• Proceedings of the Korea Information Processing Society Conference
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• 2009.04a
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• pp.846-848
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• 2009

The interest in the access and integration of distributed massive data resources has increased recently. This paper presents the Advanced Collection Manager(CM) service with OGSA-DAI component which can access and integrate the distributed data resources. The Advanced CM service supports the data resource of various types. And it can provide the query, updating, transforming and delivering data via cooperating with other services in Grid Information Retrieval(Grid-IR or GIR) System. As a result, it can access and manage the data resource more flexible and efficient.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.1
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• pp.762-768
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• 2015

This study examined the integration value of a low level pilotis space, a component that has been often selected as an essential planning element of the recent high-rise apartment complex, and compared the main outdoor unit spaces with that of an average integration value of the individual complexes. Furthermore, this study provided the preliminary data for the next level of research, which is the observation of the pilotis space usage behaviors and the frequency of utilization. The results of this present research are as follows. First, from the main outdoor unit spaces of the high-rise apartment complexes including the pilotis space, a 'complex entrance' or a 'plaza' space showed the highest integration value. Second, the spatial integration value of a pilotis space in a high-rise apartment complex was generally lower that of the integration value of other main outdoor units. Third, from the pilotis spaces of the high-rise apartment complex, those with a 'projecting entry access + pilotis addition type' that did not provide an access to the individual units, had the lowest space utilization rate by the inhabitants; thus, had a high likelihood of the spaces becoming used for illegitimate activities or becoming vacant.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1989.04a
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• pp.22-27
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• 1989

This paper presents a study of soil-structure interaction problems using infinite elements. The infinite elements are formulated for homogeneous and layered soil media, based on approximate expressions for three components of propagating waves, namely Rayleigh, compressive and shear waves. The integration scheme which was proposed for problems with single wave component by Zienkiewicz is expanded to the multi-wave problem. Verifications are carried out on rigid circular footings which are placed on and embedded in elastic half space. Numerical analysis is performed for a containment structure of a nuclear power plant subjected seismic excitation.

• Journal of IKEEE
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• v.12 no.4
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• pp.217-224
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• 2008

This paper provides a framework for semantic correspondence of heterogeneous databases using self- organizing map. It solves the problem of overlapping between different databases due to their different schemas. Clustering technique using self-organizing maps (SOM) is tested and evaluated to assess its performance when using different kinds of data. Preprocessing of database is performed prior to clustering using edit distance algorithm, principal component analysis (PCA), and normalization function to identify the features necessary for clustering.

• Journal of Aerospace System Engineering
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• v.6 no.4
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• pp.18-23
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• 2012

The fuel boost pump for the aircraft was first indigenously developed in Korea. It is one of the core component for fuel subsystem and composed of motor assembly, impeller assembly, and body assembly with BLDC motor. It shall provide some amount of fuel to engine system continuously for any flight condition considering sudden altitude change and any attitude. This paper describes the procedures and the results for the design, the integration, and the performance analysis of the fuel boost pump.

• Proceedings of the Korea Society for Simulation Conference
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• 2001.10a
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• pp.349-353
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• 2001

There are many excellent characters of Java-based simulation compared with existing ones in the respect of running on the Internet/Web, reuse, integration and etc.. In this paper, the main idea of design and realization of Java-based modeling and simulation software for DEVS will be discussed in detail.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.49-52
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.333-335
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• 2006

In this page, we developed the inspection system for automobile parts using the laser vision sensor. Laser vision sensor has gotten 2 dimensions information and third dimension information of laser vision camera using the vision camera. Used JIG and ROBOT for inspection position transfer. Also, computer integration system developed that control system component pal1s and manage data measurement information. Compare sensor measurement result with CAD Data and verified measurement result effectiveness taking advantage of CAD to get information of measurement object.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.1-7
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• 2001

This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.