• Journal of the Korean Society for Heat Treatment
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• v.35 no.3
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• pp.150-158
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• 2022

The effects of scandium addition on the Al-6Si-2Cu Alloy were investigated. The Al-6Si-2Cu-Sc alloy was prepared by gravity die casting process. In this study, scandium was added at 0.2 wt%, 0.4 wt%, 0.8 wt%, and 1.0 wt%. The microstructure of Al-6Si-2Cu-Sc alloy was investigated using Optical Microscope, Field Emission Scanning Electron Microscope, Electron Back Scatter Diffraction, and Transmission Electron microscope. The microstructure of Al-6Si-2Cu alloy with scandium added changed from dendrite structure to equiaxed crystal structure in specimens of 0.4 wt% Sc or more, and coarse needle-shape eutectic Si and β-Al₅FeSi phases were segmented and refined. The nanosized Al₃Sc intermetallic compound was observed to be uniformly distributed in the modified Al matrix.

• Journal of Korea Foundry Society
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• v.33 no.3
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• pp.103-112
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• 2013

Effect of Fe and Mn contents on the tensile properties of Al-4 wt%Mg-0.9 wt%Si alloy system has been studied. Common phases of Al-4 wt%Mg-0.9 wt%Si alloy system were ${\alpha}$-Al, $Mg_2Si$, ${\alpha}-Al_{12}(Fe,Mn)_3Si$ and ${\beta}-Al_5FeSi$. As Fe content of Al-4 wt%Mg-0.9 wt%Si alloy system increased from 0.15 wt% to above 0.3 wt%, ${\beta}-Al_5FeSi$ compound appeared. When Mn content of the alloy increased from 0.3 wt% to 0.5 wt%, morphology of plate shaped ${\beta}-Al_5FeSi$ compound changed to chinese script ${\alpha}-Al_{12}(Fe,Mn)_3Si$. As Fe content of Al-4 wt%Mg-0.9 wt%Si-0.3 wt%Mn alloy increased from 0.15 wt% to 0.4 wt%, tensile strength of the as-cast alloy decreased from 191 MPa to 183 MPa and, elongation of the alloy also decreased from 8.0% to 6.2%. Decrease of these properties can be explained as the formation of plate shape, ${\beta}-Al_5FeSi$ phase with low Mn/Fe ratio of the alloy. However, when Mn content of Al-4 wt%Mg-0.9 wt%Si-0.3 wt%Fe alloy increased from 0.3 wt% to 0.5 wt%, tensile strength of as-cast alloy increased from 181 MPa to 194 MPa and, elongation of the alloy increased from 6.8% to 7.0%. These improvements attribute to the morphology change from ${\beta}-Al_5FeSi$ phase to chinese script, ${\alpha}-Al_{15}(Fe,Mn)_3Si_2$ phase shape-modified from with high Mn/Fe ratio of the alloy.

• Journal of Korea Foundry Society
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• v.36 no.6
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• pp.202-207
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• 2016

The effects of Fe and Si additions on the microstructures and mechanical properties of aluminum bronze have been investigated. In a bar-type specimen cast in a die mold, the addition of Fe promoted the dendritic solidification of the ${\alpha}$ phase. The hardness values increased slightly in the Fe-added specimen with heat treatment, while these values was increased significantly in the specimens with Si or with combined additions of Fe and Si. When a centrifugal casting bush with combined addition of Fe and Si was heat treated, the FeSi compound within the matrix was finely dispersed, and was observed to be the origin of cup-cone type conical dimple failure in the tensile fracture surface. The mechanical properties of the heat treated centrifugal casting bushes, whose nominal alloy compositions were (Cu-7.0Al-0.8Fe-3.0Si)wt%, exhibited tensile strength of $703-781N/mm^2$, elongation of 6.6-11.7% and hardness of Hv 222.6-249.2. These high values of strength and elongation were attributed to the strengthening of the matrix due to the combined addition of Fe and Si, and to precipitation of fine the FeSi compound.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Design & Manufacturing
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• v.18 no.3
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• pp.9-14
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• 2024

Among the various plastic polymer molding methods, thermoplastic resins are most commonly used for mass production due to their suitability for high-volume manufacturing. However, recently, thermosetting resins have been utilized depending on product design and functionality, necessitating appropriate mold design and injection conditions to achieve suitable molded products. Therefore, resin selection must be considered not only in terms of product design but also based on functionality, taking into account the physical and mechanical properties of the resin. Additionally, since the flow characteristics of the resin are critical in injection molding, molding conditions should be set according to the thermal, physical, and rheological properties of the resin.This study focuses on the effects of filler content (glass fiber) in thermosetting fiber-reinforced plastics (FRP), specifically Bulk Molding Compound (BMC) resin, which is crucial for thermal deformation in automotive motor housing products. The resins used in this study include Generic BMC1 resin, BMC1 with 15% glass fiber, and BMC1 with 30% glass fiber. The research employs CAE (Computer-Aided Engineering) to investigate strain under basic conditions for the BMC resin and the strain variations with the addition of glass fiber. It also examines the impact of filler content on injection molding conditions, specifically mold temperature and curing time. Experimental results indicate that mold temperature has the most significant effect among the injection conditions, while the impact of curing time was relatively minor.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.163-169
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• 2019

Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

• Elastomers and Composites
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• v.47 no.3
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• pp.231-237
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• 2012

This study measured the mechanical and damping properties of EPDM compounds including fillers. Semi-reinforcing furnace black (SRF), high abrasion furnace black (HAF) and acetylene black were used as fillers. Dicumyl peroxide (DCP) were used as curing agents. The measurements were conducted using a moving die rheometer (MDR), durometer, universal testing machine (UTM), compression set and dynamic mechanical analysis (DMA). The tensile strength and elongation at break increased with increasing SRF contents in EPDM compounds. However, they decreased with increasing the amount of acetylene black. In the inspecting temperature range, EPDM compound filled acetylene black had stable storage modulus. Furthermore, the tan ${\delta}$ of the EPDM compounds obtained was enhanced by compounding with acetylene black.

• Journal of IKEEE
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• v.26 no.4
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• pp.537-544
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• 2022

This paper analyzes the occurrence and cause of bond wires fusing used in the manufacture of pulsed high power amplifiers. Recently GaN HEMT has been spotlight in the fields of electronic warfare, radar, base station and satellite communication. In order to produce the maximum output power, which is the main performance of the high-power amplifier, optimal impedance matching is required. And the material, diameter and number of bond wires must be determined in consideration of not only the rated current but also the heat generated by the transient current. In particular, it was confirmed that compound semiconductor with a wide energy band gap such as GaN trigger fusing of the bond wire due to an increase in thermal resistance when the design efficiency is low or the heat dissipation is insufficient. This data has been simulated for exothermic conditions, and it is expected to be used as a reference for applications using GaN devices as verified through IR microscope.

• Journal of the Korean Applied Science and Technology
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• v.35 no.1
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• pp.173-185
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• 2018

Effects of three different types of dispersions and flow improving additives composed with fatty acid esters, fatty acid metal salts and amide compound on the vulcanization and the mechanical properties properties of rubber compounds of EPDM and carbon black as fillers. were investigated using Mooney viscometer, moving die rheometer, hardness tester, and universal test machine. The aging characteristics of vulcanized EPDM compounds were also investigated. The Mooney viscosity measured at $125^{\circ}C$ showed a tendency to decrease in the order of amide type> metal salt type > ester type additive. Scorch time showed little or no difference with the addition of ester or metal salt type additives, but the amide type additive shortened a scorch time more than one minute. Rheological measurement data obtained at $160^{\circ}C$ showed that the vulcanization time was faster for metal salt type and amide type additive systems. Delta torque values of EPDM compound increased with metal salt type and amide type additives, but slightly decreased with ester type additive. The tensile strength of the EPDM compound was greatly improved when an ester type additive was added, but the amide type or metal salt type additive had no significant effect. The elongation was significantly improved for metal salt type additive, while the rest were not significantly affected. The tear strength of the EPDM compounds increased with the addition of all kinds of additives, and it increased remarkably in the case of metal salt type additive. Hardness of the EPDM compounds was nearly same value regardless of additive types. The thermal aging of the EPDM blend at $100^{\circ}C$ for 24 h showed little change in the case of metal salt type or amide type additive, but the elongation tends to decrease by 10-20% for all EPDM compounds containing additives.