics of a field-stop IGBT (FS-IGBT) and RC-IGBT are compared and analyzed using simulations. Based on the results, the RC-IGBT obtained a turn-off time of 320.6 ㎲ and a breakdown voltage of 1,720 V, while the FS-IGBT obtained a turn-off time of 742.2 ㎲ and a breakdown voltage of 1,440 V. Therefore, RC-IGBTs have faster on/off transitions and a higher breakdown voltage, which can reduce the size of the element.

• Elastomers and Composites
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• v.35 no.3
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• pp.188-195
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• 2000

The conducting composites were prepared by emulsion polymerization with poly (acrylonitrile-co-butadiene) (NBR) as a matrix and polypyrrole (PPY) as a conducting polymer. Among several surfactants, the electrical conductivity of the composite which was polymerized by dodecyl sodium sulfate (DSS) was the best. The film of composite was prepared by compression molding. The electrical conductivity was measured by 4 probes method as a function of PPY and temperature. When the content of PPY was 25 wt%, the electrical conductivity of composite was increased up to 1.17 S/cm. The percolation threshold showed at the vicinity of 15 wt% PPY content.

• Korean Chemical Engineering Research
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• v.57 no.5
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• pp.596-605
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• 2019

Proton-conducting perovskite ceramic materials are highly promising for solid electrolytes as well as catalysts at high temperatures. Therefore, they possess an outstanding potential for the membrane reactor in which both reaction and separation occur at a same time. Especially, in the case of hydrogen production catalyst, hydrogen separation, and the membrane reactor coupled with catalyst and separation, extensive results have been reported on the effect of the dopant in the solid electrolytes, temperature, and composition of reactants on the performance. In this review, the recent research trend on the application of proton-conducting ceramic materials to hydrogen production catalyst, hydrogen separation, and membrane reactor is surveyed. Moreover, the potential application and prospect of these materials to the next-generation hydrogen production and separation is discussed.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.7 s.98
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• pp.720-731
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• 2005

In this paper, radiation patterns of electrically small inverted-F antennas(IFAs) on an electrically large cylindrical conducting body like a satellite launcher are experimentally studied. First, radiation patterns are obtained by using method of moment and a commercial software tool, HFSS(High Frequency Structure Simulator) and the results are compared and analyzed with experimental ones. Especially, when the size of a cylindrical conducting body is electrically large, the effects of the size of a cylindrical conducting body on radiation patterns are studied by considering only the partial ground in vicinity of antennas. And then, when one and two inverted-F antennas are on the cylindrical conducting body, radiation patterns are simulated and investigated by using method of moment and HFSS. Good agreements are observed among the results by method of moment, HFSS, and experiments.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.1
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• pp.83-90
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• 2009

In this paper, the problem of electromagnetic transmission through slits in two parallel conducting plates which separate two half spaces is considered. The coupled integral equations for the electric field distributions over the slits are developed for the case that the TM polarized plane wave is incident on the slit and solved by the method of moments. The transmitted power beyond the slit-perforated conducting parallel plates is computed in order to check the variations of the coupled power through slits against some parameters such as the incident angle of the TM polarized wave, slit width, lateral distance between two slits, and distance between the conducting plates. When the lateral distance between two slits approaches near the multiples of half wavelengths, the transmission resonance (maximum power transmission) is observed. If the slit width in the incident side is narrow and the distance between conducting plates is small compared to the wavelength, the maximum of transmitted power is observed to be nearly independent of the incident angle and slit width. In addition, the mechanism of the transmission resonance in the present geometry is explained using a simplified geometry and its equivalent circuit.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Korean Journal of Food Science and Technology
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• v.31 no.2
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• pp.314-321
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• 1999

This study was performed to test application possibility of electronic nose with 32 conducting polymer sensor arrays for aroma analysis of persimmon vinegar. The 20, 30, 40, 50, 60, and $70^{\circ}Bx$ persimmon vinegar concentrates were prepared by vacuum concentration at $55^{\circ}C$. The recovery yield of water soluble solid to concentrates was 55.5% on $20^{\circ}Bx$ persimmon vinegar concentrate. As the concentration of persimmon vinegar concentrates increased, pH of concentrates increased and acidity as acetic acid decreased. From sensory evaluation for persimmon vinegar concentrates, as the concentration of persimmon vinegar concentrates increased, their cooking odor and umami taste increased, sour taste and acidic odor decreased, salty odor and astringency were not changed. Aroma analysis by electronic nose (AromaScan) showed no difference in normalized pattern and odor intensity among persimmon vinegar concentrates. All quality factors among concentrates also were less than 1.042. And so the electronic nose with conducting polymer sensor was not suitable for aroma analysis of persimmon vinegar concentrate.